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1. 发明授权

US08496486B2 Transceiver assembly 有权
标题翻译：收发器组件
公开(公告)号：US08496486B2
公开(公告)日：2013-07-30
申请号：US13183342
申请日：2011-07-14
申请人： David Stanley Szczesny , Michael Eugene Shirk , Bruce Allen Champion , Michael Frank Cina , Michael Warren Fogg
发明人： David Stanley Szczesny , Michael Eugene Shirk , Bruce Allen Champion , Michael Frank Cina , Michael Warren Fogg
IPC分类号： H01R12/00
CPC分类号： H01R12/73 , H01R12/724 , H01R13/6585
摘要： A receptacle connector is provided for mating with a pluggable module having a plug and a printed circuit. The receptacle connector includes a housing having a mating receptacle and a slot. The mating receptacle is configured to receive the plug of the pluggable module therein. The slot is configured to receive the printed circuit of the pluggable module therein. A receptacle contact is held by the housing. The receptacle contact includes a receptacle mating segment that extends within the mating receptacle and is configured to engage a mating contact of the plug of the pluggable module. A slot contact is held by the housing. The slot contact includes a slot mating segment that extends within the slot and is configured to engage the printed circuit of the pluggable module.
摘要翻译：提供插座连接器用于与具有插头和印刷电路的可插拔模块配合。插座连接器包括具有配合插座和插槽的壳体。配合插座构造成在其中容纳可插拔模块的插头。插槽被配置为在其中接收可插拔模块的印刷电路。容器触点由壳体保持。插座触点包括在配合插座内延伸的插座配合部分，并且构造成与可插拔模块的插头的配合触头接合。插槽触点由外壳固定。槽接触件包括在槽内延伸并且被构造成接合可插拔模块的印刷电路的槽配合段。

2. 发明申请

US20110256743A1 INTERPOSER CONNECTOR ASSEMBLY 有权
标题翻译：插座连接器总成
公开(公告)号：US20110256743A1
公开(公告)日：2011-10-20
申请号：US12763800
申请日：2010-04-20
申请人： Bruce Allen Champion , Steven Jay Millard , Bin Lin
发明人： Bruce Allen Champion , Steven Jay Millard , Bin Lin
IPC分类号： H01R12/00
CPC分类号： H01R13/6474 , H01R12/7076
摘要： An interposer connector assembly includes a substrate, conductive pads, and contacts. The substrate has opposite first and second sides with a conductive via extending through the substrate. The conductive pads are mounted to the first and second sides of the substrate and electrically coupled with each other by the via. The contacts are electrically joined with the conductive pads on the first and second sides of the substrate. The contacts protrude from the substrate to outer ends that are configured to engage conductive members of electronic packages that mate with the first and second sides of the substrate. A differential electrical impedance characteristic of a conductive pathway extending from the outer end of one of the contacts to the outer end of another one of the contacts is at least 65 Ohms.
摘要翻译：插入器连接器组件包括衬底，导电焊盘和触点。衬底具有相对的第一和第二侧面，导电通孔延伸穿过衬底。导电焊盘安装到衬底的第一和第二侧，并通过通孔彼此电耦合。触点与衬底的第一和第二侧上的导电焊盘电连接。触头从基板突出到外端，其被配置为接合与基板的第一和第二侧配合的电子封装的导电构件。从触点之一的外端延伸到另一个触点的外端的导电路径的差分电阻抗特性为至少65欧姆。

3. 发明授权

US08215966B2 Interposer connector assembly 有权
标题翻译：内插器连接器组件
公开(公告)号：US08215966B2
公开(公告)日：2012-07-10
申请号：US12763800
申请日：2010-04-20
申请人： Bruce Allen Champion , Steven Jay Millard , Bin Lin
发明人： Bruce Allen Champion , Steven Jay Millard , Bin Lin
IPC分类号： H01R12/00
CPC分类号： H01R13/6474 , H01R12/7076
摘要： An interposer connector assembly includes a substrate, conductive pads, and contacts. The substrate has opposite first and second sides with a conductive via extending through the substrate. The conductive pads are mounted to the first and second sides of the substrate and electrically coupled with each other by the via. The contacts are electrically joined with the conductive pads on the first and second sides of the substrate. The contacts protrude from the substrate to outer ends that are configured to engage conductive members of electronic packages that mate with the first and second sides of the substrate. A differential electrical impedance characteristic of a conductive pathway extending from the outer end of one of the contacts to the outer end of another one of the contacts is at least 65 Ohms.
摘要翻译：插入器连接器组件包括衬底，导电焊盘和触点。衬底具有相对的第一和第二侧面，导电通孔延伸穿过衬底。导电焊盘安装到衬底的第一和第二侧，并通过通孔彼此电耦合。触点与衬底的第一和第二侧上的导电焊盘电连接。触头从基板突出到外端，其被配置为接合与基板的第一和第二侧配合的电子封装的导电构件。从触点之一的外端延伸到另一个触点的外端的导电路径的差分电阻抗特性为至少65欧姆。

4. 发明申请

US20110230067A1 CONNECTOR SYSTEM HAVING CONTACT OVERLAPPING VIAS 有权
标题翻译：具有联系人重叠VIAS的连接器系统
公开(公告)号：US20110230067A1
公开(公告)日：2011-09-22
申请号：US12728879
申请日：2010-03-22
申请人： Bruce Allen Champion , Steven Jay Millard , Bin Lin
发明人： Bruce Allen Champion , Steven Jay Millard , Bin Lin
IPC分类号： H01R12/02
CPC分类号： H01R12/714 , H01R13/2442 , H05K1/0243 , H05K1/112 , H05K1/141 , H05K2201/10378
摘要： An electronic connector system includes an electronic package and an interposer connector assembly. The electronic package has a body with a conductive member disposed on a mating surface of the body. The conductive member is coupled with a conductive via that extends into the body and is oriented along a center axis. The interposer connector assembly includes a substrate with an elongated conductive pad mounted to the substrate and a contact joined to the conductive pad. The contact engages the conductive member when the electronic package mates with the interposer connector assembly such that the center axis extends through the contact.
摘要翻译：电子连接器系统包括电子封装和插入器连接器组件。电子封装具有设置在主体的配合表面上的导电构件的主体。导电构件与延伸到主体中并沿着中心轴线定向的导电通孔联接。插入器连接器组件包括具有安装到衬底的细长导电垫的衬底和接合到导电垫的触点。当电子封装与插入器连接器组件配合使得中心轴线延伸穿过触点时，触头接合导电构件。

5. 发明授权

US08007287B1 Connector system having contact overlapping vias 有权
标题翻译：具有接触重叠通孔的连接器系统
公开(公告)号：US08007287B1
公开(公告)日：2011-08-30
申请号：US12728879
申请日：2010-03-22
申请人： Bruce Allen Champion , Steven Jay Millard , Bin Lin
发明人： Bruce Allen Champion , Steven Jay Millard , Bin Lin
IPC分类号： H01R12/00
CPC分类号： H01R12/714 , H01R13/2442 , H05K1/0243 , H05K1/112 , H05K1/141 , H05K2201/10378
摘要： An electronic connector system includes an electronic package and an interposer connector assembly. The electronic package has a body with a conductive member disposed on a mating surface of the body. The conductive member is coupled with a conductive via that extends into the body and is oriented along a center axis. The interposer connector assembly includes a substrate with an elongated conductive pad mounted to the substrate and a contact joined to the conductive pad. The contact engages the conductive member when the electronic package mates with the interposer connector assembly such that the center axis extends through the contact.
摘要翻译：电子连接器系统包括电子封装和插入器连接器组件。电子封装具有设置在主体的配合表面上的导电构件的主体。导电构件与延伸到主体中并沿着中心轴线定向的导电通孔联接。插入器连接器组件包括具有安装到衬底的细长导电垫的衬底和接合到导电垫的触点。当电子封装与插入器连接器组件配合使得中心轴线延伸穿过触点时，触头接合导电构件。

6. 发明授权

US08597036B2 Transceiver assembly 有权
标题翻译：收发器组件
公开(公告)号：US08597036B2
公开(公告)日：2013-12-03
申请号：US13183322
申请日：2011-07-14
申请人： Michael Warren Fogg , David Stanley Szczesny , Bruce Allen Champion , Michael Frank Sina
发明人： Michael Warren Fogg , David Stanley Szczesny , Bruce Allen Champion , Michael Frank Sina
IPC分类号： H01R13/648
CPC分类号： H01R12/724 , H01R13/6471 , H01R13/6474 , H01R13/6585
摘要： A receptacle connector includes a housing having a mating interface for mating with a mating connector. Ground contacts are held by the housing. The ground contacts include ground mating segments arranged along the mating interface of the housing for mating with ground terminals of the mating connector. The ground mating segments of the ground contacts include ground mating surfaces configured to engage the ground terminals. The ground mating surfaces of the ground mating segments extending within at least one ground plane. Signal contacts are held by the housing. The signal contacts include signal mating segments arranged along the mating interface of the housing for mating with signal terminals of the mating connector. The signal mating segments of the signal contacts include signal mating surfaces configured to engage the signal terminals. The signal mating surfaces of the signal contacts extend within at least one signal plane that extends parallel to and is spaced apart from the at least one ground plane.
摘要翻译：插座连接器包括具有用于与匹配连接器配合的配合接口的壳体。接地触点由外壳固定。接地触点包括沿着壳体的配合接口布置的接地配合部分，用于与配合连接器的接地端子配合。接地触头的接地配合段包括配置成接合接地端子的接地配合表面。接地配合段的接地配合表面在至少一个接地平面内延伸。信号触点由外壳固定。信号触点包括沿着壳体的配合接口布置的信号配合部分，用于与配合连接器的信号端子配合。信号触头的信号匹配段包括被配置为接合信号端子的信号匹配表面。信号触头的信号配合表面在至少一个信号平面内延伸，该信号平面平行于并且与至少一个接地平面间隔开。

7. 发明申请

US20130090014A1 CIRCUIT BOARD FOR AN ELECTRICAL CONNECTOR 有权
标题翻译：电路连接器电路板
公开(公告)号：US20130090014A1
公开(公告)日：2013-04-11
申请号：US13269008
申请日：2011-10-07
申请人： Bruce Allen Champion
发明人： Bruce Allen Champion
IPC分类号： H01R12/70 , H05K1/11
CPC分类号： H01R13/6469 , H01R24/64 , H05K1/0228 , H05K1/0245 , H05K1/115 , H05K2201/09245
摘要： A circuit board includes a substrate having upper and lower sides, and first and second conductive vias extending between the upper and lower sides. The first and second conductive vias include circular outer profiles. The circuit board also includes a differential pair of conductive traces, which includes a first conductive trace having first upper and lower segments disposed on the upper and lower sides, respectively. The first upper and lower segments are electrically connected together through the first conductive via. The first upper segment is curved around the second conductive via such that the first upper segment follows the circular outer profile of the second conductive via. The differential pair of conductive traces also includes a second conductive trace having second upper and lower segments disposed on the upper and lower sides, respectively. The second upper and lower segments are electrically connected together through the second conductive via. The first upper segment crosses over the second lower segment. The second lower segment is curved around the first conductive via such that the second lower segment follows the circular outer profile of the first conductive via.
摘要翻译：电路板包括具有上侧和下侧的基板以及在上侧和下侧之间延伸的第一和第二导电通孔。第一和第二导电通孔包括圆形外部轮廓。电路板还包括差分导电迹线对，其包括分别设置在上侧和下侧上的第一上部和下部区段的第一导电迹线。第一上段和下段通过第一导电通孔电连接在一起。第一上部段围绕第二导电通孔弯曲，使得第一上部区段遵循第二导电通孔的圆形外部轮廓。差分导电迹线对还包括具有分别设置在上侧和下侧上的第二上段和下段的第二导电迹线。第二上段和下段通过第二导电通孔电连接在一起。第一个上段跨越第二个下段。第二下部段围绕第一导电通孔弯曲，使得第二下部区段遵循第一导电通孔的圆形外部轮廓。

8. 发明申请

US20120015563A1 TRANSCEIVER ASSEMBLY 有权
标题翻译：收发机组装
公开(公告)号：US20120015563A1
公开(公告)日：2012-01-19
申请号：US13183342
申请日：2011-07-14
申请人： David Stanley Szczesny , Michael Eugene Shirk , Bruce Allen Champion , Michael Frank Cina , Michael Warren Fogg
发明人： David Stanley Szczesny , Michael Eugene Shirk , Bruce Allen Champion , Michael Frank Cina , Michael Warren Fogg
IPC分类号： H01R13/10
CPC分类号： H01R12/73 , H01R12/724 , H01R13/6585
摘要： A receptacle connector is provided for mating with a pluggable module having a plug and a printed circuit. The receptacle connector includes a housing having a mating receptacle and a slot. The mating receptacle is configured to receive the plug of the pluggable module therein. The slot is configured to receive the printed circuit of the pluggable module therein. A receptacle contact is held by the housing. The receptacle contact includes a receptacle mating segment that extends within the mating receptacle and is configured to engage a mating contact of the plug of the pluggable module. A slot contact is held by the housing. The slot contact includes a slot mating segment that extends within the slot and is configured to engage the printed circuit of the pluggable module.
摘要翻译：提供插座连接器用于与具有插头和印刷电路的可插拔模块配合。插座连接器包括具有配合插座和插槽的壳体。配合插座构造成在其中容纳可插拔模块的插头。插槽被配置为在其中接收可插拔模块的印刷电路。容器触点由壳体保持。插座触点包括在配合插座内延伸的插座配合部分，并且构造成与可插拔模块的插头的配合触头接合。插槽触点由外壳固定。槽接触件包括在槽内延伸并且被构造成接合可插拔模块的印刷电路的槽配合段。

9. 发明授权

US08610000B2 Circuit board for an electrical connector 有权
标题翻译：电连接器电路板
公开(公告)号：US08610000B2
公开(公告)日：2013-12-17
申请号：US13269008
申请日：2011-10-07
申请人： Bruce Allen Champion
发明人： Bruce Allen Champion
IPC分类号： H05K7/06
CPC分类号： H01R13/6469 , H01R24/64 , H05K1/0228 , H05K1/0245 , H05K1/115 , H05K2201/09245
摘要： A circuit board includes a substrate having upper and lower sides, and first and second conductive vias extending between the upper and lower sides. The first and second conductive vias include circular outer profiles. The circuit board also includes a differential pair of conductive traces, which includes a first conductive trace having first upper and lower segments disposed on the upper and lower sides, respectively. The first upper and lower segments are electrically connected together through the first conductive via. The first upper segment is curved around the second conductive via such that the first upper segment follows the circular outer profile of the second conductive via. The differential pair of conductive traces also includes a second conductive trace having second upper and lower segments disposed on the upper and lower sides, respectively. The second upper and lower segments are electrically connected together through the second conductive via. The first upper segment crosses over the second lower segment. The second lower segment is curved around the first conductive via such that the second lower segment follows the circular outer profile of the first conductive via.
摘要翻译：电路板包括具有上侧和下侧的基板以及在上侧和下侧之间延伸的第一和第二导电通孔。第一和第二导电通孔包括圆形外部轮廓。电路板还包括差分导电迹线对，其包括分别设置在上侧和下侧上的第一上部和下部区段的第一导电迹线。第一上段和下段通过第一导电通孔电连接在一起。第一上部段围绕第二导电通孔弯曲，使得第一上部区段遵循第二导电通孔的圆形外部轮廓。差分导电迹线对还包括具有分别设置在上侧和下侧上的第二上段和下段的第二导电迹线。第二上段和下段通过第二导电通孔电连接在一起。第一个上段跨越第二个下段。第二下部段围绕第一导电通孔弯曲，使得第二下部区段遵循第一导电通孔的圆形外部轮廓。

10. 发明申请

US20120015533A1 TRANSCEIVER ASSEMBLY 有权
标题翻译：收发机组装
公开(公告)号：US20120015533A1
公开(公告)日：2012-01-19
申请号：US13183322
申请日：2011-07-14
申请人： Michael Warren Fogg , David Stanley Szczesny , Bruce Allen Champion , Michael Frank Cina
发明人： Michael Warren Fogg , David Stanley Szczesny , Bruce Allen Champion , Michael Frank Cina
IPC分类号： H01R13/648
CPC分类号： H01R12/724 , H01R13/6471 , H01R13/6474 , H01R13/6585
摘要： A receptacle connector includes a housing having a mating interface for mating with a mating connector. Ground contacts are held by the housing. The ground contacts include ground mating segments arranged along the mating interface of the housing for mating with ground terminals of the mating connector. The ground mating segments of the ground contacts include ground mating surfaces configured to engage the ground terminals. The ground mating surfaces of the ground mating segments extending within at least one ground plane. Signal contacts are held by the housing. The signal contacts include signal mating segments arranged along the mating interface of the housing for mating with signal terminals of the mating connector. The signal mating segments of the signal contacts include signal mating surfaces configured to engage the signal terminals. The signal mating surfaces of the signal contacts extend within at least one signal plane that extends parallel to and is spaced apart from the at least one ground plane.
摘要翻译：插座连接器包括具有用于与匹配连接器配合的配合接口的壳体。接地触点由外壳固定。接地触点包括沿着壳体的配合接口布置的接地配合部分，用于与配合连接器的接地端子配合。接地触头的接地配合段包括配置成接合接地端子的接地配合表面。接地配合段的接地配合表面在至少一个接地平面内延伸。信号触点由外壳固定。信号触点包括沿着壳体的配合接口布置的信号配合部分，用于与配合连接器的信号端子配合。信号触头的信号匹配段包括被配置为接合信号端子的信号匹配表面。信号触头的信号配合表面在至少一个信号平面内延伸，该信号平面平行于并且与至少一个接地平面间隔开。

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