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1. 发明申请

US20060018585A1 Ultra-thin polarization mode converters based on liquid crystal materials 失效
标题翻译：基于液晶材料的超薄偏振模式转换器
公开(公告)号：US20060018585A1
公开(公告)日：2006-01-26
申请号：US11189543
申请日：2005-07-26
申请人： Nagesh Vodrahalli , Achintya Bhowmik , Connie Liu , Takaharu Fujiyama , Kenji Takahashi , Biswajit Sur
发明人： Nagesh Vodrahalli , Achintya Bhowmik , Connie Liu , Takaharu Fujiyama , Kenji Takahashi , Biswajit Sur
IPC分类号： G02B6/00
CPC分类号： G02B6/12011 , G02B6/12023 , G02B6/122 , G02B6/126
摘要： A method and apparatus that includes a first waveguide segment that differentially changes the amplitude of the light relative to a first polarization orientation, a thickness of oriented liquid crystal or other birefringent material sufficient to delay one polarization component one-half wavelength relative to another, and a second waveguide segment that also differentially changes the amplitude of the light based on the polarization orientation. Also, an apparatus that includes a thin polarization converter that includes a thin first substrate that is substantially transparent to a wavelength of light, and a birefringent material deposited on one or more surfaces of the first substrate and oriented such that the polarization converter forms a half-wavelength birefringent plate for the light. Also, an apparatus having a first substrate surface, a second substrate surface, and a liquid crystal material between the first and second substrate surfaces to form a polarization converter.
摘要翻译：一种方法和装置，包括：第一波导段，其相对于第一偏振取向差异地改变光的幅度;取向液晶或其它双折射材料的厚度足以将一个偏振分量相对于另一个延迟一半波长;以及还基于极化取向差分地改变光的振幅的第二波导段。此外，一种包括薄偏振转换器的装置，其包括对于波长基本上是透明的薄的第一衬底，以及沉积在第一衬底的一个或多个表面上的双折射材料，并且使得偏振转换器形成一半 - 波长双折射板。另外，在第一和第二基板表面之间具有第一基板表面，第二基板表面和液晶材料的装置，以形成偏振转换器。

2. 发明授权

US07242088B2 IC package pressure release apparatus and method 有权
标题翻译： IC封装压力释放装置及方法
公开(公告)号：US07242088B2
公开(公告)日：2007-07-10
申请号：US09751214
申请日：2000-12-29
申请人： Sudipto Neogi , Biswajit Sur , Boon Seng Tan , Chris Rumer
发明人： Sudipto Neogi , Biswajit Sur , Boon Seng Tan , Chris Rumer
IPC分类号： H01L23/12
CPC分类号： H01L23/10 , H01L21/50 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/01068 , H01L2924/12044 , H01L2924/15311 , H01L2924/16152 , H01L2924/00 , H01L2224/0401
摘要： An apparatus and method for releasing pressure existing within a package comprising a substrate to which a die is attached to provide electrical connections between the die and the exterior of the package, a lid, and sealant disposed between the substrate and the lid in a pattern with at least one break in the pattern.
摘要翻译：用于释放存在于包装内的压力的装置和方法，包括附着有模具的基板，以提供模具与包装外部之间的电连接，盖子和密封剂，其以基板和盖子的图案形式设置在基板和盖子之间，至少有一个休息模式。

3. 发明授权

US07065273B2 Wideband arrayed waveguide grating 有权
标题翻译：宽带阵列波导光栅
公开(公告)号：US07065273B2
公开(公告)日：2006-06-20
申请号：US10601151
申请日：2003-06-20
申请人： Achintya K. Bhowmik , Biswajit Sur
发明人： Achintya K. Bhowmik , Biswajit Sur
IPC分类号： G02B6/34
CPC分类号： G02B6/12016
摘要： A flat-top arrayed waveguide grating with wideband transmission spectrum may be produced by integrating a series of directional couplers to the output slab waveguide coupler of a dual channel-spacing arrayed waveguide grating having Gaussian spectral profile. The primary channel spacing of the Gaussian arrayed waveguide grating determines the spectral width of the resultant wideband device, whereas the secondary channel spacing determines the wavelength separation between the adjacent output channels. In such a structure, a wideband or flat transmission spectral profile may be achieved without excessive losses.
摘要翻译：具有宽带透射光谱的平顶阵列波导光栅可以通过将一系列定向耦合器集成到具有高斯光谱分布的双通道间隔阵列波导光栅的输出平板波导耦合器来产生。高斯阵列波导光栅的主通道间隔决定了所得宽带器件的光谱宽度，而辅助信道间隔确定了相邻输出通道之间的波长间隔。在这种结构中，可以实现宽带或平坦的传输光谱轮廓而没有过多的损耗。

4. 发明授权

US09176550B2 Thermally downward scalable system 有权
标题翻译：热向下伸缩系统
公开(公告)号：US09176550B2
公开(公告)日：2015-11-03
申请号：US12977848
申请日：2010-12-23
申请人： Biswajit Sur , Eric Distefano , James G. Hermerding, II , Eugene P. Matter , John P. Wallace , Guy M. Therien
发明人： Biswajit Sur , Eric Distefano , James G. Hermerding, II , Eugene P. Matter , John P. Wallace , Guy M. Therien
IPC分类号： G06F1/32 , G06F1/20 , G06F1/26
CPC分类号： G06F1/206 , G06F1/26 , G06F1/3206 , G06F1/324 , G06F1/3296 , Y02D10/126 , Y02D10/16 , Y02D10/172 , Y02D50/20
摘要： An apparatus may comprise a power management system. Other embodiments are described and claimed.
摘要翻译：设备可以包括电源管理系统。描述和要求保护其他实施例。

5. 发明申请

US20120166842A1 THERMALLY DOWNWARD SCALABLE SYSTEM 有权
标题翻译：热门下拉式系统
公开(公告)号：US20120166842A1
公开(公告)日：2012-06-28
申请号：US12977848
申请日：2010-12-23
申请人： Biswajit Sur , Eric Distefano , James G. Hermerding, II , Eugene P. Matter , John P. Wallace , Guy M. Therien
发明人： Biswajit Sur , Eric Distefano , James G. Hermerding, II , Eugene P. Matter , John P. Wallace , Guy M. Therien
IPC分类号： G06F1/32
CPC分类号： G06F1/206 , G06F1/26 , G06F1/3206 , G06F1/324 , G06F1/3296 , Y02D10/126 , Y02D10/16 , Y02D10/172 , Y02D50/20
摘要： An apparatus may comprise a power management system. Other embodiments are described and claimed.
摘要翻译：设备可以包括电源管理系统。描述和要求保护其他实施例。

6. 发明授权

US07132313B2 Diamond heat spreading and cooling technique for integrated circuits 有权
公开(公告)号：US07132313B2
公开(公告)日：2006-11-07
申请号：US10721722
申请日：2003-11-25
申请人： Michael O'Connor , Kevin J. Haley , Biswajit Sur
发明人： Michael O'Connor , Kevin J. Haley , Biswajit Sur
IPC分类号： H01L21/50 , H01L21/00
CPC分类号： H01L23/3735 , H01L23/3732 , H01L2224/16 , H01L2224/73253 , H01L2924/00014 , H01L2924/01046 , H01L2924/01055 , H01L2924/10253 , Y10S257/93 , H01L2924/00 , H01L2224/0401
摘要： A semiconductor chip is shown containing an integral heat spreading layer that more effectively transmits heat from the die to ambient as a result of spreading the heat out on the die over a larger cross sectional area. Local hot spots are minimized which allows the semiconductor chip to operate at a higher frequency for a given upper threshold temperature. Also shown is a method of manufacturing such a semiconductor chip, and the associated method of cooling a semiconductor chip.

7. 发明授权

US07091063B2 Electronic assembly comprising solderable thermal interface and methods of manufacture 失效
标题翻译：电子组件，其包括可焊接热界面和制造方法
公开(公告)号：US07091063B2
公开(公告)日：2006-08-15
申请号：US10775890
申请日：2004-02-09
申请人： Biswajit Sur , Nagesh Vodrahalli , Thomas Workman
发明人： Biswajit Sur , Nagesh Vodrahalli , Thomas Workman
IPC分类号： H01L21/44
CPC分类号： H01L24/31 , H01L23/42 , H01L23/433 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/16152 , H01L2924/16251 , H01L2924/351 , H01L2924/00 , H01L2224/0401
摘要： To accommodate high power densities associated with high performance integrated circuits, heat is dissipated from a surface of a die through a solderable thermal interface to a lid or integrated heat spreader. In one embodiment, the die is mounted on an organic substrate using a C4 and land grid array arrangement. In order to maximize thermal dissipation from the die while minimizing warpage of the package when subjected to heat, due to the difference in thermal coefficients of expansion between the die and the organic substrate, a thermal interface is used that has a relatively low melting point in addition to a relatively high thermal conductivity. Methods of fabrication, as well as application of the package to an electronic assembly, an electronic system, and a data processing system, are also described.
摘要翻译：为了适应与高性能集成电路相关的高功率密度，热量从模具的表面通过可焊接的热界面消散到盖子或集成散热器。在一个实施例中，使用C4和平台栅格阵列布置将管芯安装在有机衬底上。为了最大限度地从模具散热，同时使封装受热时的翘曲最小化，由于管芯和有机基板之间的热膨胀系数的差异，使用热界面，其熔点相对较低除了相对较高的导热性。还描述了制造方法以及将包装应用于电子组件，电子系统和数据处理系统。

8. 发明授权

US06982192B1 High performance thermal interface curing process for organic flip chip packages 失效
标题翻译：有机倒装芯片封装的高性能热界面固化工艺
公开(公告)号：US06982192B1
公开(公告)日：2006-01-03
申请号：US09475104
申请日：1999-12-30
申请人： Nagesh Vodrahalli , Biswajit Sur
发明人： Nagesh Vodrahalli , Biswajit Sur
IPC分类号： H01C21/44 , H05B6/64 , H05B6/70 , H05B6/50 , H01L23/495 , H01L23/10
CPC分类号： H01L23/3737 , H01L21/4803 , H01L21/563 , H01L23/3128 , H01L23/4334 , H01L24/29 , H01L24/83 , H01L2224/16225 , H01L2224/2919 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2224/8322 , H01L2224/838 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/15311 , H01L2924/3011 , H05B6/80 , H01L2924/00 , H01L2224/0401
摘要： An integrated circuit package which has a thermal epoxy that can be attached to an integrated circuit and a thermal element. The thermal epoxy can be cured with energy at a microwave frequency. Curing the thermal epoxy with microwave energy can minimize package warpage during the curing process.
摘要翻译：一种集成电路封装，其具有可附接到集成电路和热元件的热环氧树脂。热环氧树脂可以用微波频率的能量固化。用微波能量固化热环氧树脂可以减少固化过程中的包装翘曲。

9. 发明申请

US20140189404A1 ADAPTIVE THERMAL CONTROL OF ELECTRONIC DEVICES 有权
标题翻译：电子设备的自适应热控制
公开(公告)号：US20140189404A1
公开(公告)日：2014-07-03
申请号：US13730527
申请日：2012-12-28
申请人： Biswajit SUR , Thomas E. Walsh , Ajay G. Gupta , Brian C. Kluge , Kristoffer D. Fleming
发明人： Biswajit SUR , Thomas E. Walsh , Ajay G. Gupta , Brian C. Kluge , Kristoffer D. Fleming
IPC分类号： G06F1/32
CPC分类号： G06F1/3234 , G06F1/206 , G06F1/3209 , G06F21/00 , Y02D10/16
摘要： An apparatus includes logic to control heat generation in a device. The device to operate ate leas in one of a first state and a second state, wherein the device to consume more power in the first state than in the second state. The device to connect to a network at least for a portion of time while in the second state. The logic to select a plurality of thermal control solutions to decrease the generation of heat in the device in the second state, the selected thermal control solution to be performed while the device is in the second state to reduce the generated heat to below a predetermined level.
摘要翻译：一种装置包括控制装置中的发热的逻辑。所述装置在第一状态和第二状态中的任一状态下操作，其中所述设备在所述第一状态下消耗比所述第二状态更多的功率。该设备至少在第二状态下连接到网络的一部分时间。选择多个热控制解决方案以在第二状态下减少设备中的热量产生的逻辑，所选择的热控制解决方案将在设备处于第二状态时执行以将产生的热量减少到低于预定水平。

10. 发明授权

US07220624B2 Windowed package for electronic circuitry 有权
标题翻译：用于电子电路的窗口封装
公开(公告)号：US07220624B2
公开(公告)日：2007-05-22
申请号：US11171588
申请日：2005-06-29
申请人： Sudipto Neogi , Biswajit Sur , Boon Seng Tan , Chris Rumer
发明人： Sudipto Neogi , Biswajit Sur , Boon Seng Tan , Chris Rumer
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L23/10 , H01L21/50 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/01068 , H01L2924/12044 , H01L2924/15311 , H01L2924/16152 , H01L2924/00 , H01L2224/0401
摘要： An apparatus and method for releasing pressure existing within a package comprising a substrate to which a die is attached to provide electrical connections between the die and the exterior of the package, a lid, and sealant disposed between the substrate and the lid in a pattern with at least one break in the pattern.
摘要翻译：用于释放存在于包装内的压力的装置和方法，包括附着有模具的基板，以提供模具与包装外部之间的电连接，盖子和密封剂，其以基板和盖子的图案形式设置在基板和盖子之间，至少有一个休息模式。

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