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1. 发明授权

US07254033B2 Method and apparatus for heat dissipation 有权
标题翻译：散热方法和装置
公开(公告)号：US07254033B2
公开(公告)日：2007-08-07
申请号：US10922396
申请日：2004-08-19
申请人： Behdad Jafari , Inderjit Singh
发明人： Behdad Jafari , Inderjit Singh
IPC分类号： H05K7/20
CPC分类号： H01L23/433 , H01L23/42 , H01L23/4275 , H01L23/467 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01079 , H01L2224/0401
摘要： Embodiments of methods, apparatuses, devices, and/or systems for heat dissipation are disclosed.
摘要翻译：公开了用于散热的方法，装置，装置和/或系统的实施例。

2. 发明授权

US08837161B2 Multi-configuration processor-memory substrate device 有权
标题翻译：多配置处理器 - 内存基板设备
公开(公告)号：US08837161B2
公开(公告)日：2014-09-16
申请号：US10197385
申请日：2002-07-16
申请人： Behdad Jafari , George Sorenson
发明人： Behdad Jafari , George Sorenson
IPC分类号： H05K1/11 , H05K1/14
CPC分类号： H05K1/141 , G06F1/183 , H01L25/18 , H01L2224/16225 , H01L2224/16227 , H01L2224/73253 , H01L2924/15311 , H01L2924/15321 , H05K1/0204 , H05K1/0206 , H05K3/3436 , H05K2201/09954 , H05K2201/10159 , H05K2201/10674 , H05K2203/1572
摘要： A Multi-configuration Processor-Memory device for coupling to a PCB (printed circuit board) interface. The device comprises a substrate that supports multiple configurations of memory components and a processor while having a single, common interface with a PCB interface of a printed circuit board. In a first configuration, the substrate supports a processor and a first number of memory components. In a second configuration, the substrate supports a processor and an additional number of memory components. The memory components can be pre-tested, packaged memory components mounted on the substrate. The processor can be a surface mounted processor die. Additionally, the processor can be mounted in a flip chip configuration, side-opposite the memory components. In the first configuration, a heat spreader can be mounted on the memory components and the processor to dissipate heat. In the second, flip chip, configuration, the processor face can be soldered onto a non-electrically functional area of the PCB interface of the printed circuit board to dissipate heat.
摘要翻译：用于耦合到PCB（印刷电路板）接口的多配置处理器 - 存储器件。该设备包括支持多个配置的存储器组件的基板和处理器，同时具有与印刷电路板的PCB接口的单一公共接口。在第一配置中，衬底支撑处理器和第一数量的存储器组件。在第二配置中，衬底支持处理器和附加数量的存储器组件。存储器组件可以预先测试，安装在基板上的封装存储器组件。处理器可以是表面安装的处理器管芯。此外，处理器可以安装在倒装芯片配置中，与存储器组件相对。在第一配置中，散热器可以安装在存储器组件和处理器上以散热。在第二种情况下，倒装芯片的配置，处理器面可以被焊接到印刷电路板的PCB接口的非电功能区域以散热。

3. 发明申请

US20080266786A1 METHOD AND APPARATUS FOR HEAT DISSIPATION 审中-公开
标题翻译：用于散热的方法和装置
公开(公告)号：US20080266786A1
公开(公告)日：2008-10-30
申请号：US11739859
申请日：2007-04-25
申请人： Behdad Jafari , Inderjit Singh
发明人： Behdad Jafari , Inderjit Singh
IPC分类号： H05K7/20
CPC分类号： H01L23/433 , H01L23/42 , H01L23/467 , H01L24/32 , H01L2224/16225 , H01L2224/73204 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/14 , H01L2924/19041 , H01L2924/00 , H01L2224/0401
摘要： Embodiments of methods, apparatuses, devices, and/or systems for heat dissipation are disclosed.
摘要翻译：公开了用于散热的方法，装置，装置和/或系统的实施例。

4. 发明申请

US20080106861A1 Multi-configuration processor-memory substrate device 有权
公开(公告)号：US20080106861A1
公开(公告)日：2008-05-08
申请号：US12005895
申请日：2007-12-28
申请人： Behdad Jafari , George Sorensen
发明人： Behdad Jafari , George Sorensen
IPC分类号： H05K7/06 , H05K7/20
CPC分类号： H05K1/141 , G06F1/183 , H01L25/18 , H01L2224/16225 , H01L2224/16227 , H01L2224/73253 , H01L2924/15311 , H01L2924/15321 , H05K1/0204 , H05K1/0206 , H05K3/3436 , H05K2201/09954 , H05K2201/10159 , H05K2201/10674 , H05K2203/1572
摘要： A Multi-configuration Processor-Memory device for coupling to a PCB (printed circuit board) interface. The device comprises a substrate that supports multiple configurations of memory components and a processor while having a single, common interface with a PCB interface of a printed circuit board. In a first configuration, the substrate supports a processor and a first number of memory components. In a second configuration, the substrate supports a processor and an additional number of memory components. The memory components can be pre-tested, packaged memory components mounted on the substrate. The processor can be a surface mounted processor die. Additionally, the processor can be mounted in a flip chip configuration, side-opposite the memory components. In the first configuration, a heat spreader can be mounted on the memory components and the processor to dissipate heat. In the second, flip chip, configuration, the processor face can be soldered onto a non-functional area of the PCB interface of the printed circuit board to dissipate heat.

5. 发明授权

US08482120B2 Combined heat sink multi-configuration processor memory substrate device 有权
标题翻译：组合散热器多配置处理器内存基板装置
公开(公告)号：US08482120B2
公开(公告)日：2013-07-09
申请号：US12005818
申请日：2007-12-28
申请人： Behdad Jafari , George Sorensen
发明人： Behdad Jafari , George Sorensen
IPC分类号： H01L23/34
CPC分类号： H05K1/141 , G06F1/183 , H01L25/18 , H01L2224/16225 , H01L2224/16227 , H01L2224/73253 , H01L2924/15311 , H01L2924/15321 , H05K1/0204 , H05K1/0206 , H05K3/3436 , H05K2201/09954 , H05K2201/10159 , H05K2201/10674 , H05K2203/1572
摘要： A Multi-configuration Processor-Memory device for coupling to a PCB (printed circuit board) interface. The device comprises a substrate that supports multiple configurations of memory components and a processor while having a single, common interface with a PCB interface of a printed circuit board. In a first configuration, the substrate supports a processor and a first number of memory components. In a second configuration, the substrate supports a processor and an additional number of memory components. The memory components can be pre-tested, packaged memory components mounted on the substrate. The processor can be a surface mounted processor die. Additionally, the processor can be mounted in a flip chip configuration, side-opposite the memory components. In the first configuration, a heat spreader can be mounted on the memory components and the processor to dissipate heat. In the second, flip chip, configuration, the processor face can be soldered onto a non-functional area of the PCB interface of the printed circuit board to dissipate heat.
摘要翻译：用于耦合到PCB（印刷电路板）接口的多配置处理器 - 存储器件。该设备包括支持多个配置的存储器组件的基板和处理器，同时具有与印刷电路板的PCB接口的单一公共接口。在第一配置中，衬底支撑处理器和第一数量的存储器组件。在第二配置中，衬底支撑处理器和附加数量的存储器组件。存储器组件可以预先测试，安装在基板上的封装存储器组件。处理器可以是表面安装的处理器管芯。此外，处理器可以安装在倒装芯片配置中，与存储器组件相对。在第一配置中，散热器可以安装在存储器组件和处理器上以散热。在第二个倒装芯片的配置中，处理器面可以焊接到印刷电路板的PCB接口的非功能区域以散热。

6. 发明授权

US08198727B1 Integrated circuit/substrate interconnect system and method of manufacture 有权
标题翻译：集成电路/基板互连系统及其制造方法
公开(公告)号：US08198727B1
公开(公告)日：2012-06-12
申请号：US11611818
申请日：2006-12-15
申请人： Inderjit Singh , Ray Chen , Orion K. Starr , Behdad Jafari
发明人： Inderjit Singh , Ray Chen , Orion K. Starr , Behdad Jafari
IPC分类号： H01L23/48
CPC分类号： H01L24/13 , H01L24/81 , H01L2224/131 , H01L2224/13105 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13118 , H01L2224/1312 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/1329 , H01L2224/133 , H01L2224/13624 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2224/81191 , H01L2224/81385 , H01L2224/814 , H01L2224/83192 , H01L2924/00013 , H01L2924/01029 , H01L2924/01322 , H01L2924/14 , H01L2924/00014 , H01L2224/1379 , H01L2924/01032 , H01L2924/01082 , H01L2924/0105 , H01L2924/01047 , H01L2924/014 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： An integrated circuit/substrate interconnect apparatus and method are provided. Included is an integrated circuit including a plurality of bond pads, and a substrate including a plurality of landing pads and a mask. Such mask is spaced from the landing pads for defining areas therebetween. Further provided is a plurality of interconnects connected between the bond pads of the integrated circuit and the landing pads of the substrate. The interconnects include metal projections extending from the bond pads and a solder material for connecting the metal projections and the landing pads of the substrate.
摘要翻译：提供集成电路/基板互连装置和方法。包括包括多个接合焊盘的集成电路，以及包括多个着陆焊盘和掩模的基板。这样的掩模与着陆垫间隔开，以限定它们之间的区域。还提供了连接在集成电路的接合焊盘和衬底的着陆焊盘之间的多个互连。互连包括从接合焊盘延伸的金属突起和用于连接金属突起和衬底的着陆焊盘的焊料材料。

7. 发明授权

US07838999B1 System and method of manufacture for interconnecting an integrated circuit and a substrate 有权
标题翻译：用于互连集成电路和基板的系统和制造方法
公开(公告)号：US07838999B1
公开(公告)日：2010-11-23
申请号：US11733149
申请日：2007-04-09
申请人： Inderjit Singh , Ray Chen , Behdad Jafari
发明人： Inderjit Singh , Ray Chen , Behdad Jafari
IPC分类号： H01L29/40
CPC分类号： H01L23/49811 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/81191 , H01L2224/81801 , H01L2924/00014 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/14 , H01L2924/00 , H01L2224/05099 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An integrated circuit/substrate interconnect apparatus and method of manufacture are provided. Included is a substrate with a plurality of wells and a landing pad formed in each of the wells. The substrate further includes a seed layer deposited in each of the wells over the landing pad, and a metalized layer deposited in each of the wells over the seed layer. Before assembly, an upper surface of the metalized layer forms a well.
摘要翻译：提供集成电路/基板互连装置及其制造方法。包括具有多个孔的基底和在每个孔中形成的着陆垫。衬底还包括沉积在着陆焊盘上的每个阱中的种子层，以及沉积在种子层上的每个阱中的金属化层。在组装之前，金属化层的上表面形成井。

8. 发明申请

US20100103605A1 MULTI-CONFIGURATION PROCESSOR-MEMORY SUBSTRATE DEVICE 审中-公开
标题翻译：多配置处理器存储器基板设备
公开(公告)号：US20100103605A1
公开(公告)日：2010-04-29
申请号：US12650993
申请日：2009-12-31
申请人： Behdad Jafari , George Sorensen
发明人： Behdad Jafari , George Sorensen
IPC分类号： H05K7/00
CPC分类号： H05K1/141 , G06F1/183 , H01L25/18 , H01L2224/16225 , H01L2224/16227 , H01L2224/73253 , H01L2924/15311 , H01L2924/15321 , H05K1/0204 , H05K1/0206 , H05K3/3436 , H05K2201/09954 , H05K2201/10159 , H05K2201/10674 , H05K2203/1572
摘要： A Multi-configuration Processor-Memory device for coupling to a PCB (printed circuit board) interface. The device comprises a substrate that supports multiple configurations of memory components and a processor while having a single, common interface with a PCB interface of a printed circuit board. In a first configuration, the substrate supports a processor and a first number of memory components. In a second configuration, the substrate supports a processor and an additional number of memory components. The memory components can be pre-tested, packaged memory components mounted on the substrate. The processor can be a surface mounted processor die. Additionally, the processor can be mounted in a flip chip configuration, side-opposite the memory components. In the first configuration, a heat spreader can be mounted on the memory components and the processor to dissipate heat. In the second, flip chip, configuration, the processor face can be soldered onto a non-electrically functional area of the PCB interface of the printed circuit board to dissipate heat.
摘要翻译：用于耦合到PCB（印刷电路板）接口的多配置处理器 - 存储器件。该设备包括支持多个配置的存储器组件的基板和处理器，同时具有与印刷电路板的PCB接口的单一公共接口。在第一配置中，衬底支撑处理器和第一数量的存储器组件。在第二配置中，衬底支撑处理器和附加数量的存储器组件。存储器组件可以预先测试，安装在基板上的封装存储器组件。处理器可以是表面安装的处理器管芯。此外，处理器可以安装在倒装芯片配置中，与存储器组件相对。在第一配置中，散热器可以安装在存储器组件和处理器上以散热。在第二种情况下，倒装芯片的配置，处理器面可以被焊接到印刷电路板的PCB接口的非电功能区域以散热。

9. 发明授权

US08264851B2 Multi-configuration processor-memory substrate device 有权
标题翻译：多配置处理器 - 内存基板设备
公开(公告)号：US08264851B2
公开(公告)日：2012-09-11
申请号：US12005895
申请日：2007-12-28
申请人： Behdad Jafari , George Sorensen
发明人： Behdad Jafari , George Sorensen
IPC分类号： H05K1/11 , H05K1/14
CPC分类号： H05K1/141 , G06F1/183 , H01L25/18 , H01L2224/16225 , H01L2224/16227 , H01L2224/73253 , H01L2924/15311 , H01L2924/15321 , H05K1/0204 , H05K1/0206 , H05K3/3436 , H05K2201/09954 , H05K2201/10159 , H05K2201/10674 , H05K2203/1572
摘要： A Multi-configuration Processor-Memory device for coupling to a PCB (printed circuit board) interface. The device comprises a substrate that supports multiple configurations of memory components and a processor while having a single, common interface with a PCB interface of a printed circuit board. In a first configuration, the substrate supports a processor and a first number of memory components. In a second configuration, the substrate supports a processor and an additional number of memory components. The memory components can be pre-tested, packaged memory components mounted on the substrate. The processor can be a surface mounted processor die. Additionally, the processor can be mounted in a flip chip configuration, side-opposite the memory components. In the first configuration, a heat spreader can be mounted on the memory components and the processor to dissipate heat. In the second, flip chip, configuration, the processor face can be soldered onto a non-functional area of the PCB interface of the printed circuit board to dissipate heat.
摘要翻译：用于耦合到PCB（印刷电路板）接口的多配置处理器 - 存储器件。该设备包括支持多个配置的存储器组件的基板和处理器，同时具有与印刷电路板的PCB接口的单一公共接口。在第一配置中，衬底支撑处理器和第一数量的存储器组件。在第二配置中，衬底支持处理器和附加数量的存储器组件。存储器组件可以预先测试，安装在基板上的封装存储器组件。处理器可以是表面安装的处理器管芯。此外，处理器可以安装在倒装芯片配置中，与存储器组件相对。在第一配置中，散热器可以安装在存储器组件和处理器上以散热。在第二个倒装芯片的配置中，处理器面可以被焊接到印刷电路板的PCB接口的非功能区域以散热。

10. 发明申请

US20100103604A1 MULTI-CONFIGURATION PROCESSOR-MEMORY SUBSTRATE DEVICE 审中-公开
公开(公告)号：US20100103604A1
公开(公告)日：2010-04-29
申请号：US12650406
申请日：2009-12-30
申请人： Behdad Jafari , George Sorensen
发明人： Behdad Jafari , George Sorensen
IPC分类号： H05K7/06 , H05K7/20
CPC分类号： H05K1/141 , G06F1/183 , H01L25/18 , H01L2224/16225 , H01L2224/16227 , H01L2224/73253 , H01L2924/15311 , H01L2924/15321 , H05K1/0204 , H05K1/0206 , H05K3/3436 , H05K2201/09954 , H05K2201/10159 , H05K2201/10674 , H05K2203/1572
摘要： A Multi-configuration Processor-Memory device for coupling to a PCB (printed circuit board) interface. The device comprises a substrate that supports multiple configurations of memory components and a processor while having a single, common interface with a PCB interface of a printed circuit board. In a first configuration, the substrate supports a processor and a first number of memory components. In a second configuration, the substrate supports a processor and an additional number of memory components. The memory components can be pre-tested, packaged memory components mounted on the substrate. The processor can be a surface mounted processor die. Additionally, the processor can be mounted in a flip chip configuration, side-opposite the memory components. In the first configuration, a heat spreader can be mounted on the memory components and the processor to dissipate heat. In the second, flip chip, configuration, the processor face can be soldered onto a non-electrically functional area of the PCB interface of the printed circuit board to dissipate heat.

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