专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20070128911A1 DESIGN AND METHOD FOR PLATING PCI EXPRESS (PCIE) EDGE CONNECTOR 有权
标题翻译： PCI EXPRESS（PCIE）边缘连接器的设计和方法
公开(公告)号：US20070128911A1
公开(公告)日：2007-06-07
申请号：US11671909
申请日：2007-02-06
申请人： Bruce Michaud , Peter Ammann , George Sorensen
发明人： Bruce Michaud , Peter Ammann , George Sorensen
IPC分类号： H01R13/15 , H01R13/62
CPC分类号： H05K3/242 , H05K1/117 , H05K3/0052 , H05K2201/094
摘要： Embodiments of methods and apparatus for plating a PCI Express edge connector are described. In one embodiment, a printed circuit board having connectors is employed for electroplating one or more of the connectors formed thereon. The printed circuit board comprises a substrate having one or more layers, and a plurality of connectors formed on one or more of the layers, wherein at least one connector includes at least one short pin and at least one extra pin. The at least one extra pin extends beyond an outer shape of the printed circuit board after fabrication. The printed circuit board also includes connection circuitry formed on one or more of the layers, wherein the connection circuitry is configured to electrically connect the short pin with the extra pin at least during electroplating of said short pin.
摘要翻译：描述了用于电镀PCI Express边缘连接器的方法和装置的实施例。在一个实施例中，使用具有连接器的印刷电路板来电镀其中形成的一个或多个连接器。印刷电路板包括具有一个或多个层的衬底和形成在一个或多个层上的多个连接器，其中至少一个连接器包括至少一个短针和至少一个额外的针。在制造之后，至少一个额外的销延伸超出印刷电路板的外部形状。印刷电路板还包括形成在一个或多个层上的连接电路，其中连接电路被配置为至少在电镀所述短销期间将短销与额外的引脚电连接。

2. 发明申请

US20050241848A1 Design and Method for plating PCI express (PCIE) edge connector 有权
标题翻译： PCI Express（PCIE）边缘连接器的设计和方法
公开(公告)号：US20050241848A1
公开(公告)日：2005-11-03
申请号：US10836576
申请日：2004-04-30
申请人： Bruce Michaud , Peter Ammann , George Sorensen
发明人： Bruce Michaud , Peter Ammann , George Sorensen
IPC分类号： C25D5/02 , H05K1/00 , H05K1/11 , H05K3/00 , H05K3/24
CPC分类号： H05K3/242 , H05K1/117 , H05K3/0052 , H05K2201/094
摘要： Embodiments of methods of plating a PCI Express edge connector are described.
摘要翻译：描述了电镀PCI Express边缘连接器的方法的实施例。

3. 发明授权

US08264851B2 Multi-configuration processor-memory substrate device 有权
标题翻译：多配置处理器 - 内存基板设备
公开(公告)号：US08264851B2
公开(公告)日：2012-09-11
申请号：US12005895
申请日：2007-12-28
申请人： Behdad Jafari , George Sorensen
发明人： Behdad Jafari , George Sorensen
IPC分类号： H05K1/11 , H05K1/14
CPC分类号： H05K1/141 , G06F1/183 , H01L25/18 , H01L2224/16225 , H01L2224/16227 , H01L2224/73253 , H01L2924/15311 , H01L2924/15321 , H05K1/0204 , H05K1/0206 , H05K3/3436 , H05K2201/09954 , H05K2201/10159 , H05K2201/10674 , H05K2203/1572
摘要： A Multi-configuration Processor-Memory device for coupling to a PCB (printed circuit board) interface. The device comprises a substrate that supports multiple configurations of memory components and a processor while having a single, common interface with a PCB interface of a printed circuit board. In a first configuration, the substrate supports a processor and a first number of memory components. In a second configuration, the substrate supports a processor and an additional number of memory components. The memory components can be pre-tested, packaged memory components mounted on the substrate. The processor can be a surface mounted processor die. Additionally, the processor can be mounted in a flip chip configuration, side-opposite the memory components. In the first configuration, a heat spreader can be mounted on the memory components and the processor to dissipate heat. In the second, flip chip, configuration, the processor face can be soldered onto a non-functional area of the PCB interface of the printed circuit board to dissipate heat.
摘要翻译：用于耦合到PCB（印刷电路板）接口的多配置处理器 - 存储器件。该设备包括支持多个配置的存储器组件的基板和处理器，同时具有与印刷电路板的PCB接口的单一公共接口。在第一配置中，衬底支撑处理器和第一数量的存储器组件。在第二配置中，衬底支持处理器和附加数量的存储器组件。存储器组件可以预先测试，安装在基板上的封装存储器组件。处理器可以是表面安装的处理器管芯。此外，处理器可以安装在倒装芯片配置中，与存储器组件相对。在第一配置中，散热器可以安装在存储器组件和处理器上以散热。在第二个倒装芯片的配置中，处理器面可以被焊接到印刷电路板的PCB接口的非功能区域以散热。

4. 发明申请

US20100103604A1 MULTI-CONFIGURATION PROCESSOR-MEMORY SUBSTRATE DEVICE 审中-公开
公开(公告)号：US20100103604A1
公开(公告)日：2010-04-29
申请号：US12650406
申请日：2009-12-30
申请人： Behdad Jafari , George Sorensen
发明人： Behdad Jafari , George Sorensen
IPC分类号： H05K7/06 , H05K7/20
CPC分类号： H05K1/141 , G06F1/183 , H01L25/18 , H01L2224/16225 , H01L2224/16227 , H01L2224/73253 , H01L2924/15311 , H01L2924/15321 , H05K1/0204 , H05K1/0206 , H05K3/3436 , H05K2201/09954 , H05K2201/10159 , H05K2201/10674 , H05K2203/1572
摘要： A Multi-configuration Processor-Memory device for coupling to a PCB (printed circuit board) interface. The device comprises a substrate that supports multiple configurations of memory components and a processor while having a single, common interface with a PCB interface of a printed circuit board. In a first configuration, the substrate supports a processor and a first number of memory components. In a second configuration, the substrate supports a processor and an additional number of memory components. The memory components can be pre-tested, packaged memory components mounted on the substrate. The processor can be a surface mounted processor die. Additionally, the processor can be mounted in a flip chip configuration, side-opposite the memory components. In the first configuration, a heat spreader can be mounted on the memory components and the processor to dissipate heat. In the second, flip chip, configuration, the processor face can be soldered onto a non-electrically functional area of the PCB interface of the printed circuit board to dissipate heat.

5. 发明申请

US20080106860A1 Multi-configuration processor-memory substrate device 有权
标题翻译：多配置处理器 - 内存基板设备
公开(公告)号：US20080106860A1
公开(公告)日：2008-05-08
申请号：US12005818
申请日：2007-12-28
申请人： Behdad Jafari , George Sorensen
发明人： Behdad Jafari , George Sorensen
IPC分类号： H05K7/06 , H05K7/20
CPC分类号： H05K1/141 , G06F1/183 , H01L25/18 , H01L2224/16225 , H01L2224/16227 , H01L2224/73253 , H01L2924/15311 , H01L2924/15321 , H05K1/0204 , H05K1/0206 , H05K3/3436 , H05K2201/09954 , H05K2201/10159 , H05K2201/10674 , H05K2203/1572
摘要： A Multi-configuration Processor-Memory device for coupling to a PCB (printed circuit board) interface. The device comprises a substrate that supports multiple configurations of memory components and a processor while having a single, common interface with a PCB interface of a printed circuit board. In a first configuration, the substrate supports a processor and a first number of memory components. In a second configuration, the substrate supports a processor and an additional number of memory components. The memory components can be pre-tested, packaged memory components mounted on the substrate. The processor can be a surface mounted processor die. Additionally, the processor can be mounted in a flip chip configuration, side-opposite the memory components. In the first configuration, a heat spreader can be mounted on the memory components and the processor to dissipate heat. In the second, flip chip, configuration, the processor face can be soldered onto a non-functional area of the PCB interface of the printed circuit board to dissipate heat.
摘要翻译：用于耦合到PCB（印刷电路板）接口的多配置处理器 - 存储器件。该设备包括支持多个配置的存储器组件的基板和处理器，同时具有与印刷电路板的PCB接口的单一公共接口。在第一配置中，衬底支撑处理器和第一数量的存储器组件。在第二配置中，衬底支撑处理器和附加数量的存储器组件。存储器组件可以是预先测试的，封装的存储器组件安装在衬底上。处理器可以是表面安装的处理器管芯。此外，处理器可以安装在倒装芯片配置中，与存储器组件相对。在第一配置中，散热器可以安装在存储器组件和处理器上以散热。在第二个倒装芯片的配置中，处理器面可以焊接到印刷电路板的PCB接口的非功能区域以散热。

6. 发明授权

US2467570A Nail paint applicator 失效
标题翻译：指甲油涂抹器
公开(公告)号：US2467570A
公开(公告)日：1949-04-19
申请号：US73591347
申请日：1947-03-20
申请人： MARIE TALLMAN WARD , VIOLETTE WARD SORENSEN , ELMER GEORGE SORENSEN
发明人： WARD JOHN E
IPC分类号： A45D34/04
CPC分类号： A45D34/042 , Y10S15/04

7. 发明授权

US08482120B2 Combined heat sink multi-configuration processor memory substrate device 有权
标题翻译：组合散热器多配置处理器内存基板装置
公开(公告)号：US08482120B2
公开(公告)日：2013-07-09
申请号：US12005818
申请日：2007-12-28
申请人： Behdad Jafari , George Sorensen
发明人： Behdad Jafari , George Sorensen
IPC分类号： H01L23/34
CPC分类号： H05K1/141 , G06F1/183 , H01L25/18 , H01L2224/16225 , H01L2224/16227 , H01L2224/73253 , H01L2924/15311 , H01L2924/15321 , H05K1/0204 , H05K1/0206 , H05K3/3436 , H05K2201/09954 , H05K2201/10159 , H05K2201/10674 , H05K2203/1572
摘要： A Multi-configuration Processor-Memory device for coupling to a PCB (printed circuit board) interface. The device comprises a substrate that supports multiple configurations of memory components and a processor while having a single, common interface with a PCB interface of a printed circuit board. In a first configuration, the substrate supports a processor and a first number of memory components. In a second configuration, the substrate supports a processor and an additional number of memory components. The memory components can be pre-tested, packaged memory components mounted on the substrate. The processor can be a surface mounted processor die. Additionally, the processor can be mounted in a flip chip configuration, side-opposite the memory components. In the first configuration, a heat spreader can be mounted on the memory components and the processor to dissipate heat. In the second, flip chip, configuration, the processor face can be soldered onto a non-functional area of the PCB interface of the printed circuit board to dissipate heat.
摘要翻译：用于耦合到PCB（印刷电路板）接口的多配置处理器 - 存储器件。该设备包括支持多个配置的存储器组件的基板和处理器，同时具有与印刷电路板的PCB接口的单一公共接口。在第一配置中，衬底支撑处理器和第一数量的存储器组件。在第二配置中，衬底支撑处理器和附加数量的存储器组件。存储器组件可以预先测试，安装在基板上的封装存储器组件。处理器可以是表面安装的处理器管芯。此外，处理器可以安装在倒装芯片配置中，与存储器组件相对。在第一配置中，散热器可以安装在存储器组件和处理器上以散热。在第二个倒装芯片的配置中，处理器面可以焊接到印刷电路板的PCB接口的非功能区域以散热。

8. 发明申请

US20100103605A1 MULTI-CONFIGURATION PROCESSOR-MEMORY SUBSTRATE DEVICE 审中-公开
标题翻译：多配置处理器存储器基板设备
公开(公告)号：US20100103605A1
公开(公告)日：2010-04-29
申请号：US12650993
申请日：2009-12-31
申请人： Behdad Jafari , George Sorensen
发明人： Behdad Jafari , George Sorensen
IPC分类号： H05K7/00
CPC分类号： H05K1/141 , G06F1/183 , H01L25/18 , H01L2224/16225 , H01L2224/16227 , H01L2224/73253 , H01L2924/15311 , H01L2924/15321 , H05K1/0204 , H05K1/0206 , H05K3/3436 , H05K2201/09954 , H05K2201/10159 , H05K2201/10674 , H05K2203/1572
摘要： A Multi-configuration Processor-Memory device for coupling to a PCB (printed circuit board) interface. The device comprises a substrate that supports multiple configurations of memory components and a processor while having a single, common interface with a PCB interface of a printed circuit board. In a first configuration, the substrate supports a processor and a first number of memory components. In a second configuration, the substrate supports a processor and an additional number of memory components. The memory components can be pre-tested, packaged memory components mounted on the substrate. The processor can be a surface mounted processor die. Additionally, the processor can be mounted in a flip chip configuration, side-opposite the memory components. In the first configuration, a heat spreader can be mounted on the memory components and the processor to dissipate heat. In the second, flip chip, configuration, the processor face can be soldered onto a non-electrically functional area of the PCB interface of the printed circuit board to dissipate heat.
摘要翻译：用于耦合到PCB（印刷电路板）接口的多配置处理器 - 存储器件。该设备包括支持多个配置的存储器组件的基板和处理器，同时具有与印刷电路板的PCB接口的单一公共接口。在第一配置中，衬底支撑处理器和第一数量的存储器组件。在第二配置中，衬底支撑处理器和附加数量的存储器组件。存储器组件可以预先测试，安装在基板上的封装存储器组件。处理器可以是表面安装的处理器管芯。此外，处理器可以安装在倒装芯片配置中，与存储器组件相对。在第一配置中，散热器可以安装在存储器组件和处理器上以散热。在第二种情况下，倒装芯片的配置，处理器面可以被焊接到印刷电路板的PCB接口的非电功能区域以散热。

9. 发明申请

US20080106861A1 Multi-configuration processor-memory substrate device 有权
公开(公告)号：US20080106861A1
公开(公告)日：2008-05-08
申请号：US12005895
申请日：2007-12-28
申请人： Behdad Jafari , George Sorensen
发明人： Behdad Jafari , George Sorensen
IPC分类号： H05K7/06 , H05K7/20
CPC分类号： H05K1/141 , G06F1/183 , H01L25/18 , H01L2224/16225 , H01L2224/16227 , H01L2224/73253 , H01L2924/15311 , H01L2924/15321 , H05K1/0204 , H05K1/0206 , H05K3/3436 , H05K2201/09954 , H05K2201/10159 , H05K2201/10674 , H05K2203/1572
摘要： A Multi-configuration Processor-Memory device for coupling to a PCB (printed circuit board) interface. The device comprises a substrate that supports multiple configurations of memory components and a processor while having a single, common interface with a PCB interface of a printed circuit board. In a first configuration, the substrate supports a processor and a first number of memory components. In a second configuration, the substrate supports a processor and an additional number of memory components. The memory components can be pre-tested, packaged memory components mounted on the substrate. The processor can be a surface mounted processor die. Additionally, the processor can be mounted in a flip chip configuration, side-opposite the memory components. In the first configuration, a heat spreader can be mounted on the memory components and the processor to dissipate heat. In the second, flip chip, configuration, the processor face can be soldered onto a non-functional area of the PCB interface of the printed circuit board to dissipate heat.

10. 发明授权

US07341490B2 Design and method for plating PCI Express (PCIE) edge connector 有权
标题翻译： PCI Express（PCIE）边缘连接器的设计和方法
公开(公告)号：US07341490B2
公开(公告)日：2008-03-11
申请号：US11671909
申请日：2007-02-06
申请人： Bruce Michaud , Peter Ammann , George Sorensen
发明人： Bruce Michaud , Peter Ammann , George Sorensen
IPC分类号： H01R24/00
CPC分类号： H05K3/242 , H05K1/117 , H05K3/0052 , H05K2201/094
摘要： Embodiments of methods and apparatus for plating a PCI Express edge connector are described. In one embodiment, a printed circuit board having connectors is employed for electroplating one or more of the connectors formed thereon. The printed circuit board comprises a substrate having one or more layers, and a plurality of connectors formed on one or more of the layers, wherein at least one connector includes at least one short pin and at least one extra pin. The at least one extra pin extends beyond an outer shape of the printed circuit board after fabrication. The printed circuit board also includes connection circuitry formed on one or more of the layers, wherein the connection circuitry is configured to electrically connect the short pin with the extra pin at least during electroplating of said short pin.
摘要翻译：描述了用于电镀PCI Express边缘连接器的方法和装置的实施例。在一个实施例中，使用具有连接器的印刷电路板来电镀其中形成的一个或多个连接器。印刷电路板包括具有一个或多个层的衬底和形成在一个或多个层上的多个连接器，其中至少一个连接器包括至少一个短针和至少一个额外的针。在制造之后，至少一个额外的销延伸超出印刷电路板的外部形状。印刷电路板还包括形成在一个或多个层上的连接电路，其中连接电路被配置为至少在电镀所述短销期间将短销与额外的引脚电连接。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式