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1. 发明授权

US08198727B1 Integrated circuit/substrate interconnect system and method of manufacture 有权
标题翻译：集成电路/基板互连系统及其制造方法
公开(公告)号：US08198727B1
公开(公告)日：2012-06-12
申请号：US11611818
申请日：2006-12-15
申请人： Inderjit Singh , Ray Chen , Orion K. Starr , Behdad Jafari
发明人： Inderjit Singh , Ray Chen , Orion K. Starr , Behdad Jafari
IPC分类号： H01L23/48
CPC分类号： H01L24/13 , H01L24/81 , H01L2224/131 , H01L2224/13105 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13118 , H01L2224/1312 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/1329 , H01L2224/133 , H01L2224/13624 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2224/81191 , H01L2224/81385 , H01L2224/814 , H01L2224/83192 , H01L2924/00013 , H01L2924/01029 , H01L2924/01322 , H01L2924/14 , H01L2924/00014 , H01L2224/1379 , H01L2924/01032 , H01L2924/01082 , H01L2924/0105 , H01L2924/01047 , H01L2924/014 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： An integrated circuit/substrate interconnect apparatus and method are provided. Included is an integrated circuit including a plurality of bond pads, and a substrate including a plurality of landing pads and a mask. Such mask is spaced from the landing pads for defining areas therebetween. Further provided is a plurality of interconnects connected between the bond pads of the integrated circuit and the landing pads of the substrate. The interconnects include metal projections extending from the bond pads and a solder material for connecting the metal projections and the landing pads of the substrate.
摘要翻译：提供集成电路/基板互连装置和方法。包括包括多个接合焊盘的集成电路，以及包括多个着陆焊盘和掩模的基板。这样的掩模与着陆垫间隔开，以限定它们之间的区域。还提供了连接在集成电路的接合焊盘和衬底的着陆焊盘之间的多个互连。互连包括从接合焊盘延伸的金属突起和用于连接金属突起和衬底的着陆焊盘的焊料材料。

2. 发明授权

US07838999B1 System and method of manufacture for interconnecting an integrated circuit and a substrate 有权
标题翻译：用于互连集成电路和基板的系统和制造方法
公开(公告)号：US07838999B1
公开(公告)日：2010-11-23
申请号：US11733149
申请日：2007-04-09
申请人： Inderjit Singh , Ray Chen , Behdad Jafari
发明人： Inderjit Singh , Ray Chen , Behdad Jafari
IPC分类号： H01L29/40
CPC分类号： H01L23/49811 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/81191 , H01L2224/81801 , H01L2924/00014 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/14 , H01L2924/00 , H01L2224/05099 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An integrated circuit/substrate interconnect apparatus and method of manufacture are provided. Included is a substrate with a plurality of wells and a landing pad formed in each of the wells. The substrate further includes a seed layer deposited in each of the wells over the landing pad, and a metalized layer deposited in each of the wells over the seed layer. Before assembly, an upper surface of the metalized layer forms a well.
摘要翻译：提供集成电路/基板互连装置及其制造方法。包括具有多个孔的基底和在每个孔中形成的着陆垫。衬底还包括沉积在着陆焊盘上的每个阱中的种子层，以及沉积在种子层上的每个阱中的金属化层。在组装之前，金属化层的上表面形成井。

3. 发明授权

US07254033B2 Method and apparatus for heat dissipation 有权
标题翻译：散热方法和装置
公开(公告)号：US07254033B2
公开(公告)日：2007-08-07
申请号：US10922396
申请日：2004-08-19
申请人： Behdad Jafari , Inderjit Singh
发明人： Behdad Jafari , Inderjit Singh
IPC分类号： H05K7/20
CPC分类号： H01L23/433 , H01L23/42 , H01L23/4275 , H01L23/467 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01079 , H01L2224/0401
摘要： Embodiments of methods, apparatuses, devices, and/or systems for heat dissipation are disclosed.
摘要翻译：公开了用于散热的方法，装置，装置和/或系统的实施例。

4. 发明申请

US20060039118A1 Method and apparatus for heat dissipation 有权
标题翻译：散热方法和装置
公开(公告)号：US20060039118A1
公开(公告)日：2006-02-23
申请号：US10922396
申请日：2004-08-19
申请人： Behdad Jafari , Inderjit Singh
发明人： Behdad Jafari , Inderjit Singh
IPC分类号： H05K7/20
CPC分类号： H01L23/433 , H01L23/42 , H01L23/4275 , H01L23/467 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01079 , H01L2224/0401
摘要： Embodiments of methods, apparatuses, devices, and/or systems for heat dissipation are disclosed.
摘要翻译：公开了用于散热的方法，装置，装置和/或系统的实施例。

5. 发明申请

US20080266786A1 METHOD AND APPARATUS FOR HEAT DISSIPATION 审中-公开
标题翻译：用于散热的方法和装置
公开(公告)号：US20080266786A1
公开(公告)日：2008-10-30
申请号：US11739859
申请日：2007-04-25
申请人： Behdad Jafari , Inderjit Singh
发明人： Behdad Jafari , Inderjit Singh
IPC分类号： H05K7/20
CPC分类号： H01L23/433 , H01L23/42 , H01L23/467 , H01L24/32 , H01L2224/16225 , H01L2224/73204 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/14 , H01L2924/19041 , H01L2924/00 , H01L2224/0401
摘要： Embodiments of methods, apparatuses, devices, and/or systems for heat dissipation are disclosed.
摘要翻译：公开了用于散热的方法，装置，装置和/或系统的实施例。

6. 发明申请

US20140291376A1 FLAT-CLINCH STAPLER 有权
标题翻译：平缝机
公开(公告)号：US20140291376A1
公开(公告)日：2014-10-02
申请号：US13982081
申请日：2011-01-27
申请人： D. Ranjan , Navdeep Bassi , Inderjit Singh
发明人： D. Ranjan , Navdeep Bassi , Inderjit Singh
IPC分类号： B25C5/02
CPC分类号： B25C5/02 , B25C5/025
摘要： A flat-clinch-stapler comprises: a base portion (20) having upstanding bearing pieces (21) at its rear end for supporting a first transverse pivot axis (22), and a floating clincher table (11); a magazine (5) having a U-shaped cross section pivotably mounted at its rear end about said first pivot axis; a driver arm (1) carrying a driver blade (9) and being pivotably mounted at its rear end to said first pivot axis; and a handle member (300) pivotably mounted about a second transverse axis (310) in the bearing pieces offset relative to said first pivot axis in a direction to the front end of the base portion and acting on the driver arm at a position even further to the front end of the stapler. The magazine bottom wall guides the free ends of the legs of staples within the magazine. An elongated intermediate member (3) disposed between said magazine and said driver arm is pivotably mounted to said first pivot axis and has an inverted U-shaped cross section comprising a top wall and side walls downwardly extending inbetween and along said side walls of said magazine, the bottom edges of said side walls of said intermediate member engaging the cross members of staples within said magazine.
摘要翻译：扁平订书机包括：在其后端具有用于支撑第一横向枢转轴线（22）的直立轴承件（21）的底座部分（20）和浮动敲弯台（11）; 具有U形横截面的杂志（5），所述U形横截面在其后端围绕所述第一枢转轴线可枢转地安装; 驱动臂（1），其承载驱动器叶片（9）并且在其后端可枢转地安装到所述第一枢转轴线; 以及手柄构件（300），其围绕第一横向轴线（310）可枢转地安装在所述轴承件中，所述轴承件相对于所述第一枢转轴线在基本部分的前端的方向上偏移，并且在更远的位置处作用在所述驱动臂上到订书机的前端。刀库底壁引导刀库内钉钉的自由端。设置在所述盒和所述驱动臂之间的细长中间构件（3）可枢转地安装到所述第一枢转轴线上并且具有倒置的U形横截面，该横截面包括顶壁和向下延伸到所述盒的所述侧壁所述中间构件的所述侧壁的底边缘与所述料盒内的缝钉的横向构件接合。

7. 发明申请

US20130344208A1 METHOD AND APPARATUS FOR PLASMA ASSISTED LASER COOKING OF FOOD PRODUCTS 审中-公开
标题翻译：用于等离子体辅助激光烹饪食品的方法和装置
公开(公告)号：US20130344208A1
公开(公告)日：2013-12-26
申请号：US14004290
申请日：2011-03-11
申请人： Inderjit Singh
发明人： Inderjit Singh
IPC分类号： A23L1/01
CPC分类号： A23L1/0128 , A23L5/15 , A23L5/32 , F24C7/087 , H05B6/647
摘要： A method and apparatus are disclosed for applying laser energy to a food product to effect cooking thereof. The energy can be applied with a laser emitter in proximity to the food product. The application of the energy can be controlled according to a profile so as to generate a plasma in and around the food product during a cooking period. The application of energy can be adjusted based on feedback associated with the controlled application of the energy to the food product.
摘要翻译：公开了一种用于将激光能量施加到食品以实现其烹饪的方法和装置。能量可以与食品附近的激光发射器一起施加。可以根据轮廓来控制能量的施加，以便在烹饪期间在食品内和周围产生等离子体。能量的应用可以根据与食品的能量受控应用相关的反馈进行调整。

8. 发明授权

US08352569B2 Full mesh rates transaction in a network 有权
标题翻译：网络中的全网格率交易
公开(公告)号：US08352569B2
公开(公告)日：2013-01-08
申请号：US12027228
申请日：2008-02-06
申请人： Robert L. Hare, Jr. , Inderjit Singh , Bradley Thomas Hyslop , Shlomo Ovadia
发明人： Robert L. Hare, Jr. , Inderjit Singh , Bradley Thomas Hyslop , Shlomo Ovadia
IPC分类号： G06F15/16
CPC分类号： H04L12/403 , H04L12/2801 , H04W74/06
摘要： In one embodiment a communication method comprises the steps of receiving a query at Layer 2 from an entry node by way of a coordinated network, the query requesting data rates of network resources of the coordinated network; transmitting a Layer 2 request for an available data rate to each of a plurality of nodes connected to the coordinated network in response to the query; receiving a first Layer 2 response to said request from one or more of the plurality of nodes, wherein the first response includes a data rate with which each of the one or more nodes is capable of transmitting or receiving data; and transmitting a list of the received data rates to at least the entry node on the coordinated network.
摘要翻译：在一个实施例中，通信方法包括以下步骤：通过协调网络从入口节点在层2处接收查询，所述查询请求协调网络的网络资源的数据速率; 响应于所述查询，向连接到所述协调网络的多个节点中的每一个发送可用数据速率的层2请求; 从所述多个节点中的一个或多个节点接收对所述请求的第一层2响应，其中所述第一响应包括所述一个或多个节点中的每一个能够发送或接收数据的数据速率; 以及将所接收的数据速率的列表发送到协调网络上的至少入口节点。

9. 发明申请

US20090192120A1 INHIBITORS OF NITRIC OXIDE SYNTHASE 审中-公开
标题翻译：氮氧化物合成酶抑制剂
公开(公告)号：US20090192120A1
公开(公告)日：2009-07-30
申请号：US12145261
申请日：2008-06-24
申请人： Inderjit Singh
发明人： Inderjit Singh
IPC分类号： A61K31/7076 , A61K31/4015 , A61K31/352
CPC分类号： A61K31/366 , A61K31/00 , A61K31/137 , A61K31/145 , A61K31/175 , A61K31/192 , A61K31/198 , A61K31/20 , A61K31/275 , A61K31/343 , A61K31/35 , A61K31/352 , A61K31/40 , A61K31/4015 , A61K31/4196 , A61K31/472 , A61K31/522 , A61K31/661 , A61K31/7056 , A61K31/7076 , C12N9/99 , Y10S514/866
摘要： The current invention discloses novel methods for the inhibition of inducible nitric oxide synthesis (iNOS) and the production of NO. Methods of inhibiting the induction of proinflammatory cytokines are also described. Methods of treating various disease states, such as X-linked adrenoleukodystrophy, multiple sclerosis, Alzheimer's and septic shock using inhibitors of iNOS and cytokine induction are disclosed. The inhibitors include the exemplary compounds lovastatin, a sodium salt of phenylacetic acid (NaPA), FPT inhibitor II, N-acetyl cysteine (NAC), and cAMP.
摘要翻译：本发明公开了抑制诱导型一氧化氮合成（iNOS）和NO产生的新方法。还描述了抑制促炎细胞因子诱导的方法。公开了使用iNOS抑制剂和细胞因子诱导来治疗各种疾病状态的方法，例如X连接的肾上腺脑白质营养不良，多发性硬化，阿尔茨海默病和败血症休克。抑制剂包括示例性化合物洛伐他汀，苯乙酸钠盐（NaPA），FPT抑制剂II，N-乙酰半胱氨酸（NAC）和cAMP。

10. 发明授权

US07396659B2 Inhibitors of nitric oxide synthase to treat type 1 diabetes 失效
标题翻译：一氧化氮合酶抑制剂治疗1型糖尿病
公开(公告)号：US07396659B2
公开(公告)日：2008-07-08
申请号：US11204288
申请日：2005-08-15
申请人： Inderjit Singh
发明人： Inderjit Singh
IPC分类号： C12Q1/26
CPC分类号： A61K31/366 , A61K31/00 , A61K31/137 , A61K31/145 , A61K31/175 , A61K31/192 , A61K31/198 , A61K31/20 , A61K31/275 , A61K31/343 , A61K31/35 , A61K31/352 , A61K31/40 , A61K31/4015 , A61K31/4196 , A61K31/472 , A61K31/522 , A61K31/661 , A61K31/7056 , A61K31/7076 , C12N9/99 , Y10S514/866
摘要： A method for treating type 1 diabetes in a human in need of such treatment, comprising administering to the human a biologically effective amount of at least one inhibitor of inducible nitric oxide synthase or a pro-inflammatory cytokine, wherein the inhibitor is an inhibitor of HMG-CoA reductase or a pharmaceutically acceptable salt thereof, and the inhibitor specifically inhibits the activity of HMG-CoA reductase.
摘要翻译：一种治疗需要这种治疗的人的1型糖尿病的方法，包括向人体施用生物有效量的至少一种诱导型一氧化氮合酶抑制剂或促炎细胞因子，其中所述抑制剂是HMG的抑制剂 -CoA还原酶或其药学上可接受的盐，并且所述抑制剂特异性抑制HMG-CoA还原酶的活性。

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