专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20090241312A1 Capacitor and Method for Producing the Same 审中-公开
标题翻译：电容器及其制作方法
公开(公告)号：US20090241312A1
公开(公告)日：2009-10-01
申请号：US12481066
申请日：2009-06-09
申请人： Hiroshi Kunimatsu , Yoshinori Oyabu , Tadahiro Minamikawa , Atsuyoshi Maeda
发明人： Hiroshi Kunimatsu , Yoshinori Oyabu , Tadahiro Minamikawa , Atsuyoshi Maeda
IPC分类号： H01G9/00
CPC分类号： H01G4/008 , H01G4/12 , H01G4/33
摘要： A low-profile capacitor that can be bent and that has excellent interlayer adhesion strength. The capacitor includes a dielectric layer, a first capacitor electrode formed on a first main surface of the dielectric layer, a second capacitor electrode formed on a second main surface of the dielectric layer, and a lead electrode formed on the first main surface of the dielectric layer and electrically connected to the second capacitor electrode. The dielectric layer has a thickness of 5 μm or less. The sum of the thicknesses of the first and second capacitor electrodes is 5 μm or more and at least twice the thickness of the dielectric layer. The first and second capacitor electrodes and the lead electrode are formed of a malleable metal. The dielectric layer and the first and second capacitor electrodes are formed by being simultaneously sintered.
摘要翻译：可弯曲的薄型电容器，具有优异的层间粘合强度。电容器包括电介质层，形成在电介质层的第一主表面上的第一电容器电极，形成在电介质层的第二主表面上的第二电容器电极和形成在电介质的第一主表面上的引线电极并且电连接到第二电容器电极。电介质层的厚度为5μm以下。第一和第二电容器电极的厚度之和为5μm以上且为电介质层的厚度的2倍以上。第一和第二电容器电极和引线电极由可锻金属形成。介电层和第一和第二电容器电极通过同时烧结形成。

2. 发明申请

US20100232126A1 PACKAGE SUBSTRATE 有权
标题翻译：包装基板
公开(公告)号：US20100232126A1
公开(公告)日：2010-09-16
申请号：US12722607
申请日：2010-03-12
申请人： Atsuyoshi MAEDA , Shingo ITO , Satoru NODA
发明人： Atsuyoshi MAEDA , Shingo ITO , Satoru NODA
IPC分类号： H05K7/02
CPC分类号： H05K7/026 , H01G4/232 , H01G4/40 , H01L23/49816 , H01L23/49838 , H01L23/50 , H01L23/5389 , H01L2224/05001 , H01L2224/05026 , H01L2224/05568 , H01L2224/16 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15159 , H01L2924/15311 , H01L2924/19106 , H01L2224/05599 , H01L2224/05099
摘要： A package substrate includes a main package body including a first principal surface on which an IC is mounted, and a second principal surface, opposed to the first principal surface, on which first bonding materials for mounting are provided. An internal circuit is provided within the main package body and connected to the first bonding materials. A sub-package is arranged on the second principal surface and includes electronic components embedded therein. A thickness direction dimension being the distance from the second principal surface to a portion of the sub-package most distant from the second principal surface, is not more than a thickness direction dimension being the distance from the second principal surface to an edge of the first bonding material at the second principal surface.
摘要翻译：封装基板包括：主封装主体，包括安装有IC的第一主表面;以及与第一主表面相对的第二主表面，在其上设置用于安装的第一粘合材料。内部电路设置在主包装体内并连接到第一接合材料。子包装被布置在第二主表面上并且包括嵌入其中的电子部件。厚度方向尺寸是从第二主表面到最远离第二主表面的子组件的一部分的距离的厚度方向尺寸不大于从第二主表面到第一主表面的边缘的距离的厚度方向尺寸在第二主表面处接合材料。

3. 发明授权

US07771552B2 Method for manufacturing thin film capacitor 有权
标题翻译：制造薄膜电容器的方法
公开(公告)号：US07771552B2
公开(公告)日：2010-08-10
申请号：US11928287
申请日：2007-10-30
申请人： Tadahiro Minamikawa , Atsuyoshi Maeda
发明人： Tadahiro Minamikawa , Atsuyoshi Maeda
IPC分类号： C03B29/00 , B29C65/00 , C04B33/32
CPC分类号： H01G4/33 , H01G4/1209
摘要： A dielectric green sheet containing a dielectric ceramic powder, conductor green sheets containing a metal powder, and firing-assisting green sheets containing an inorganic oxide material powder are prepared, and the firing-assisting green sheet, the conductor green sheet, the dielectric green sheet, another conductor green sheet, and another firing-assisting green sheets are stacked in that order to prepare a laminate. The laminate is then fired. During firing, the bonding strength of the interfaces between the conductor green sheets and the firing-assisting green sheets is decreased and the oxygen partial pressure of the firing atmosphere is changed at least once so that the capacitor portion is separated from the firing-assisting green sheets. In this manner, a method for manufacturing thin film capacitor by which a high-reliability thin film capacitor can be produced at high efficiency and low cost without adversely affecting the characteristics of the thin film capacitor.
摘要翻译：制备包含电介质陶瓷粉末，含有金属粉末的导体生片和含有无机氧化物材料粉末的焙烧辅助生片的电介质生片，并且，辅助生片，导体生片，电介质生片，另一个导体生片，和另一个焙烧辅助生片按顺序堆叠以制备层压体。然后将层压板烧制。在焙烧期间，导体生片与助燃原料之间的界面的接合强度降低，并且烧成气氛的氧分压至少改变一次，使得电容器部分与助燃绿床单。以这种方式，可以以高效率和低成本生产高可靠性薄膜电容器的薄膜电容器的制造方法，而不会不利地影响薄膜电容器的特性。

4. 发明申请

US20080106845A1 Capacitor and Method for Producing the Same 审中-公开
标题翻译：电容器及其制作方法
公开(公告)号：US20080106845A1
公开(公告)日：2008-05-08
申请号：US12014180
申请日：2008-01-15
申请人： Hiroshi Kunimatsu , Yoshinori Oyabu , Tadahiro Minamikawa , Atsuyoshi Maeda
发明人： Hiroshi Kunimatsu , Yoshinori Oyabu , Tadahiro Minamikawa , Atsuyoshi Maeda
IPC分类号： H01G4/005
CPC分类号： H01G4/008 , H01G4/12 , H01G4/33
摘要： A low-profile capacitor that can be bent and that has excellent interlayer adhesion strength. The capacitor includes a dielectric layer, a first capacitor electrode formed on a first main surface of the dielectric layer, a second capacitor electrode formed on a second main surface of the dielectric layer, and a lead electrode formed on the first main surface of the dielectric layer and electrically connected to the second capacitor electrode. The dielectric layer has a thickness of 5 μm or less. The sum of the thicknesses of the first and second capacitor electrodes is 5 μm or more and at least twice the thickness of the dielectric layer. The first and second capacitor electrodes and the lead electrode are formed of a malleable metal. The dielectric layer and the first and second capacitor electrodes are formed by being simultaneously sintered.
摘要翻译：可弯曲的薄型电容器，具有优异的层间粘合强度。电容器包括电介质层，形成在电介质层的第一主表面上的第一电容器电极，形成在电介质层的第二主表面上的第二电容器电极和形成在电介质的第一主表面上的引线电极并且电连接到第二电容器电极。电介质层的厚度为5μm以下。第一和第二电容器电极的厚度之和为5μm以上且为电介质层的厚度的2倍以上。第一和第二电容器电极和引线电极由可锻金属形成。介电层和第一和第二电容器电极通过同时烧结形成。

5. 发明申请

US20080060743A1 Method for Manufacturing Thin Film Capacitor 有权
标题翻译：制造薄膜电容器的方法
公开(公告)号：US20080060743A1
公开(公告)日：2008-03-13
申请号：US11928287
申请日：2007-10-30
申请人： Tadahiro Minamikawa , Atsuyoshi Maeda
发明人： Tadahiro Minamikawa , Atsuyoshi Maeda
IPC分类号： C03B29/00 , C04B35/64
CPC分类号： H01G4/33 , H01G4/1209
摘要： A dielectric green sheet containing a dielectric ceramic powder, conductor green sheets containing a metal powder, and firing-assisting green sheets containing an inorganic oxide material powder are prepared, and the firing-assisting green sheet, the conductor green sheet, the dielectric green sheet, another conductor green sheet, and another firing-assisting green sheets are stacked in that order to prepare a laminate. The laminate is then fired. During firing, the bonding strength of the interfaces between the conductor green sheets and the firing-assisting green sheets is decreased and the oxygen partial pressure of the firing atmosphere is changed at least once so that the capacitor portion is separated from the firing-assisting green sheets. In this manner, a method for manufacturing thin film capacitor by which a high-reliability thin film capacitor can be produced at high efficiency and low cost without adversely affecting the characteristics of the thin film capacitor.
摘要翻译：制备包含电介质陶瓷粉末，含有金属粉末的导体生片和含有无机氧化物材料粉末的焙烧辅助生片的电介质生片，并且，辅助生片，导体生片，电介质生片，另一个导体生片，和另一个焙烧辅助生片按顺序堆叠以制备层压体。然后将层压板烧制。在焙烧期间，导体生片与助燃原料之间的界面的接合强度降低，并且烧成气氛的氧分压至少改变一次，使得电容器部分与助燃绿床单。以这种方式，可以以高效率和低成本生产高可靠性薄膜电容器的薄膜电容器的制造方法，而不会不利地影响薄膜电容器的特性。

6. 发明授权

US06500362B2 Conductive paste and ceramic electronic component 有权
标题翻译：导电胶和陶瓷电子元件
公开(公告)号：US06500362B2
公开(公告)日：2002-12-31
申请号：US09779270
申请日：2001-02-08
申请人： Takeshi Miki , Atsuyoshi Maeda
发明人： Takeshi Miki , Atsuyoshi Maeda
IPC分类号： H01B102
CPC分类号： H01G4/232 , C03C3/14 , H01B1/16 , H01C1/14 , H01G4/228 , Y10T428/24917 , Y10T428/24926
摘要： A conductive paste containing no Pb and able to suppress heat generation in a sintered ceramic body, and a medium and high voltage ceramic capacitor with thick film electrodes formed thereof, are provided. The conductive paste containing substantially no Pb is composed of an Ag powder, a glass powder having on a % by mole basis, 30
摘要翻译：提供了不含Pb并且能够抑制烧结陶瓷体中的发热的导电性糊料以及由其形成有厚膜电极的中高压陶瓷电容器。基本上不含Pb的导电糊料由Ag粉末，以摩尔％计的玻璃粉末30

7. 发明授权

US06939619B2 Metal powder, method for producing the same, conductive paste using the same, and monolithic ceramic electronic component 有权
标题翻译：金属粉末，其制造方法，使用其的导电膏，以及单片陶瓷电子部件
公开(公告)号：US06939619B2
公开(公告)日：2005-09-06
申请号：US10378947
申请日：2003-03-05
申请人： Tadasu Hosokura , Atsuyoshi Maeda
发明人： Tadasu Hosokura , Atsuyoshi Maeda
IPC分类号： B22F1/00 , B22F9/24 , H01B1/00 , H01B1/02 , H01B1/22 , H01B13/00 , H01G4/12 , H01G9/052 , B32B5/30
CPC分类号： H01G9/0525 , B22F9/24 , B22F2998/00 , H01B1/02 , H01B1/22 , Y10T428/12028 , Y10T428/12049 , B22F1/0018
摘要： A metal powder is formed by the steps of preparing a reducing agent solution, preparing a mixed metallic salt solution by dissolving a nickel salt and a copper salt in a solvent, and mixing the reducing agent solution and the mixed metallic salt solution so that the copper salt is reduced to precipitate copper particle nuclei and then the nickel salt is reduced to precipitate nickel around the copper particle nuclei. A metal power produced by this production method, a conductive paste containing the metal powder and a monolithic ceramic electronic component in which internal electrodes are formed using the conductive paste are also disclosed.
摘要翻译：通过以下步骤形成金属粉末：制备还原剂溶液，通过将镍盐和铜盐溶解在溶剂中制备混合金属盐溶液，并将还原剂溶液和混合金属盐溶液混合，使铜盐减少以沉淀铜颗粒核，然后还原镍盐以在铜颗粒核周围沉淀镍。还公开了通过该制造方法制造的金属功率，含有金属粉末的导电性糊料和使用导电性糊料形成内部电极的整体式陶瓷电子部件。

8. 发明授权

US06551729B2 Conductive paste and ceramic electronic element using the same 有权
公开(公告)号：US06551729B2
公开(公告)日：2003-04-22
申请号：US09934230
申请日：2001-08-21
申请人： Shinichi Taira , Atsuyoshi Maeda
发明人： Shinichi Taira , Atsuyoshi Maeda
IPC分类号： B32B904
CPC分类号： H01C1/148 , H01C7/003 , H01C17/283
摘要： A conductive paste is provided which can prevent the generation of wrinkles on electrode films after drying and which can be used for forming a highly reliable ceramic electronic element having superior appearance. The conductive paste contains a conductive component such as silver or copper and an organic vehicle. The organic vehicle contains an organic binder, a first solvent dissolving the organic binder and a second solvent substantially not dissolving the organic binder, wherein the boiling point of the first solvent is higher than that of the second solvent or is higher than the temperature at the end of distillation thereof by about 20° C. or more, and the content of the second solvent is about 30 to 70 wt % of the organic vehicle.

9. 发明授权

US06503291B2 Method for manufacturing a metal powder, a metal powder, an electroconductive paste using the same, and a multilayer ceramic electronic component using the same 有权
标题翻译：金属粉末，金属粉末，使用其的导电性糊料的制造方法以及使用其的多层陶瓷电子部件
公开(公告)号：US06503291B2
公开(公告)日：2003-01-07
申请号：US09841199
申请日：2001-04-24
申请人： Tadasu Hosokura , Atsuyoshi Maeda
发明人： Tadasu Hosokura , Atsuyoshi Maeda
IPC分类号： B22F924
CPC分类号： H01G4/008 , B22F1/0018 , B22F9/24 , B32B18/00 , B82Y30/00 , C04B35/4682 , C04B35/645 , C04B2235/3206 , C04B2235/3224 , C04B2235/3234 , C04B2235/3262 , C04B2235/3418 , C04B2235/5445 , C04B2235/6025 , C04B2235/6567 , C04B2235/6582 , C04B2235/6584 , C04B2235/785 , C04B2235/786 , C04B2237/346 , C04B2237/525 , C04B2237/704 , H01G4/30 , H05K1/092 , Y10T428/24917 , Y10T428/2991 , Y10T428/2993
摘要： Provided is a method for manufacturing a metal powder by providing a reducing solution by dispersing caustic alkali, and hydrazine and/or hydrazine hydrate into a solvent; providing a metal salt solution comprising a salt of electroconductive metal, a rare earth metal salt and a solvent; and mixing the reducing solution with the metal salt solution to form a metal powder by depositing a hydroxide derived from the rare earth metal salt and by reducing the salt of electroconductive metal. With this metal powder manufacturing method, the sintering of the metal powder is restricted at a low temperature, the sintering initiation temperature is shifted to a higher level, and rapid sintering shrinkage is restricted, while ceramic grain growth is not accelerated.
摘要翻译：本发明提供一种通过将苛性碱分散还原溶液和肼和/或水合肼加入到溶剂中来制造金属粉末的方法; 提供包含导电金属盐，稀土金属盐和溶剂的金属盐溶液; 并将还原溶液与金属盐溶液混合，通过沉积衍生自稀土金属盐的氢氧化物和还原导电金属盐形成金属粉末。利用该金属粉末的制造方法，金属粉末的烧结被限制在低温下，烧结开始温度转移到更高的水平，并且在不促进陶瓷晶粒生长的同时限制了快速烧结收缩。

10. 发明授权

US06585796B2 Metal powder, method for producing the same, conductive paste using the same, and monolithic ceramic electronic component 有权
公开(公告)号：US06585796B2
公开(公告)日：2003-07-01
申请号：US09863739
申请日：2001-05-23
申请人： Tadasu Hosokura , Atsuyoshi Maeda
发明人： Tadasu Hosokura , Atsuyoshi Maeda
IPC分类号： B22F924
CPC分类号： H01G9/0525 , B22F9/24 , B22F2998/00 , H01B1/02 , H01B1/22 , Y10T428/12028 , Y10T428/12049 , B22F1/0018
摘要： A metal powder is formed by the steps of preparing a reducing agent solution, preparing a mixed metallic salt solution by dissolving a nickel salt and a copper salt in a solvent, and mixing the reducing agent solution and the mixed metallic salt solution so that the copper salt is reduced to precipitate copper particle nuclei and then the nickel salt is reduced to precipitate nickel around the copper particle nuclei. A metal power produced by this production method, a conductive paste containing the metal powder and a monolithic ceramic electronic component in which internal electrodes are formed using the conductive paste are also disclosed.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式