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1. 发明申请

US20090241312A1 Capacitor and Method for Producing the Same 审中-公开
标题翻译：电容器及其制作方法
公开(公告)号：US20090241312A1
公开(公告)日：2009-10-01
申请号：US12481066
申请日：2009-06-09
申请人： Hiroshi Kunimatsu , Yoshinori Oyabu , Tadahiro Minamikawa , Atsuyoshi Maeda
发明人： Hiroshi Kunimatsu , Yoshinori Oyabu , Tadahiro Minamikawa , Atsuyoshi Maeda
IPC分类号： H01G9/00
CPC分类号： H01G4/008 , H01G4/12 , H01G4/33
摘要： A low-profile capacitor that can be bent and that has excellent interlayer adhesion strength. The capacitor includes a dielectric layer, a first capacitor electrode formed on a first main surface of the dielectric layer, a second capacitor electrode formed on a second main surface of the dielectric layer, and a lead electrode formed on the first main surface of the dielectric layer and electrically connected to the second capacitor electrode. The dielectric layer has a thickness of 5 μm or less. The sum of the thicknesses of the first and second capacitor electrodes is 5 μm or more and at least twice the thickness of the dielectric layer. The first and second capacitor electrodes and the lead electrode are formed of a malleable metal. The dielectric layer and the first and second capacitor electrodes are formed by being simultaneously sintered.
摘要翻译：可弯曲的薄型电容器，具有优异的层间粘合强度。电容器包括电介质层，形成在电介质层的第一主表面上的第一电容器电极，形成在电介质层的第二主表面上的第二电容器电极和形成在电介质的第一主表面上的引线电极并且电连接到第二电容器电极。电介质层的厚度为5μm以下。第一和第二电容器电极的厚度之和为5μm以上且为电介质层的厚度的2倍以上。第一和第二电容器电极和引线电极由可锻金属形成。介电层和第一和第二电容器电极通过同时烧结形成。

2. 发明申请

US20080106845A1 Capacitor and Method for Producing the Same 审中-公开
标题翻译：电容器及其制作方法
公开(公告)号：US20080106845A1
公开(公告)日：2008-05-08
申请号：US12014180
申请日：2008-01-15
申请人： Hiroshi Kunimatsu , Yoshinori Oyabu , Tadahiro Minamikawa , Atsuyoshi Maeda
发明人： Hiroshi Kunimatsu , Yoshinori Oyabu , Tadahiro Minamikawa , Atsuyoshi Maeda
IPC分类号： H01G4/005
CPC分类号： H01G4/008 , H01G4/12 , H01G4/33
摘要： A low-profile capacitor that can be bent and that has excellent interlayer adhesion strength. The capacitor includes a dielectric layer, a first capacitor electrode formed on a first main surface of the dielectric layer, a second capacitor electrode formed on a second main surface of the dielectric layer, and a lead electrode formed on the first main surface of the dielectric layer and electrically connected to the second capacitor electrode. The dielectric layer has a thickness of 5 μm or less. The sum of the thicknesses of the first and second capacitor electrodes is 5 μm or more and at least twice the thickness of the dielectric layer. The first and second capacitor electrodes and the lead electrode are formed of a malleable metal. The dielectric layer and the first and second capacitor electrodes are formed by being simultaneously sintered.
摘要翻译：可弯曲的薄型电容器，具有优异的层间粘合强度。电容器包括电介质层，形成在电介质层的第一主表面上的第一电容器电极，形成在电介质层的第二主表面上的第二电容器电极和形成在电介质的第一主表面上的引线电极并且电连接到第二电容器电极。电介质层的厚度为5μm以下。第一和第二电容器电极的厚度之和为5μm以上且为电介质层的厚度的2倍以上。第一和第二电容器电极和引线电极由可锻金属形成。介电层和第一和第二电容器电极通过同时烧结形成。

3. 发明授权

US5070988A Apparatus for aligning electronic component chips 失效
标题翻译：用于对准电子元器件的装置
公开(公告)号：US5070988A
公开(公告)日：1991-12-10
申请号：US625877
申请日：1990-12-11
申请人： Toru Konishi , Yoshinori Oyabu
发明人： Toru Konishi , Yoshinori Oyabu
IPC分类号： H05K13/02 , B65G47/14
CPC分类号： B65G47/1407
摘要： An apparatus for aligning electronic component chips includes an aligning passage for guiding a plurality of electronic component chips which are in an aligned state along a prescribed direction, and a chamber communicated with the aligning passage for storing the plurality of electronic component chips. A blowing passage is provided near an inlet of the aligning passage for introducing compressed air from the outside. An upper wall surface defining the space is provided by a displaceable movable block, the displacement of the movable block upward is driven by the compressed air introduced from the blowing passage, and displacement downward is driven by natural gravity. Therefore, by the intermittent introduction of the compressed air, the movable block reciprocates up and down so that a space between the upper and lower wall surfaces of the space is widened and narrowed. Consequently, a phenomenon in which a plurality of electronic component chips butt to each other between these wall surfaces to stop the movement of the electronic component chips can be easily dissolved.
摘要翻译：用于对准电子元件芯片的设备包括：对准通道，用于沿着规定方向引导处于取向状态的多个电子元件芯片;以及与对准通道连通的室，用于存储多个电子元件芯片。在对准通道的入口附近设置有吹送通道，用于从外部引入压缩空气。通过可移动的可移动块来提供限定空间的上壁表面，向上移动的块的位移由从吹送通道引入的压缩空气驱动，向下的位移由自然重力驱动。因此，通过间歇地引入压缩空气，可动块上下往复运动，使得空间的上下壁面之间的空间变宽。因此，能够容易地解除在这些壁面之间彼此对接的多个电子部件芯片以阻止电子部件芯片的移动的现象。

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