会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明授权
    • Nitride semiconductor light emitting device
    • 氮化物半导体发光器件
    • US08324639B2
    • 2012-12-04
    • US11882826
    • 2007-08-06
    • Mayuko FudetaAtsuo Tsunoda
    • Mayuko FudetaAtsuo Tsunoda
    • H01L33/00
    • H01L33/0075H01L21/027H01L21/28H01L21/78H01L33/0066H01L33/0079H01L33/405H01L33/44H01L33/486H01L33/62H01L2933/0033H01L2933/0066
    • A nitride semiconductor light emitting device includes a conductive substrate, a first metal layer, a second conductivity-type semiconductor layer, an emission layer, and a first conductivity-type semiconductor layer in this order. The nitride semiconductor light emitting device additionally has an insulating layer covering at least side surfaces of the second conductivity-type semiconductor layer, the emission layer and the first conductivity-type semiconductor layer. A method of manufacturing the same is provided. The nitride semiconductor light emitting device may further include a second metal layer. Thus, a reliable nitride semiconductor light emitting device and a method of manufacturing the same are provided in which short-circuit at the PN junction portion and current leak is reduced as compared with the conventional examples.
    • 氮化物半导体发光器件依次包括导电衬底,第一金属层,第二导电型半导体层,发光层和第一导电型半导体层。 氮化物半导体发光器件还具有覆盖第二导电型半导体层,发光层和第一导电型半导体层的至少侧面的绝缘层。 提供了制造该方法的方法。 氮化物半导体发光器件还可以包括第二金属层。 因此,提供了可靠的氮化物半导体发光器件及其制造方法,其中与传统示例相比,PN结部分处的短路和电流泄漏被降低。
    • 4. 发明授权
    • Semiconductor laser device capable of preventing a threshold current and an operating current from increasing and manufacturing method therefor
    • 能够防止阈值电流和工作电流的半导体激光装置的增加和制造方法
    • US06999488B2
    • 2006-02-14
    • US10602827
    • 2003-06-25
    • Atsuo Tsunoda
    • Atsuo Tsunoda
    • H01S5/00
    • B82Y20/00H01S5/0421H01S5/2201H01S5/2206H01S5/2231H01S5/34326H01S2301/173H01S2304/02
    • A ridge section constructed of a p-type second AlGaInP clad layer 8, a p-type GaInP interlayer 9 and a p-type GaAs cap layer 10 is formed on an etching stop layer 7. A step of not smaller than 0.13 μm is formed between the p-type interlayer 9 and the p-type second clad layer 8 by making the p-type interlayer 9 protrude in both widthwise directions beyond the p-type second clad layer 8. With this step, AlInP layers can be formed separately from each other on both sides of the ridge section and on the ridge section. Therefore, when the AlInP layer on the ridge section is removed by etching, an AlInP current constriction layer 13 located on both sides of the ridge section is reliably protected by a resist film and not over-etched. The AlInP current constriction layer 13 effectively puts a current constriction function into effect, so that a semiconductor laser device of low-threshold current and low-power consumption is obtained.
    • 在蚀刻停止层7上形成由p型第二AlGaInP包覆层8,p型GaInP夹层9和p型GaAs覆盖层10构成的脊部。 通过使p型中间层9在宽度方向上突出超过p型第二覆盖层8,在p型中间层9和p型第二覆盖层8之间形成不小于0.13μm的台阶。 通过该步骤,AlInP层可以在脊部两侧和脊部两侧彼此分开形成。 因此,当通过蚀刻去除脊部上的AlInP层时,位于脊部两侧的AlInP电流收缩层13可靠地被抗蚀剂膜保护而不被过度蚀刻。 AlInP电流收缩层13有效地使电流收缩功能起作用,从而获得低阈值电流和低功耗的半导体激光器件。
    • 7. 发明申请
    • Method for manufacturing semiconductor laser device
    • 制造半导体激光器件的方法
    • US20060094141A1
    • 2006-05-04
    • US11262548
    • 2005-10-28
    • Atsuo TsunodaAkiyoshi Sugahara
    • Atsuo TsunodaAkiyoshi Sugahara
    • H01L21/00
    • H01S5/0425B82Y20/00H01S5/2086H01S5/22H01S5/3211H01S5/34326
    • A method for manufacturing a semiconductor laser device is provided in which deformation of a cap layer and a third cladding layer is inhibited and a protruding portion of an intermediate layer is removed. By coating outer peripheral portions facing an intermediate layer of a third cladding layer and an etching stop layer with a resist, inevitably removing at least the third cladding layer, and etching the intermediate layer and a cap layer in a second etching step, a protruding portion of the intermediate layer is removed, and the cap layer is prevented from being etched undesirably, whereby a ridge portion without irregularities with respect to a direction substantially perpendicular to a lamination direction is produced, and increase of an operation voltage and decrease of external differential quantum efficiency are prevented.
    • 提供了一种制造半导体激光器件的方法,其中抑制了盖层和第三覆层的变形,并且去除了中间层的突出部分。 通过涂覆面对第三包覆层的中间层的外周部分和具有抗蚀剂的蚀刻停止层,不可避免地至少去除第三包层,并且在第二蚀刻步骤中蚀刻中间层和覆盖层,突出部分 除去中间层,并且防止盖层被不期望地蚀刻,由此产生相对于基本上垂直于层叠方向的方向没有凹凸的脊部,并且增加操作电压并减小外部微分量子 防止效率。