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1. 发明申请

US20210392802A1 COMPLIANT DIE ATTACH TOOLS, DIE ATTACH SYSTEMS, AND METHODS OF USING THE SAME 有权
公开(公告)号：US20210392802A1
公开(公告)日：2021-12-16
申请号：US17412757
申请日：2021-08-26
申请人： Assembléon B.V.
发明人： Rudolphus H. Hoefs , Roy Brewel , Richard A. Van Der Burg
IPC分类号： H05K13/04 , H01L23/00 , H01L21/67 , H01L21/683
摘要： A die attach system is provided. The die attach system includes: a support structure for supporting a substrate; a die supply source including a plurality of die for attaching to the substrate; and a bond head for bonding a die from the die supply source to the substrate, the bond head including a bond tool having a contact portion for contacting the die during a transfer from the die supply source to the substrate, the bond head including a spring portion engaged with the bond tool such that the spring portion is configured to compress during pressing of the die against the substrate using the contact portion of the bond tool.

2. 发明授权

US09193015B2 Methods for component placement utilizing a counteracting force drive 有权
标题翻译：使用反作用力驱动的部件放置方法
公开(公告)号：US09193015B2
公开(公告)日：2015-11-24
申请号：US13673943
申请日：2012-11-09
申请人： Assembléon B.V.
发明人： Johannes Hubertus Antonius van de Rijdt
IPC分类号： B23P19/02 , B23P11/00 , H05K13/04
CPC分类号： B23P11/00 , H05K13/0404 , H05K13/0406 , H05K13/0452 , Y10T29/49826 , Y10T29/53
摘要： A method for driving a component placement device, the component placement device having a machine frame, component pickup units and a subframe, the first and second component pickup units configured to be movable in a direction of travel, the method comprising: moving at least one of the component pickup unit in the direction of movement relative to the subframe, the component pickup units and the subframe configured for a reactive force to be exerted on the subframe by the moving of the at least one of the component pickup units; determining a counterforce to be exerted against the subframe substantially opposite a direction of the reactive force, the counterforce determined by an auxiliary control unit, wherein the counterforce at least partially counteracts the reactive force; and applying the counterforce to the subframe substantially in the opposite direction of the reactive force by at least one drive unit.
摘要翻译：一种用于驱动部件放置装置的方法，具有机架，部件拾取单元和子框架的部件放置装置，第一和第二部件拾取单元被配置为可在行进方向上移动，该方法包括：移动至少一个所述部件拾取单元和所述子框架被构造成通过所述至少一个所述部件拾取单元的移动而施加在所述子框架上的反作用力; 确定对基本上与所述反作用力的方向相反的所述子框架施加的反作用力，所述反作用力由辅助控制单元确定，其中所述反作用力至少部分抵消所述反作用力; 以及基本上由所述至少一个驱动单元向所述反作用力的相反方向施加所述反作用力。

3. 发明申请

US20210313215A1 DIE ATTACH SYSTEMS, AND METHODS OF ATTACHING A DIE TO A SUBSTRATE 有权
公开(公告)号：US20210313215A1
公开(公告)日：2021-10-07
申请号：US17353368
申请日：2021-06-21
申请人： Assembléon B.V.
发明人： Roy Brewel , Richard A. Van Der Burg , Rudolphus H. Hoefs , Wilhelmus G. Van Sprang
IPC分类号： H01L21/683 , H01L33/62 , H01L25/075
摘要： A die attach system is provided. The die attach system includes: a support structure for supporting a substrate; a die supply source including a plurality of die for attaching to the substrate; a bond head for bonding a die from the die supply source to the substrate, the bond head including a bond tool for contacting the die during a transfer from the die supply source to the substrate; a first motion system for moving the bond head along a first axis; and a second motion system, independent of the first motion system, for moving the bond tool along the first axis.

4. 发明授权

US11069555B2 Die attach systems, and methods of attaching a die to a substrate 有权
公开(公告)号：US11069555B2
公开(公告)日：2021-07-20
申请号：US16556158
申请日：2019-08-29
申请人： Assembléon B.V.
发明人： Roy Brewel , Richard A. Van Der Burg , Rudolphus H. Hoefs , Wilhelmus G. Van Sprang
IPC分类号： H01L21/683 , H01L33/62 , H01L25/075
摘要： A die attach system is provided. The die attach system includes: a support structure for supporting a substrate; a die supply source including a plurality of die for attaching to the substrate; a bond head for bonding a die from the die supply source to the substrate, the bond head including a bond tool for contacting the die during a transfer from the die supply source to the substrate; a first motion system for moving the bond head along a first axis; and a second motion system, independent of the first motion system, for moving the bond tool along the first axis.

5. 发明授权

US11410870B2 Die attach systems, and methods of attaching a die to a substrate 有权
公开(公告)号：US11410870B2
公开(公告)日：2022-08-09
申请号：US17353368
申请日：2021-06-21
申请人： Assembléon B.V.
发明人： Roy Brewel , Richard A. Van Der Burg , Rudolphus H. Hoefs , Wilhelmus G. Van Sprang
IPC分类号： H01L21/683 , H01L33/62 , H01L25/075
摘要： A die attach system is provided. The die attach system includes: a support structure for supporting a substrate; a die supply source including a plurality of die for attaching to the substrate; a bond head for bonding a die from the die supply source to the substrate, the bond head including a bond tool for contacting the die during a transfer from the die supply source to the substrate; a first motion system for moving the bond head along a first axis; and a second motion system, independent of the first motion system, for moving the bond tool along the first axis.

6. 发明申请

US20180063964A1 COMPONENT PLACEMENT DEVICE AS WELL AS A METHOD FOR PICKING UP A COMPONENT AND PLACING A COMPONENT ON A SUBSTRATE 审中-公开
公开(公告)号：US20180063964A1
公开(公告)日：2018-03-01
申请号：US15804141
申请日：2017-11-06
申请人： Assembléon B.V.
发明人： Roy Brewel , Richard Adrianus Johannes van der Burg , Petrus Adrianus Antonius van Hoogstraten
IPC分类号： H05K3/30 , H05K13/08 , H05K13/04
CPC分类号： H05K3/30 , H05K13/0409 , H05K13/08 , Y10T29/4913 , Y10T29/53174
摘要： A component placement device for picking up a component and placing a component on a substrate device comprises a holder which is movable at least in a main direction, as well as a nozzle for picking up a component. The nozzle is movable at least in a direction opposite the main direction relative to the holder. The component placement device comprises a fluid flow channel which opens or closes upon movement of the nozzle in the direction opposite the main direction relative to the holder, detection means for detecting the opening or closing of the fluid flow channel as well as means for controlling the movement of the holder in at least the main direction on the basis of a signal delivered by the detection means concerning the opening or closing of the fluid flow channel.

7. 发明公开

US20230148420A1 DIE ATTACH SYSTEMS, AND METHODS FOR INTEGRATED ACCURACY VERIFICATION AND CALIBRATION USING SUCH SYSTEMS 审中-公开
公开(公告)号：US20230148420A1
公开(公告)日：2023-05-11
申请号：US18092546
申请日：2023-01-03
申请人： Assembléon B.V.
发明人： Alain De Bock , René Bouman
IPC分类号： H01L21/68 , H01L23/00 , H01L23/544 , H01L21/67
CPC分类号： H01L21/681 , H01L24/75 , H01L23/544 , H01L24/83 , H01L21/67144 , H01L2224/8318 , H01L2224/75702 , H01L2224/75753 , H01L2224/75755 , H01L2224/83132 , H01L2224/75001
摘要： A die attach system is provided. The die attach system includes a verification substrate configured to receive a plurality of die, the verification substrate including a plurality of substrate reference markers. The die attach system also includes an imaging system for determining an alignment of the plurality of die with the verification substrate by imaging each of the plurality of die with respective ones of the plurality of substrate reference markers.

8. 发明授权

US11612089B2 Component placement systems and methods of operating the same 有权
公开(公告)号：US11612089B2
公开(公告)日：2023-03-21
申请号：US17541954
申请日：2021-12-03
申请人： Assembléon B.V.
发明人： Roy Brewel , Rudolphus Hendrikus Hoefs , Wilhelmus Gijsbertus Leonardus Van Sprang
IPC分类号： H05K13/04
摘要： A component placement system is provided. The component placement system includes: a first bond head array configured for simultaneously carrying a first plurality of electronic components; a second bond head array configured for simultaneously carrying a second plurality of electronic components; a first motion system for simultaneously carrying the first bond head array and the second bond head array along a first motion axis; and a second motion system for carrying the first bond head array independent of the second bond head array.

9. 发明申请

US20220183198A1 COMPONENT PLACEMENT SYSTEMS AND METHODS OF OPERATING THE SAME 有权
公开(公告)号：US20220183198A1
公开(公告)日：2022-06-09
申请号：US17541954
申请日：2021-12-03
申请人： Assembléon B.V.
发明人： Roy Brewel , Rudolphus Hendrikus Hoefs , Wilhelmus Gijsbertus Leonardus Van Sprang
IPC分类号： H05K13/04
摘要： A component placement system is provided. The component placement system includes: a first bond head array configured for simultaneously carrying a first plurality of electronic components; a second bond head array configured for simultaneously carrying a second plurality of electronic components; a first motion system for simultaneously carrying the first bond head array and the second bond head array along a first motion axis; and a second motion system for carrying the first bond head array independent of the second bond head array.

10. 发明授权

US11134595B2 Compliant die attach systems having spring-driven bond tools 有权
公开(公告)号：US11134595B2
公开(公告)日：2021-09-28
申请号：US16559531
申请日：2019-09-03
申请人： Assembléon B.V.
发明人： Rudolphus H. Hoefs , Roy Brewel , Richard A. Van Der Burg
IPC分类号： H01K13/04 , H01L21/683 , H01L21/67 , H01L23/00 , H05K13/04
摘要： A die attach system is provided. The die attach system includes: a support structure for supporting a substrate; a die supply source including a plurality of die for attaching to the substrate; and a bond head for bonding a die from the die supply source to the substrate, the bond head including a bond tool having a contact portion for contacting the die during a transfer from the die supply source to the substrate, the bond head including a spring portion engaged with the bond tool such that the spring portion is configured to compress during pressing of the die against the substrate using the contact portion of the bond tool.

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