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    • 5. 发明授权
    • Chip resistant coatings and methods of application
    • 耐芯片涂层和应用方法
    • US5066733A
    • 1991-11-19
    • US556681
    • 1990-07-23
    • Jonathan T. MartzThomas W. KellyRostyslaw DowbenkoJames A. MeierAnthony C. Palermo
    • Jonathan T. MartzThomas W. KellyRostyslaw DowbenkoJames A. MeierAnthony C. Palermo
    • B05D1/36C08F299/06C08G18/67
    • C08F299/065B05D7/542C08G18/671
    • Disclosed is a liquid coating composition, useful for making a chip resistant coating, comprising a binder of: a first and a second urethane resin each containing terminal, reactive ethylenically unsaturated groups. Each urethane resin is prepared by reacting components comprising (A) an isocyanate-terminated prepolymer which is the product of reacting an organic polyisocyanate with an organic polyol with (B) an isocyanate reactive group-containing unsaturated monomer selected from hydroxyalkyl acrylates, hydroxyalkyl methacrylates and hydroxyalkyl acrylamides. The organic polyol for the first urethane resin has a hydroxyl functionality of 3 or more; the organic polyol for the second urethane resin has a hydroxyl functionality of less than three; and the average functionality of the polyols utilized for the first and second urethane resins is less than three.Also disclosed is a method of making a cured chip resistant, coating.
    • 公开了一种可用于制造耐芯片涂层的液体涂料组合物,其包含粘合剂,第一和第二聚氨酯树脂各自含有末端,反应性烯属不饱和基团。 每个聚氨酯树脂通过使包含(A)异氰酸酯封端的预聚物(其是有机多异氰酸酯与有机多元醇反应的产物)与(B)含异氰酸酯反应性基团的不饱和单体的选自丙烯酸羟烷基酯,甲基丙烯酸羟烷基酯和 羟烷基丙烯酰胺。 第一聚氨酯树脂的有机多元醇的羟基官能度为3以上; 第二聚氨酯树脂的有机多元醇的羟基官能度小于3; 并且用于第一和第二聚氨酯树脂的多元醇的平均官能度小于3。 还公开了一种制造耐固化芯片的涂层的方法。