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1. 发明申请

US20100078779A1 System on a Chip with On-Chip RF Shield 有权
标题翻译：片上阵列RF屏蔽系统
公开(公告)号：US20100078779A1
公开(公告)日：2010-04-01
申请号：US12242698
申请日：2008-09-30
申请人： Hans-Joachim Barth , Andre Hanke , Snezana Jenei , Oliver Nagy , Jiro Morinaga , Bernd Adler , Heinrich Koerner
发明人： Hans-Joachim Barth , Andre Hanke , Snezana Jenei , Oliver Nagy , Jiro Morinaga , Bernd Adler , Heinrich Koerner
IPC分类号： H01L23/552 , H01L21/71
CPC分类号： H01L21/71 , H01L23/49822 , H01L23/552 , H01L23/585 , H01L23/66 , H01L2224/05572 , H01L2224/05573 , H01L2224/056 , H01L2224/16225 , H01L2224/16227 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： Structures of a system on a chip are disclosed. In one embodiment, the system on a chip (SoC) includes an RF component disposed on a first part of a substrate, a semiconductor component disposed on a second part of the substrate, the semiconductor component and the RF component sharing a common boundary, and a conductive cage disposed enclosing the RF component. The conductive cage shields the semiconductor component from electromagnetic radiation originating from the RF circuit.
摘要翻译：公开了一种芯片上的系统的结构。在一个实施例中，芯片上的系统（SoC）包括设置在基板的第一部分上的RF部件，设置在基板的第二部分上的半导体部件，共享公共边界的半导体部件和RF部件，以及布置成围绕RF部件的导电笼。导电笼罩半导体元件不受来自RF电路的电磁辐射。

2. 发明申请

US20090274202A1 SYSTEM PARTITIONING FOR MULTI-MOBILE DEVICES 失效
标题翻译：多移动设备的系统分区
公开(公告)号：US20090274202A1
公开(公告)日：2009-11-05
申请号：US12112596
申请日：2008-04-30
申请人： Andre Hanke , Bernd Adler
发明人： Andre Hanke , Bernd Adler
IPC分类号： H04B1/40
CPC分类号： H04W88/06
摘要： A communication device partition for multiple device data standards to be received on one baseband integrated circuit is described. At least two interfaces are partitioned according to the data rate speed of various types of data standards and coupled to a multimode SDR modem. A digital baseband processor is coupled to the multimode SDR modem and receives the various types of application data compliant with various data standards.
摘要翻译：描述在一个基带集成电路上接收多个设备数据标准的通信设备分区。至少两个接口根据各种数据标准的数据速率进行分区，并耦合到多模SDR调制解调器。数字基带处理器耦合到多模SDR调制解调器，并接收符合各种数据标准的各种类型的应用数据。

3. 发明申请

US20090060011A1 REUSE OF DIGITAL INTERFACE FOR MULTIPLE COMPONENTS 有权
标题翻译：多个组件的数字接口的重用
公开(公告)号：US20090060011A1
公开(公告)日：2009-03-05
申请号：US11845449
申请日：2007-08-27
申请人： Andre Hanke , Bernd Adler
发明人： Andre Hanke , Bernd Adler
IPC分类号： H04B1/40 , H04L27/00
CPC分类号： H04B7/0822 , H04L25/0264 , H04L25/0292 , H04L67/12
摘要： In one embodiment, a circuit can selectively adjust a current for driving a load. The circuit includes a sensor configured to measure a magnetic field associated with the current and provide a sensor voltage representative thereof. A control circuit is configured to selectively adjust the current as a function of the sensor voltage and a time-varying voltage threshold. Other methods and systems are also disclosed.
摘要翻译：在一个实施例中，电路可以选择性地调节用于驱动负载的电流。电路包括被配置为测量与电流相关联的磁场并提供代表其的传感器电压的传感器。控制电路被配置为根据传感器电压和时变电压阈值来选择性地调节电流。还公开了其它方法和系统。

4. 发明申请

US20070206702A1 Modulation device for a transmission path, method for signal processing in a transmission path, and transmission path having the modulation device 有权
标题翻译：用于传输路径的调制装置，传输路径中的信号处理方法和具有调制装置的传输路径
公开(公告)号：US20070206702A1
公开(公告)日：2007-09-06
申请号：US11709004
申请日：2007-02-21
申请人： Bernd Adler , Andre Hanke
发明人： Bernd Adler , Andre Hanke
IPC分类号： H04L27/00
CPC分类号： H03C5/00 , H03C3/40
摘要： A modulation device includes a signal input for receiving a data stream to be modulated and a first and a second signal output. At least one first complex component is derived from the data stream in a coding device. A first and a second high-frequency signal are output via the signal outputs. The first and second high-frequency signals are derived from the at least one first complex component and are distinguished by the fact that the second high-frequency signal has a phase shift of substantially 90° with respect to the first high-frequency signal.
摘要翻译：调制装置包括用于接收要调制的数据流的信号输入和第一和第二信号输出。至少一个第一复合分量是从编码设备中的数据流导出的。通过信号输出输出第一和第二高频信号。第一和第二高频信号从至少一个第一复合分量导出，并且通过第二高频信号相对于第一高频信号具有大致90°的相移的事实来区分。

5. 发明申请

US20050113056A1 Signal conditioning circuit 有权
标题翻译：信号调理电路
公开(公告)号：US20050113056A1
公开(公告)日：2005-05-26
申请号：US10947963
申请日：2004-09-23
申请人： Dietolf Seippel , Andre Hanke , Duyen Pham-Stabner
发明人： Dietolf Seippel , Andre Hanke , Duyen Pham-Stabner
IPC分类号： H03B27/00 , H03K21/00 , H04N9/77 , H04N9/79 , H04N17/00
CPC分类号： H03B27/00
摘要： A signal conditioning circuit contains an oscillator which is connected to the inputs of two mixers. The output of one mixer is coupled, so as to form a feedback path, to a frequency divider circuit whose first output is coupled to the second input of the first mixer. A second signal output of the frequency divider circuit carries a signal with a phase shift of 90 degrees with respect to the signal at the first signal output of the frequency divider circuit. The second signal is supplied to a second input of the second mixer. Feedback results in undesirable signal components in the in-phase and quadrature components being suppressed. At the same time, the in-phase and quadrature components have a fixed phase relationship with respect to one another. The signal conditioning circuit allows desired non-integer division ratios to be achieved.
摘要翻译：信号调理电路包含连接到两个混频器输入端的振荡器。将一个混频器的输出端耦合到一个分频器电路，以形成一个反馈路径，该分频器电路的第一个输出耦合到第一个混频器的第二个输入端。分频器电路的第二信号输出相对于分频器电路的第一信号输出处的信号携带相对于90度的相移的信号。第二信号被提供给第二混频器的第二输入端。反馈导致同相和正交分量中不期望的信号分量被抑制。同时，同相和正交分量相对于彼此具有固定的相位关系。信号调理电路允许实现期望的非整数分频比。

6. 发明申请

US20050085105A1 Arrangement for producing an electrical connection between a BGA package and a signal source, and method for producing such a connection 失效
标题翻译：用于产生BGA封装和信号源之间的电连接的布置以及用于产生这种连接的方法
公开(公告)号：US20050085105A1
公开(公告)日：2005-04-21
申请号：US10944537
申请日：2004-09-17
申请人： Andre Hanke , Stephan Dobritz
发明人： Andre Hanke , Stephan Dobritz
IPC分类号： G01R31/26 , G01R1/04 , G01R31/28 , H01R13/22 , H01R33/76 , H05K1/11 , H05K3/28 , H05K3/32 , H05K3/40 , H01R12/00
CPC分类号： H01R13/22 , G01R1/0483 , H01L2924/0002 , H05K1/118 , H05K3/28 , H05K3/325 , H05K3/4007 , H05K3/4015 , H05K2201/10734 , H05K2201/2009 , H05K2203/167 , H01L2924/00
摘要： An arrangement for producing an electrical connection between a ball grid array (BGA) package and a signal source is disclosed. A flexible printed circuit board (PCB) has conductor (e.g., copper) tracks arranged between flexible plastic layers. A contact receptacle with guide elements for the BGA package is located over a portion of the flexible PCB. Contact structures are electrically coupled to the conductor tracks of the flexible PCB and accessible via the contact receptacle. The contact structures serve for providing an electrical contact-connection of terminals of a BGA package placed in the receptacle. The contact structures comprise column- or sleeve-shaped contact elements that extend through the flexible PCB and project upwards on one side from one of the flexible plastic layers.
摘要翻译：公开了一种用于在球栅阵列（BGA）封装和信号源之间产生电连接的装置。柔性印刷电路板（PCB）具有布置在柔性塑料层之间的导体（例如，铜）轨道。具有用于BGA封装的引导元件的接触插座位于柔性PCB的一部分上方。接触结构电耦合到柔性PCB的导体轨道并且经由接触插座可接近。接触结构用于提供放置在容器中的BGA封装的端子的电接触连接。接触结构包括延伸穿过柔性PCB并从一个柔性塑料层的一侧向上突出的柱形或套筒状接触元件。

7. 发明申请

US20050063490A1 Demodulator and demodulation method for demodulating received signals 有权
标题翻译：用于解调接收信号的解调器和解调方法
公开(公告)号：US20050063490A1
公开(公告)日：2005-03-24
申请号：US10485975
申请日：2002-06-07
申请人： Christian Grewing , Markus Hammes , Andre Hanke , Stefan Waasen
发明人： Christian Grewing , Markus Hammes , Andre Hanke , Stefan Waasen
IPC分类号： H03D3/00
CPC分类号： H03D3/007
摘要： The invention relates to a demodulator and also a demodulation method and enables a reliable demodulation even when the intermediate frequency range overlaps the range of the data frequencies of the signal. For this purpose, a rapidly oscillating output signal is generated from the in-phase signal and also the quadrature signal, the sign of which output signal varies in a manner dependent on the product of the signs of the in-phase signal and of the quadrature signal. Either an XOR gate or a multiplier stage may be used in order to generate an output signal of this type.
摘要翻译：本发明涉及解调器和解调方法，并且即使当中间频率范围与信号的数据频率的范围重叠时也能够进行可靠的解调。为此，从同相信号和正交信号产生快速振荡的输出信号，其输出信号的符号以取决于同相信号和正交信号的符号的乘积的方式变化信号。为了产生这种类型的输出信号，可以使用异或门或乘法器级。

8. 发明授权

US08085834B2 System partitioning for multi-mobile devices 失效
标题翻译：多移动设备的系统分区
公开(公告)号：US08085834B2
公开(公告)日：2011-12-27
申请号：US12112596
申请日：2008-04-30
申请人： Andre Hanke , Bernd Adler
发明人： Andre Hanke , Bernd Adler
IPC分类号： H04B1/38
CPC分类号： H04W88/06
摘要： A communication device partition for multiple device data standards to be received on one baseband integrated circuit is described. At least two interfaces are partitioned according to the data rate speed of various types of data standards and coupled to a multimode software define radio (SDR) modem. A digital baseband processor is coupled to the multimode SDR modem and receives the various types of application data compliant with various data standards.
摘要翻译：描述在一个基带集成电路上接收多个设备数据标准的通信设备分区。至少两个接口根据各种数据标准的数据速率进行分区，并耦合到多模式软件定义无线电（SDR）调制解调器。数字基带处理器耦合到多模SDR调制解调器，并接收符合各种数据标准的各种类型的应用数据。

9. 发明申请

US20100032800A1 Capacitor Structure 有权
标题翻译：电容结构
公开(公告)号：US20100032800A1
公开(公告)日：2010-02-11
申请号：US12187407
申请日：2008-08-07
申请人： Andre HANKE , Oliver NAGY
发明人： Andre HANKE , Oliver NAGY
IPC分类号： H01L29/92
CPC分类号： H01L28/40 , H01L23/481 , H01L27/0805 , H01L28/60 , H01L28/91 , H01L2924/0002 , H01L2924/00
摘要： One or more embodiments relate to a semiconductor device, comprising: a substrate; and a plurality of first conductive vias, the first conductive vias electrically coupled together, each of the first conductive vias passing through the substrate; and a plurality of second conductive vias, the second conductive vias electrically coupled together, each of the second conductive vias passing through the substrate, the second conductive vias spacedly disposed from the first conductive vias.
摘要翻译：一个或多个实施例涉及半导体器件，包括：衬底; 以及多个第一导电通孔，所述第一导电通孔电耦合在一起，每个所述第一导电通孔穿过所述基板; 以及多个第二导电通孔，所述第二导电通孔电耦合在一起，每个所述第二导电通孔穿过所述基板，所述第二导电通孔与所述第一导电通孔间隔开设置。

10. 发明申请

US20090083977A1 Method for Filling Via Holes in Semiconductor Substrates 审中-公开
标题翻译：半导体基板中填充孔的方法
公开(公告)号：US20090083977A1
公开(公告)日：2009-04-02
申请号：US11864396
申请日：2007-09-28
申请人： Andre Hanke , Helmuth Hermann , Michael Dunkel
发明人： Andre Hanke , Helmuth Hermann , Michael Dunkel
IPC分类号： H05K3/42
CPC分类号： H01L21/76898 , Y10T29/49165
摘要： A method for filling either blind or through via holes in a semiconductor substrate involves the use of dielectric or conductive polymer paste, and a drying and a curing process of the polymer paste.
摘要翻译：用于填充半导体衬底中的盲孔或通孔的方法包括使用电介质或导电聚合物糊，以及聚合物糊的干燥和固化过程。

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