专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US09780078B2 Method for producing optoelectronic semiconductor devices and optoelectronic semiconductor device 有权
公开(公告)号：US09780078B2
公开(公告)日：2017-10-03
申请号：US15029241
申请日：2014-09-02
申请人： OSRAM Opto Semiconductors GmbH
发明人： Lutz Hoeppel
IPC分类号： H01L33/00 , H01L25/16 , H01L31/02 , H01L33/62 , H01L27/02 , H01L31/0304 , H01L31/18 , H01L33/32 , H01L33/48
CPC分类号： H01L25/167 , H01L27/0248 , H01L31/02002 , H01L31/02005 , H01L31/03044 , H01L31/1852 , H01L31/1876 , H01L33/0066 , H01L33/0079 , H01L33/0095 , H01L33/32 , H01L33/486 , H01L33/62 , H01L2924/0002 , H01L2933/0066
摘要： The invention relates to a method for producing a plurality of optoelectronic semiconductor components (1), comprising the following steps: a) providing a semiconductor layer sequence (2) having a plurality of semiconductor body regions (200); b) providing a plurality of carrier bodies (3), which each have a first contact structure (31) and a second contact structure (32); c) forming a composite (4) having the semiconductor layer sequence and the carrier bodies in such a way that adjacent carrier bodies are separated from one another by interspaces (35) and each semiconductor body area is electrically conductive connected to the first contact structure and the second contact structure of the associated carrier body; and d) separating the composite into the plurality of semiconductor components, wherein the semiconductor components each have a semiconductor body (20) and a carrier body. The invention further relates to an optoelectronic semiconductor component (1).

2. 发明授权

US09577165B2 Light emitting diode chip 有权
标题翻译：发光二极管芯片
公开(公告)号：US09577165B2
公开(公告)日：2017-02-21
申请号：US14240443
申请日：2012-08-23
申请人： Korbinian Perzlmaier , Kai Gehrke , Robert Walter , Karl Engl , Guido Weiss , Markus Maute , Stefanie Rammelsberger
发明人： Korbinian Perzlmaier , Kai Gehrke , Robert Walter , Karl Engl , Guido Weiss , Markus Maute , Stefanie Rammelsberger
IPC分类号： H01L33/60 , H01L33/40 , H01L33/42 , H01L33/56 , H01L33/38
CPC分类号： H01L33/60 , H01L33/382 , H01L33/405 , H01L33/42 , H01L33/56 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： A light emitting diode chip includes a semiconductor layer sequence having an active layer that generates electromagnetic radiation, wherein the light emitting diode chip has a radiation exit area at a front side, the light emitting diode chip has a mirror layer at least in regions at a rear side situated opposite the radiation exit area, said mirror layer containing silver, a protective layer is arranged on the mirror layer, and the protective layer comprises a transparent conductive oxide.
摘要翻译：发光二极管芯片包括具有产生电磁辐射的有源层的半导体层序列，其中发光二极管芯片在前侧具有辐射出射区域，发光二极管芯片至少在一个背面位于辐射出口区域的对面，所述镜面层含有银，保护层设置在镜面层上，保护层包括透明导电氧化物。

3. 发明授权

US09530951B2 Optoelectronic device 有权
标题翻译：光电器件
公开(公告)号：US09530951B2
公开(公告)日：2016-12-27
申请号：US14784945
申请日：2014-04-10
申请人： OSRAM Opto Semiconductors GmbH
发明人： Juergen Moosburger
IPC分类号： H01L33/00 , H01L33/64 , H01L33/48 , H01L33/62
CPC分类号： H01L33/641 , H01L24/48 , H01L33/486 , H01L33/62 , H01L33/647 , H01L2224/48091 , H01L2224/48464 , H01L2924/00014 , H01L2933/0033 , H01L2933/0066 , H01L2933/0075 , H01L2224/05599 , H01L2224/45099 , H01L2224/85399
摘要： A method for producing an optoelectronic device comprises steps for providing a package with a first surface and a second surface, wherein an electrically conductive chip carrier is embedded in the package and is accessible at the first surface and at the second surface, and for applying an insulation layer on the second surface of the package by means of aerosol deposition.
摘要翻译：一种用于制造光电子器件的方法包括用于提供具有第一表面和第二表面的封装的步骤，其中导电芯片载体被嵌入封装中并且可在第一表面和第二表面处接近，并且用于施加通过气溶胶沉积在包装的第二表面上的绝缘层。

4. 发明授权

US09520539B2 Optoelectronic component and method for the production thereof 有权
标题翻译：光电元件及其制造方法
公开(公告)号：US09520539B2
公开(公告)日：2016-12-13
申请号：US14784879
申请日：2014-04-04
申请人： OSRAM Opto Semiconductors GmbH
发明人： Martin Brandl , Michael Zitzlsperger
IPC分类号： H01L33/00 , H01L33/48 , H01L33/62 , H01L33/56
CPC分类号： H01L33/483 , H01L33/56 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00
摘要： An optoelectronic component includes a plastics housing, wherein a first leadframe section is embedded into the plastics housing, a chip landing face and a soldering contact face of the first leadframe section are at least partly not covered by the plastics housing, the soldering contact face has a groove, and the groove is not covered by the material of the plastics housing.
摘要翻译：光电子部件包括塑料壳体，其中第一引线框架部分嵌入到塑料壳体中，第一引线框架部分的芯片着陆面和焊接接触面至少部分地不被塑料壳体覆盖，焊接接触面具有凹槽，并且凹槽不被塑料外壳的材料覆盖。

5. 发明授权

US09472923B2 Laser component and method for the production thereof 有权
标题翻译：激光组件及其制造方法
公开(公告)号：US09472923B2
公开(公告)日：2016-10-18
申请号：US14780846
申请日：2014-03-25
申请人： OSRAM Opto Semiconductors GmbH
发明人： Tilman Eckert
IPC分类号： H01S5/00 , H01S5/022 , G02B7/02 , G02B27/09
CPC分类号： H01S5/02252 , G02B7/025 , G02B27/0966 , H01L2224/48091 , H01L2224/73265 , H01S5/02208 , H01S5/02272 , H01S5/02288 , H01L2924/00014
摘要： A laser component includes a carrier having a lens carrier surface and a chip carrier surface raised relative to the lens carrier surface, wherein an optical lens is arranged on the lens carrier surface, a laser chip is arranged on the chip carrier surface, the chip carrier surface and the lens carrier surface are formed by materially uniformly continuous sections of the carrier, the carrier includes a plastic material, and the laser component is configured as a surface-mountable SMD component.
摘要翻译：激光器部件包括具有透镜载体表面和相对于透镜载体表面升高的芯片载体表面的载体，其中光学透镜布置在透镜载体表面上，激光芯片布置在芯片载体表面上，芯片载体表面和透镜载体表面由载体的物质均匀连续的部分形成，载体包括塑料材料，并且激光组件被配置为可表面安装的SMD部件。

6. 发明授权

US09472534B2 Method of arranging a multiplicity of LEDs in packaging units, and packaging unit including a multiplicity of LEDs 有权
标题翻译：在封装单元中布置多个LED的方法以及包括多个LED的封装单元
公开(公告)号：US09472534B2
公开(公告)日：2016-10-18
申请号：US15099783
申请日：2016-04-15
申请人： OSRAM Opto Semiconductors GmcH
发明人： Alexander Wilm , Roland Schulz , Felix Michel
IPC分类号： H01L33/48 , H01L25/075 , H01L21/66
CPC分类号： H01L25/0753 , F21K9/90 , H01L22/24 , H01L22/26 , H01L27/156 , H01L33/0095 , H01L33/48 , H01L2933/0033
摘要： A method of arranging a multiplicity of LEDs in packaging units includes defining a desired range for at least one photometric measurement variable for each of the packaging units; selecting an LED from the multiplicity of LEDs not yet arranged in one of the packaging units; measuring the at least one photometric measurement variable for the selected LED; equipping one of the packaging units containing fewer than N−1 LEDs with the selected LED; storing a measured value and a position of the selected LED in the packaging unit in a memory; repeating until the packaging units are equipped with N−1 LEDs; repeating and calculating the average value of the photometric measurement variable, equipping a packaging unit for which the calculated average value of the variable lies in a defined range with the selected LED; and storing the measured value and the position of the selected LED.
摘要翻译：在包装单元中布置多个LED的方法包括为每个包装单元定义至少一个测光测量变量的期望范围; 从尚未布置在一个包装单元中的多个LED选择LED; 测量所选择的LED的至少一个测光测量变量; 配备一个包含少于N-1个LED的包装单元与选定的LED; 将所选择的LED的测量值和位置存储在存储器中; 直到包装单元配备有N-1个LED; 重复并计算测光测量变量的平均值，将所计算的变量的平均值位于与所选择的LED的限定范围内的包装单元; 并存储所选择的LED的测量值和位置。

7. 发明授权

US09147806B2 Optoelectronic semiconductor chip, method of fabrication and application in an optoelectronic component 有权
标题翻译：光电子半导体芯片，制造和应用于光电子器件的方法
公开(公告)号：US09147806B2
公开(公告)日：2015-09-29
申请号：US13825156
申请日：2011-09-15
申请人： Bernd Böhm , Gertrud Kräuter , Andreas Plöβl
发明人： Bernd Böhm , Gertrud Kräuter , Andreas Plöβl
IPC分类号： H01L33/22 , H01L33/44 , H01L31/0236 , H01L31/054
CPC分类号： H01L33/22 , H01L31/0236 , H01L31/02366 , H01L31/054 , H01L33/44 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2933/0091 , Y02E10/52 , H01L2924/00014 , H01L2924/00
摘要： An optoelectronic semiconductor chip includes an active layer with a first and a second major face, including a semiconductor material which emits or receives radiation when the semiconductor chip is in operation; a patterned layer including three-dimensional patterns for outcoupling or incoupling radiation and arranged on the first major face in a beam path of the radiation, wherein the patterned layer includes an inorganic-organic hybrid material.
摘要翻译：光电半导体芯片包括具有第一和第二主面的有源层，包括当半导体芯片工作时发射或接收辐射的半导体材料; 包括用于输出耦合或去耦辐射的三维图案并且布置在辐射的光束路径中的第一主面上的图案层，其中所述图案化层包括无机 - 有机杂化材料。

8. 发明授权

US09048393B2 Optoelectronic component 有权
标题翻译：光电元件
公开(公告)号：US09048393B2
公开(公告)日：2015-06-02
申请号：US13377910
申请日：2010-05-28
申请人： Michael Zitzlsperger , Eckhard Ditzel , Jörg Erich Sorg
发明人： Michael Zitzlsperger , Eckhard Ditzel , Jörg Erich Sorg
IPC分类号： H01L33/58 , H01L33/48 , H01L33/52 , H01L33/54 , H01L33/38
CPC分类号： H01L33/486 , H01L33/38 , H01L33/52 , H01L33/54 , H01L2224/48091 , H01L2924/00014
摘要： An optoelectronic component including a connection carrier including an electrically insulating film at a top side of the connection carrier, an optoelectronic semiconductor chip at the top side of the connection carrier, a cutout in the electrically insulating film which encloses the optoelectronic semiconductor chip, and a potting body surrounding the optoelectronic semiconductor chip, wherein a bottom area of the cutout is formed at least regionally by the electrically insulating film, the potting body extends at least regionally as far as an outer edge of the cutout facing the optoelectronic semiconductor chip, and the cutout is at least regionally free of the potting body.
摘要翻译：一种光电子部件，包括在连接载体的顶侧包括电绝缘膜的连接载体，在连接载体的顶侧的光电半导体芯片，包围光电半导体芯片的电绝缘膜中的切口，以及灌封体围绕光电子半导体芯片，其中，所述切口的底部区域至少由所述电绝缘膜区域形成，所述灌封体至少在区域上延伸至所述切口的面向所述光电半导体芯片的外边缘，并且切口至少在区域上没有灌封体。

9. 发明授权

US08981238B2 Electronic device 有权
标题翻译：电子设备
公开(公告)号：US08981238B2
公开(公告)日：2015-03-17
申请号：US13382698
申请日：2010-06-22
申请人： Michael Zitzlsperger , Stefan Grötsch
发明人： Michael Zitzlsperger , Stefan Grötsch
IPC分类号： H01L23/48 , H05K9/00 , H05K3/34 , H01L33/48 , H01L33/62
CPC分类号： H05K1/181 , H01L31/0203 , H01L33/486 , H01L33/62 , H01L2224/16057 , H01L2224/16105 , H01L2224/48091 , H01L2224/48247 , H05K3/3442 , H05K2201/09181 , H05K2201/10106 , H05K2201/1084 , Y02P70/613 , H01L2924/00012 , H01L2924/00014
摘要： An electronic device includes a base body, which has a top side and also an underside lying opposite the top side. The base body has connection locations at its underside. An electronic component is arranged at the base body at the top side of the base body. The base body has at least one side area having at least one point of inspection having a first region and second region. The second region is embodied as an indentation in the first region. The first and the second region contain different materials.
摘要翻译：电子设备包括基体，该基体具有顶侧，并且还具有与顶侧相对的下侧。基体在其下侧具有连接位置。在基体的顶侧设置有电子部件。基体具有至少一个具有至少一个检查点的侧面区域，具有第一区域和第二区域。第二个地区体现为第一个地区的缩进。第一和第二区域包含不同的材料。

10. 发明授权

US08927325B2 Method for producing an organic radiation-emitting component and organic radiation-emitting component 有权
标题翻译：用于制造有机辐射发射部件和有机辐射发射部件的方法
公开(公告)号：US08927325B2
公开(公告)日：2015-01-06
申请号：US13062449
申请日：2009-08-10
申请人： Christoph Gaerditz , Ralph Paetzold
发明人： Christoph Gaerditz , Ralph Paetzold
IPC分类号： H01L21/00
CPC分类号： H01L51/445 , H01L21/31683 , H01L51/5206 , H01L51/5212 , H01L2251/308 , Y02E10/549 , Y02P70/521
摘要： A method for producing an organic radiation-emitting component is specified, which comprises, in particular, the following method steps: A) providing a first electrode layer (2) on a substrate (1), B) applying a structured electrically conductive layer (3) on the first electrode layer (2), wherein the electrically conductive layer (3) comprises a metal, C) producing an electrically insulating layer (4) comprising an oxide of the metal of the electrically conductive layer (3) on surfaces (31) of the electrically conductive layer (3) which are remote from the first electrode layer (2) by oxidation of the metal, D) applying at least one organic functional layer (5) on the first electrode layer (2) and the electrically insulating layer (4), and E) applying a second electrode layer (9) on the at least one organic functional layer (5). An organic radiation-emitting component is furthermore specified.
摘要翻译：具体地说，包括以下方法步骤：A）在基板（1）上设置第一电极层（2），B）将结构化的导电层（ 3）在第一电极层（2）上，其中导电层（3）包括金属，C）产生电绝缘层（4），其包括表面上的导电层（3）的金属的氧化物通过金属氧化远离第一电极层（2）的导电层（3）31），D）在第一电极层（2）上施加至少一个有机功能层（5）绝缘层（4），以及E）在所述至少一个有机功能层（5）上施加第二电极层（9）。此外还规定了有机辐射发射组分。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式