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1. 发明授权

US09048393B2 Optoelectronic component 有权
标题翻译：光电元件
公开(公告)号：US09048393B2
公开(公告)日：2015-06-02
申请号：US13377910
申请日：2010-05-28
申请人： Michael Zitzlsperger , Eckhard Ditzel , Jörg Erich Sorg
发明人： Michael Zitzlsperger , Eckhard Ditzel , Jörg Erich Sorg
IPC分类号： H01L33/58 , H01L33/48 , H01L33/52 , H01L33/54 , H01L33/38
CPC分类号： H01L33/486 , H01L33/38 , H01L33/52 , H01L33/54 , H01L2224/48091 , H01L2924/00014
摘要： An optoelectronic component including a connection carrier including an electrically insulating film at a top side of the connection carrier, an optoelectronic semiconductor chip at the top side of the connection carrier, a cutout in the electrically insulating film which encloses the optoelectronic semiconductor chip, and a potting body surrounding the optoelectronic semiconductor chip, wherein a bottom area of the cutout is formed at least regionally by the electrically insulating film, the potting body extends at least regionally as far as an outer edge of the cutout facing the optoelectronic semiconductor chip, and the cutout is at least regionally free of the potting body.
摘要翻译：一种光电子部件，包括在连接载体的顶侧包括电绝缘膜的连接载体，在连接载体的顶侧的光电半导体芯片，包围光电半导体芯片的电绝缘膜中的切口，以及灌封体围绕光电子半导体芯片，其中，所述切口的底部区域至少由所述电绝缘膜区域形成，所述灌封体至少在区域上延伸至所述切口的面向所述光电半导体芯片的外边缘，并且切口至少在区域上没有灌封体。

2. 发明授权

US09756730B2 Chip-integrated through-plating of multi-layer substrates 有权
公开(公告)号：US09756730B2
公开(公告)日：2017-09-05
申请号：US13883154
申请日：2011-10-21
申请人： Andreas Steffen Klein , Eckhard Ditzel , Frank Krüger , Michael Schumann
发明人： Andreas Steffen Klein , Eckhard Ditzel , Frank Krüger , Michael Schumann
IPC分类号： H05K1/18 , H01L23/13 , H01L23/36 , H01L33/60 , H01L23/00 , H05K3/00 , H01L33/48 , H05K3/40
CPC分类号： H05K1/183 , H01L23/13 , H01L23/36 , H01L24/32 , H01L33/486 , H01L33/60 , H01L2224/29339 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/83385 , H01L2224/8384 , H01L2924/12042 , H01L2924/14 , H05K3/00 , H05K3/4084 , H05K2201/0355 , H05K2201/10106 , H05K2201/2054 , H05K2203/0278 , H05K2203/049 , H05K2203/063 , H05K2203/1484 , Y10T29/49002 , H01L2924/00014 , H01L2924/00
摘要： A laminate and method for producing the laminate are provided for contacting at least one electronic component. An insulating layer is laminated between first and second metal layers electrically contacted to each other in at least one contact region. At least one recess in the contact region is generated with at least one embossing and/or bulging in the first metal layer. The distance between the two metal layers is reduced, such that dimensions of the embossing/bulging are sufficient for taking up the electronic component, which is inserted and connected into the embossing/bulging in a conductive manner therein. The electronic component is taken up in the embossing/bulging entirely with respect to its circumference and at least partly with respect to the height (H) of the electronic component. The laminate may be used as a circuit board, sensor, LED lamp, mobile phone component, control, or regulator.

3. 发明申请

US20080220202A1 LAMINATED SUBSTRATES FOR MOUNTING ELECTRONIC PARTS AND METHODS FOR MAKING SAME 失效
标题翻译：用于安装电子部件的层压基板及其制造方法
公开(公告)号：US20080220202A1
公开(公告)日：2008-09-11
申请号：US12047353
申请日：2008-03-13
申请人： Eckhard DITZEL , Siegfried WALTER , Manfred GRESCH
发明人： Eckhard DITZEL , Siegfried WALTER , Manfred GRESCH
IPC分类号： B32B3/00 , B32B37/00
CPC分类号： H05K3/0097 , H01L23/49861 , H01L2924/0002 , H05K1/0393 , H05K3/0052 , H05K3/202 , H05K3/4084 , H05K3/4092 , H05K2201/0397 , H05K2203/1545 , Y10T156/1049 , Y10T428/24008 , Y10T428/24281 , Y10T428/24289 , H01L2924/00
摘要： A method is provided for producing a laminated substrate for mounting semiconductor chips. At least respective metal and plastic structure films having respective different recurrent contours are laminated together in such a way that a material strip is obtained. The lamination is followed by perforations or cuttings, and the method includes at least one of the following steps: A. the films are structured in such a way that superposition thereof makes it possible to obtain the areas which are devoid of overlap through the total width thereof; B. the films are not laminated through the total width of the laminate in partly recurrent areas; and C. recurrent segments of the recurrent contours are bent out of the surface of the laminated strip starting from the laminate.
摘要翻译：提供了一种用于制造用于安装半导体芯片的层叠基板的方法。具有各自不同轮廓轮廓的至少相应的金属和塑料结构膜以获得材料条的方式层压在一起。层叠之后是穿孔或切割，并且该方法包括以下步骤中的至少一个：A.膜以这样的方式构造，使得其叠加使得可以通过总宽度获得没有重叠的区域的; B.在部分复发区域中，薄膜不层压在层压板的总宽度上; 并且复制轮廓的C.复发段从层压板开始从层压带的表面弯曲出来。

4. 发明授权

US5496140A Blind rivets and method for its manufacture 失效
标题翻译：盲铆钉及其制造方法
公开(公告)号：US5496140A
公开(公告)日：1996-03-05
申请号：US352244
申请日：1994-12-08
申请人： Richard Gossmann , Eckhard Ditzel
发明人： Richard Gossmann , Eckhard Ditzel
IPC分类号： B21K1/60 , F16B5/04 , F16B19/08 , F16B19/10 , F16B13/04 , B21K1/44 , F16B13/06
CPC分类号： F16B19/1054 , B21K1/60
摘要： A blind rivet includes a mandrel shaft having a head disposed at one axial end. A hollow rivet shell has a cylindrical shape including an inner cylindrical surface and an outer cylindrical surface. The rivet shell surrounds the mandrel shaft. The outer cylindrical surface has at least one attenuation groove, which includes at least two recesses. Each recess has a bottom surface that substantially forms a secant with respect to the outer cylindrical surface. A method of manufacturing a blind rivet comprises the steps of placing a mandrel shaft having a head within a hollow rivet shell, producing at least one attenuation groove in an outer cylindrical surface of the rivet shell after the placing step so that at least two recesses are formed. Each of the recesses has a bottom surface that substantially forms a secant with respect to the outer cylindrical surface.
摘要翻译：盲铆钉包括具有设置在一个轴向端部的头部的心轴轴。中空铆钉外壳具有包括内圆柱形表面和外圆柱形表面的圆柱形形状。铆钉壳围绕心轴。外圆柱形表面具有至少一个衰减槽，其包括至少两个凹槽。每个凹部具有相对于外圆柱形表面基本形成割线的底表面。制造盲铆钉的方法包括以下步骤：将具有头部的心轴轴放置在中空铆钉壳内，在放置步骤之后在铆钉外壳的外圆柱形表面中产生至少一个衰减槽，使得至少两个凹槽形成。每个凹部具有相对于外圆柱形表面基本形成割线的底面。

5. 发明申请

US20130215584A1 LAMINATE WITH INTEGRATED ELECTRONIC COMPONENT 审中-公开
标题翻译：具有集成电子元件的层压板
公开(公告)号：US20130215584A1
公开(公告)日：2013-08-22
申请号：US13880756
申请日：2011-10-24
申请人： Andreas Klein , Eckhard Ditzel , Frank Krüger , Wulf Kock , Andreas Hinrich
发明人： Andreas Klein , Eckhard Ditzel , Frank Krüger , Wulf Kock , Andreas Hinrich
IPC分类号： H05K1/02 , H05K3/10
CPC分类号： H05K1/0298 , H01L23/13 , H01L23/3735 , H01L23/498 , H01L33/60 , H01L2224/32013 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H05K3/10 , Y10T29/49155 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to methods for producing a laminate for contacting an electronic component, in which an insulating layer is arranged between first and second metal layers. The method includes contacting the metal layers to each other in a contact region, generating a recess in the insulating layer, laminating the metal layers to the insulating layer, generating a notch for accommodating the electronic component in the contact region in the first metal layer, inserting the electronic component in a depression in the laminate formed through a notch and recess. The electronic component is connected in a conductive manner to the second metal layer, such that an entire circumference of the electronic component is accommodated in the recess and/or notch, and at least part of the height of the electronic component is accommodated in the notch and/or recess. The invention also relates to such a laminate for contacting an electronic component.
摘要翻译：本发明涉及一种用于制造用于接触电子部件的层压体的方法，其中绝缘层布置在第一和第二金属层之间。该方法包括在接触区域中使金属层彼此接触，在绝缘层中产生凹陷，将金属层层压到绝缘层上，在第一金属层的接触区域中产生用于容纳电子部件的凹口，将电子部件插入通过凹口和凹槽形成的层压体中的凹陷中。电子部件以导电方式连接到第二金属层，使得电子部件的整个圆周被容纳在凹部和/或凹口中，并且电子部件的至少一部分高度容纳在凹口中和/或凹部。本发明还涉及用于接触电子部件的这种层压体。

6. 发明申请

US20120139003A1 OPTOELECTRONIC COMPONENT 有权
标题翻译：光电组件
公开(公告)号：US20120139003A1
公开(公告)日：2012-06-07
申请号：US13377910
申请日：2010-05-28
申请人： Michael Zitzlsperger , Eckhard Ditzel , Jörg Erich Sorg
发明人： Michael Zitzlsperger , Eckhard Ditzel , Jörg Erich Sorg
IPC分类号： H01L33/48 , H01L31/0203
CPC分类号： H01L33/486 , H01L33/38 , H01L33/52 , H01L33/54 , H01L2224/48091 , H01L2924/00014
摘要： An optoelectronic component including a connection carrier including an electrically insulating film at a top side of the connection carrier, an optoelectronic semiconductor chip at the top side of the connection carrier, a cutout in the electrically insulating film which encloses the optoelectronic semiconductor chip, and a potting body surrounding the optoelectronic semiconductor chip, wherein a bottom area of the cutout is formed at least regionally by the electrically insulating film, the potting body extends at least regionally as far as an outer edge of the cutout facing the optoelectronic semiconductor chip, and the cutout is at least regionally free of the potting body.
摘要翻译：一种光电子部件，包括在连接载体的顶侧包括电绝缘膜的连接载体，在连接载体的顶侧的光电半导体芯片，包围光电半导体芯片的电绝缘膜中的切口，以及灌封体围绕光电子半导体芯片，其中，所述切口的底部区域至少由所述电绝缘膜区域形成，所述灌封体至少在区域上延伸至所述切口的面向所述光电半导体芯片的外边缘，并且切口至少在区域上没有灌封体。

7. 发明申请

US20130223032A1 CHIP-INTEGRATED THROUGH-PLATING OF MULTI-LAYER SUBSTRATES 有权
标题翻译：通过多层基板的芯片集成
公开(公告)号：US20130223032A1
公开(公告)日：2013-08-29
申请号：US13883154
申请日：2011-10-21
申请人： Andreas Steffen Klein , Eckhard Ditzel , Frank Krüger , Michael Schumann
发明人： Andreas Steffen Klein , Eckhard Ditzel , Frank Krüger , Michael Schumann
IPC分类号： H05K1/18 , H05K3/00
CPC分类号： H05K1/183 , H01L23/13 , H01L23/36 , H01L24/32 , H01L33/486 , H01L33/60 , H01L2224/29339 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/83385 , H01L2224/8384 , H01L2924/12042 , H01L2924/14 , H05K3/00 , H05K3/4084 , H05K2201/0355 , H05K2201/10106 , H05K2201/2054 , H05K2203/0278 , H05K2203/049 , H05K2203/063 , H05K2203/1484 , Y10T29/49002 , H01L2924/00014 , H01L2924/00
摘要： A laminate and method for producing the laminate are provided for contacting at least one electronic component. An insulating layer is laminated between first and second metal layers electrically contacted to each other in at least one contact region. At least one recess in the contact region is generated with at least one embossing and/or bulging in the first metal layer. The distance between the two metal layers is reduced, such that dimensions of the embossing/bulging are sufficient for taking up the electronic component, which is inserted and connected into the embossing/bulging in a conductive manner therein. The electronic component is taken up in the embossing/bulging entirely with respect to its circumference and at least partly with respect to the height (H) of the electronic component. The laminate may be used as a circuit board, sensor, LED lamp, mobile phone component, control, or regulator.
摘要翻译：提供层压体和用于制造层压体的方法用于使至少一个电子部件接触。在至少一个接触区域中彼此电接触的第一和第二金属层之间层压绝缘层。在第一金属层中产生至少一个压花和/或凸起的接触区域中的至少一个凹部。两个金属层之间的距离减小，使得压花/凸起的尺寸足以吸收电子部件，该电子部件以导电的方式插入并连接到压花/凸起中。电子部件相对于其圆周完全被压印/凸起，并且至少部分地相对于电子部件的高度（H）被吸收。层压板可用作电路板，传感器，LED灯，手机部件，控制或调节器。

8. 发明授权

US08153232B2 Laminated substrates for mounting electronic parts and methods for making same 失效
标题翻译：用于安装电子部件的层叠基板及其制造方法
公开(公告)号：US08153232B2
公开(公告)日：2012-04-10
申请号：US12047353
申请日：2008-03-13
申请人： Eckhard Ditzel , Siegfried Walter , Manfred Gresch
发明人： Eckhard Ditzel , Siegfried Walter , Manfred Gresch
IPC分类号： B32B3/24 , B65D85/90
CPC分类号： H05K3/0097 , H01L23/49861 , H01L2924/0002 , H05K1/0393 , H05K3/0052 , H05K3/202 , H05K3/4084 , H05K3/4092 , H05K2201/0397 , H05K2203/1545 , Y10T156/1049 , Y10T428/24008 , Y10T428/24281 , Y10T428/24289 , H01L2924/00
摘要： A method is provided for producing a laminated substrate for mounting semiconductor chips. At least respective metal and plastic structure films having respective different recurrent contours are laminated together in such a way that a material strip is obtained. The lamination is followed by perforations or cuttings, and the method includes at least one of the following steps: A. the films are structured in such a way that superposition thereof makes it possible to obtain the areas which are devoid of overlap through the total width thereof; B. the films are not laminated through the total width of the laminate in partly recurrent areas; and C. recurrent segments of the recurrent contours are bent out of the surface of the laminated strip starting from the laminate.
摘要翻译：提供了一种用于制造用于安装半导体芯片的层叠基板的方法。具有各自不同轮廓轮廓的至少相应的金属和塑料结构膜以获得材料条的方式层压在一起。层叠之后是穿孔或切割，并且该方法包括以下步骤中的至少一个：A.膜以这样的方式构造，使得其叠加使得可以通过总宽度获得没有重叠的区域的; B.在部分复发区域中，薄膜不层压在层压板的总宽度上; 并且复制轮廓的C.复发段从层压板开始从层压带的表面弯曲出来。

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