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1. 发明授权

US5851370A Automated electrophoresis system and method 失效
标题翻译：自动电泳系统及方法
公开(公告)号：US5851370A
公开(公告)日：1998-12-22
申请号：US788970
申请日：1997-01-24
申请人： George N. Maracas , William L. Reber , Cary D. Perttunen
发明人： George N. Maracas , William L. Reber , Cary D. Perttunen
IPC分类号： G01N27/447 , G01N27/26
CPC分类号： G01N27/44782 , G01N27/44704
摘要： Automated electrophoresis is performed by applying a cover plate to a substrate having a plurality of electrophoresis lanes, applying at least one sample to the plurality of electrophoresis lanes, electrophoresing the at least one sample, removing the cover plate from the substrate, and washing the substrate. Thereafter, the aforementioned steps are repeated using the same substrate.
摘要翻译：通过在具有多个电泳通道的基板上涂覆覆盖板，将至少一个样品施加到多个电泳泳道，对该至少一个样品进行电泳，从基板上除去盖板，并洗涤该基板来进行自动电泳。此后，使用相同的基板重复上述步骤。

2. 发明授权

US06897562B2 Electronic component and method of manufacturing same 有权
标题翻译：电子元件及其制造方法
公开(公告)号：US06897562B2
公开(公告)日：2005-05-24
申请号：US10411744
申请日：2003-04-11
申请人： Lei L. Mercado , Tien-Yu Tom Lee , Jay Jui Hsiang Liu
发明人： Lei L. Mercado , Tien-Yu Tom Lee , Jay Jui Hsiang Liu
IPC分类号： H01L23/498 , H05K3/34 , H01L23/02
CPC分类号： H01L23/49816 , H01L2224/48227 , H01L2924/12044 , H01L2924/15311 , H05K3/341 , H05K2201/10727 , H05K2201/10969 , Y02P70/613
摘要： An electronic component includes an organic interposer (160, 460, 560, 660, 760, 860, 960), a semiconductor chip (220) mounted over the organic interposer, copper pads (250, 751, 851) under the organic interposer, a solder attachment (110, 510, 610, 910) between certain ones of the copper pads, and solder interconnects (120, 420) between certain other ones of the copper pads and located around an outer perimeter (111, 511, 911) of the solder attachment. The solder attachment is placed at locations within the electronic component that experience the greatest stress, which may include, for example, locations adjacent to at least a portion of a perimeter (221) of the semiconductor chip. In one embodiment, a surface area of the solder attachment is larger than a surface area of each one of the solder interconnects. In the same or another embodiment, the electronic component includes multiple solder attachments.
摘要翻译：电子部件包括有机插入件（160,460,560,660,760,860,960），安装在有机插入件上的半导体芯片（220），有机插入件下方的铜焊盘（250,751,851），在某些铜焊盘之间的焊料附着物（110,510,610,910）以及位于铜焊盘的某些其它铜焊盘之间的焊料互连（120,420），并位于铜焊盘的外周边（111,511,911）周围焊锡附件。焊料附着物被放置在经受最大应力的电子部件内的位置，其可以包括例如与半导体芯片的周边（221）的至少一部分相邻的位置。在一个实施例中，焊料附着物的表面积大于每个焊料互连的表面积。在相同或另一个实施例中，电子部件包括多个焊接附件。

3. 发明授权

US5895976A Microelectronic assembly including polymeric reinforcement on an integrated circuit die, and method for forming same 失效
标题翻译：包括集成电路芯片上的聚合物增强的微电子组件及其形成方法
公开(公告)号：US5895976A
公开(公告)日：1999-04-20
申请号：US657216
申请日：1996-06-03
申请人： Michelle J. Morrell , Steven C. Machuga , Grace M. O'Malley , George A. Carson , Andrew Skipor , Wen Xu Zhou , Karl W. Wyatt
发明人： Michelle J. Morrell , Steven C. Machuga , Grace M. O'Malley , George A. Carson , Andrew Skipor , Wen Xu Zhou , Karl W. Wyatt
IPC分类号： H01L21/56 , H01L23/31 , H01L23/48
CPC分类号： H01L23/3157 , H01L21/563 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/01322 , H01L2924/09701
摘要： A microelectronic assembly (10) includes an integrated circuit die (12) mounted onto a substrate (14) by solder bump interconnections (32). The die (12) and the substrate (14) are spaced apart by a gap (30) that is filled with a polymeric encapsulant (16). The die (12) includes a die perimeter (24) and a face (27) facing away from the substrate (14). A polymeric reinforcement (18) is disposed onto the die face (27) to protect the die (12) and to reduce the effects of thermally induced stresses on the die (12) and the solder bump interconnections (32). The polymeric reinforcement (18) is spaced apart from the die perimeter (24) to maintain a desired peripheral fillet geometry of the encapsulant (16).
摘要翻译：微电子组件（10）包括通过焊料凸块互连（32）安装到衬底（14）上的集成电路管芯（12）。模具（12）和衬底（14）被填充有聚合物密封剂（16）的间隙（30）间隔开。模具（12）包括模具周边（24）和面向背离衬底（14）的面（27）。聚合物加强件（18）设置在模具表面（27）上以保护模具（12）并且减少热引起的应力对模具（12）和焊料凸块互连（32）的影响。聚合物加强件（18）与模具周边（24）间隔开，以保持密封剂（16）的期望的外圆角几何形状。

4. 发明授权

US5827482A Transistor-based apparatus and method for molecular detection and field enhancement 失效
标题翻译：基于晶体管的装置和分子检测和场增强方法
公开(公告)号：US5827482A
公开(公告)日：1998-10-27
申请号：US699757
申请日：1996-08-20
申请人： Chan-Long Shieh , Donald E. Ackley
发明人： Chan-Long Shieh , Donald E. Ackley
IPC分类号： C12N15/09 , C12Q1/68 , G01N27/00 , G01N27/327 , G01N27/414 , G01N33/543 , G01N27/02 , G01N27/26 , G01N33/53
CPC分类号： C12Q1/6825 , G01N27/4145 , G01N33/54373
摘要： Binding of a molecule to a molecular receptor is sensed using a transistor having a gate located at a binding site. The channel conductance of the transistor is modified by a charge associated with the molecule when the molecule binds with the molecular receptor. A modified electrical characteristic of the transistor which results is sensed to sense the binding event. Electric field enhancement is provided by applying a voltage to the gate. A second sensing transistor can be coupled to the sensing transistor to form a differential pair. The differential pair allows for enhancing and sensing of differential binding events.
摘要翻译：使用具有位于结合位点的栅极的晶体管来感测分子与分子受体的结合。当分子与分子受体结合时，通过与分子相关的电荷来修饰晶体管的沟道电导。检测结果感测结合事件的晶体管的改进的电特性。通过向栅极施加电压来提供电场增强。第二感测晶体管可以耦合到感测晶体管以形成差分对。差分对允许增强和感测差分绑定事件。

5. 发明授权

US5805037A Distributed transmission line structure 失效
标题翻译：分布式传输线结构
公开(公告)号：US5805037A
公开(公告)日：1998-09-08
申请号：US780020
申请日：1996-12-23
申请人： Roger J. Forse , William L. Olson
发明人： Roger J. Forse , William L. Olson
IPC分类号： H01P3/08 , H05K1/02 , H05K3/46
CPC分类号： H01P3/088 , H05K1/0253 , H05K1/0219 , H05K2201/09536 , H05K2201/09663 , H05K3/4602
摘要： A distributed transmission line structure (10) includes a ground plane (26) affixed to a substrate (12). The substrate (12) is formed of a generally nonconductive material. A first metallic strip (14) is affixed to the substrate (12) and is electrically connected to the ground plane (26) through a first through-hole (34). A second metallic strip (16) is affixed to the substrate (12) and is spaced apart from the first metallic strip (14) by a gap (28) and is electrically connected to the ground plane (26) through a second through-hole (38). A dielectric layer (20) overlies the substrate (12), the first metallic strip (14), and the second metallic strip (16). A third metallic strip (18) is affixed to the dielectric layer (20) and is disposed to overlie the gap (28). The third metallic strip (18) has a width less than the gap (28). The impedance of the distributed transmission line structure (10) is substantially constant over a predetermined range of thickness of the dielectric layer (20).
摘要翻译：分布式传输线结构（10）包括固定到基板（12）的接地平面（26）。基板（12）由大致非导电材料形成。第一金属条（14）固定到基板（12）上，并通过第一通孔（34）与接地平面（26）电连接。第二金属条（16）固定到基板（12）上并且通过间隙（28）与第一金属条（14）间隔开，并且通过第二通孔电连接到接地平面（26）（38）。介电层（20）覆盖在基底（12），第一金属条（14）和第二金属条（16）上。第三金属条（18）固定到电介质层（20）上并且设置成覆盖间隙（28）。第三金属条（18）的宽度小于间隙（28）。分布式传输线结构（10）的阻抗在电介质层（20）的预定厚度范围内基本上是恒定的。

6. 发明授权

US5844319A Microelectronic assembly with collar surrounding integrated circuit component on a substrate 失效
标题翻译：微电子组件，带有围绕集成电路部件的衬底
公开(公告)号：US5844319A
公开(公告)日：1998-12-01
申请号：US808773
申请日：1997-03-03
申请人： Danniel Roman Gamota , George Amos Carson , Sean Xin Wu , Brian J. Bullock
发明人： Danniel Roman Gamota , George Amos Carson , Sean Xin Wu , Brian J. Bullock
IPC分类号： H01L21/60 , H05K1/02 , H05K3/34 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/81 , H05K1/0271 , H01L2224/16225 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/1579 , H05K2201/068 , H05K2201/10674 , H05K2201/2009 , H05K2201/2018 , H05K3/3436
摘要： A microelectronic assembly (10) includes an integrated circuit component (14) attached to a polymeric substrate (12) by a plurality of unencapsulated solder bump interconnections (16). A collar (18) is affixed to the polymeric substrate (12) about the integrated circuit component (14) and is formed of an inorganic material having a coefficient of thermal expansion less than that of the substrate (12). The collar (18) constrains thermal expansion of the polymeric substrate (12) in the die attach region (22), thereby lessening any deleterious effects caused by a mismatch in the thermal expansion of the polymeric substrate (12) and the integrated circuit component (14).
摘要翻译：微电子组件（10）包括通过多个未封装的焊料凸块互连（16）连接到聚合物基板（12）的集成电路部件（14）。围绕集成电路部件（14）将轴环（18）固定到聚合物基体（12）上，并且由热膨胀系数小于基底（12）的热膨胀系数的无机材料形成。套环（18）限制聚合物基材（12）在管芯附接区域（22）中的热膨胀，从而减少由聚合物基材（12）和集成电路部件（12）的热膨胀失配引起的任何有害影响 14）。

7. 发明授权

US5844315A Low-profile microelectronic package 失效
标题翻译：薄型微电子封装
公开(公告)号：US5844315A
公开(公告)日：1998-12-01
申请号：US621912
申请日：1996-03-26
申请人： Cynthia M. Melton , George N. Demet , Iwona Turlik
发明人： Cynthia M. Melton , George N. Demet , Iwona Turlik
IPC分类号： H01L21/56 , H01L21/68 , H01L23/31 , H01L23/495 , H05K3/34 , H01L23/48 , H01L29/40
CPC分类号： H01L21/568 , H01L23/3107 , H01L23/49517 , H05K3/3436 , H01L2224/05554 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/854 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01079 , H01L2924/01322 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/18165 , H05K2201/0394 , H05K2201/09472 , H05K2201/10477 , H05K2201/10977 , Y02P70/613
摘要： A microelectronic package (10) is formed by placing a lead frame (22) onto an adhesive polyimide tape (38). The lead frame (22) includes a plurality of metallic leads (16) and an opening. An integrated circuit die (12) is positioned onto the molding support (38) within the opening such that a non-active face (32) of the integrated circuit die (12) rests against the molding support (38). Wire leads (18) connect an active face (28) of the integrated circuit die (12) to the metallic leads (16). A plurality of metallic bumps (20) are attached to the metallic leads (16), and a polymeric precursor is dispensed. The precursor embeds the active face (28) of the integrated circuit die (12), the inner surface (19) of the metallic leads (16), the wire leads (18), and the metallic bumps (20). The microelectronic package (10) is then heated to cure the polymeric precursor to form a polymeric body (14). The microelectronic package (10) is then capable of being tested and subsequently attached to a printed circuit board (40) to form a low-profile microelectronic assembly (11).
摘要翻译：通过将引线框架（22）放置在粘合聚酰亚胺胶带（38）上形成微电子封装（10）。引线框架（22）包括多个金属引线（16）和开口。集成电路模具（12）被定位在开口内的模制支撑件（38）上，使得集成电路模具（12）的非活动面（32）靠在模制支撑件（38）上。导线（18）将集成电路管芯（12）的有源面（28）连接到金属引线（16）。多个金属凸块（20）连接到金属引线（16）上，分配聚合物前体。前体嵌入集成电路管芯（12）的有源面（28），金属引线（16）的内表面（19），引线引线（18）和金属凸块（20）。然后加热微电子封装（10）以固化聚合物前体以形成聚合体（14）。微电子封装（10）然后能够被测试并随后连接到印刷电路板（40）以形成低调微电子组件（11）。

8. 发明授权

US5829668A Method for forming solder bumps on bond pads 失效
标题翻译：在焊盘上形成焊料凸块的方法
公开(公告)号：US5829668A
公开(公告)日：1998-11-03
申请号：US706863
申请日：1996-09-03
申请人： Reed A. George , Dennis Brian Miller
发明人： Reed A. George , Dennis Brian Miller
IPC分类号： H01L21/48 , H01L21/60 , H01L21/68 , H05K3/34
CPC分类号： H01L24/11 , H01L21/4853 , H01L21/6835 , H05K3/3484 , H01L2224/11003 , H01L2224/13099 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/14 , H01L2924/15747 , H05K2203/0338 , H05K2203/043
摘要： Solder paste (16) is dispensed onto a platen (12) that includes depressions (14) that are preferably conical or in an inverted pyramid shape. The solder paste (16) is formed of a plurality of particles composed of a solder alloy. Excess solder paste (16) is removed, and a predetermined solder paste volume fills the depressions (14). A substrate (18) is superposed onto platen (12) such that solder-wettable bond pads (20) on the substrate (18) register with the depressions (14). The platen (12) is heated to melt the solder alloy, and the solder alloy coalesces to form molten solder droplets (22). The solder droplets (22) are transferred onto the solder-wettable bond pads (20) to form solder bumps (24) bonded to the bond pads (20).
摘要翻译：将焊膏（16）分配到包括凹陷（14）的压板（12）上，所述凹陷（14）优选为圆锥形或倒锥形。焊膏（16）由焊料合金构成的多个粒子形成。去除过量的焊膏（16），并且预定的焊膏体积填充凹陷（14）。衬底（18）重叠在压板（12）上，使得衬底（18）上的焊料可润湿接合焊盘（20）与凹陷（14）对准。将压板（12）加热熔化焊料合金，并且焊料合金聚结形成熔融焊料液滴（22）。焊料液滴（22）被转移到可焊接的可焊接接合焊盘（20）上以形成结合到接合焊盘（20）的焊料凸块（24）。

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