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    • 6. 发明授权
    • Method of making MOS read only memory by specified double implantation
    • 通过指定的双重注入制作MOS只读存储器的方法
    • US4549336A
    • 1985-10-29
    • US608539
    • 1984-05-09
    • Sheppard Douglas P.
    • Sheppard Douglas P.
    • H01L27/088H01L27/112H01L29/10H01L29/78H01L21/263
    • H01L27/088H01L27/112H01L29/1041H01L29/78
    • The power consumption and corresponding speed of an integrated circuit is scaled by means of adjusting the channel width for MOS transistors. A transistor (12) is initially fabricated with a channel (24) having a width W.sub.1. The channel (24) receives a depletion type implant (30) to make the transistor (12) lightly depleted. An enhancement implant (32) is applied to the channel (24) to cover a selected area (24a). The enhancement implant (32) is made substantially stronger than the depletion implant (30). This results in a first section (24a) of the channel (24) having a large threshold voltage while the second section (24b) of channel (24) has a relatively small pinch-off voltage. The size of the second section (24b) is selectively controlled to scale the source-drain current of transistor (12) and the corresponding power consumption of the transistor (12). The method of applying the first and second implants (30, 32) can be easily incorporated into conventional ROM fabrication without the need for additional manufacturing steps.
    • 通过调整MOS晶体管的沟道宽度来缩放集成电路的功耗和相应的速度。 晶体管(12)最初制造有具有宽度W1的通道(24)。 通道(24)接收耗尽型注入(30)以使晶体管(12)轻度耗尽。 增强植入物(32)被施加到通道(24)以覆盖选定区域(24a)。 增强植入物(32)被制成比耗尽植入物(30)更强。 这导致通道(24)的第一部分(24a)具有大的阈值电压,而通道(24)的第二部分(24b)具有较小的夹断电压。 选择性地控制第二部分(24b)的尺寸以缩放晶体管(12)的源极 - 漏极电流和晶体管(12)的相应功率消耗。 施加第一和第二植入物(30,32)的方法可以容易地并入常规的ROM制造中,而不需要额外的制造步骤。
    • 9. 发明授权
    • Offset voltage compensation circuit
    • 偏移电压补偿电路
    • US4492927A
    • 1985-01-08
    • US430446
    • 1982-09-30
    • Douglas R. Holberg
    • Douglas R. Holberg
    • H04M1/50
    • H04M1/505
    • A dual-tone multi-frequency (DTMF) tone generator circuit (10) produces selected frequency row and column tones which are combined to generate a DTMF signal. Key board scan circuits (42, 44) scan a conventional push-button telephone key board to produce row and column input signals. Row and column fundamental rate signals are generated by fundamental counters (48,76) from a reference signal derived from an external crystal (12). Row and column integration rate signals are generated by integrator counters (50,78) also derived from the reference signal. Specialized row and column clock control signals (SLOPE RATE, SLOPE SIGN, AUTO ZERO) are produced by clock generators (58,82). Row and column integrators (64,92) integrate reference signals to produce discrete voltage steps at the rate of the row and column integration rate signals to produce row and column signals made up of a plurality of segments for each cycle of the signal. Each signal segment comprises a plurality of similar voltage steps having amplitude and polarity determined by the specialized row and column clock signals (SLOPE RATE, SLOPE SIGN). The row and column signals are combined in a summer (68) to produce the DTMF signal.
    • 双音多频(DTMF)音产生器电路(10)产生被组合以产生DTMF信号的所选频率行和列音调。 键板扫描电路(42,44)扫描传统的按钮电话键盘以产生行和列输入信号。 行和列基本速率信号由来自外部晶体(12)的参考信号的基本计数器(48,76)产生。 行和列积分率信号由也从参考信号导出的积分器计数器(50,78)产生。 专门的行和列时钟控制信号(SLOPE RATE,SLOPE SIGN,AUTO ZERO)由时钟发生器(58,82)生成。 行和列积分器(64,92)集成参考信号以以行和列积分率信号的速率产生离散电压步长,以产生由信号的每个周期的多个段组成的行和列信号。 每个信号段包括具有由专门的行和列时钟信号(SLOPE RATE,SLOPE SIGN)确定的振幅和极性的多个相似的电压阶跃。 行和列信号在夏季(68)中组合以产生DTMF信号。
    • 10. 发明授权
    • MOSFET Fabrication process for reducing overlap capacitance and lowering
interconnect impedance
    • MOSFET减少重叠电容并降低互连阻抗的制造工艺
    • US4445266A
    • 1984-05-01
    • US290833
    • 1981-08-07
    • Chao C. MaiWilliam M. WhitneyWilliam M. GosneyDonald J. Gulyas
    • Chao C. MaiWilliam M. WhitneyWilliam M. GosneyDonald J. Gulyas
    • H01L21/8234H01L21/22H01L21/28
    • H01L21/823475Y10S438/907
    • A method of forming a plurality of interconnected metal oxide semiconductor field effect transistors on P-type semiconductor substrate (10). A layer of oxide (14) is formed on the substrate (10) and then a polysilicon layer (16) is formed on top of the oxide layer (14). A layer of silicon nitride (18) is deposited on top of the polysilicon layer (16). The silicon nitride layer (18), polysilicon layer (16) and oxide layer (14) are selectively etched to form a conductor pattern. The conductor pattern defines a gate electrode and a plurality of interconnecting lines (42) that interconnect transistors to each other and to the peripheral circuits that drive the transistors. The source and drain regions (26 and 28) are ion implanted with arsenic ions. The exposed sidewalls of the polysilicon layer (16) are oxidized lateral and subjacent to the silicon nitride layer (18). The oxidation forms a lateral band of oxide (32) on the polysilicon layer (16) and effectively reduces the conductive width of the polysilicon layer (16). The reduced conductive width reduces the overlap capacitance. The silicon nitride layer (18) is then removed and a layer of tungsten (34) is deposited by hot-wall, low-pressure chemical vapor deposition (LPCVD). The tungsten layer (34) selectively adheres to the polysilicon layer (18) providing a low resistance path for the conductors. The tungsten layer (18) forms both a gate electrode and the low resistance interconnect lines (42) or "runs." A heat treatment may then be applied to the combined tungsten layer (34) and the polysilicon layer (16) to form a composite conductor of tungsten silicide. Thereafter the interconnect lines (42) and gate electrodes are covered by a low temperature oxide (36).
    • 一种在P型半导体衬底(10)上形成多个互连的金属氧化物半导体场效应晶体管的方法。 在衬底(10)上形成氧化层(14),然后在氧化物层(14)的顶部形成多晶硅层(16)。 在多晶硅层(16)的顶部上淀积一层氮化硅(18)。 选择性地蚀刻氮化硅层(18),多晶硅层(16)和氧化物层(14)以形成导体图案。 导体图案限定了栅极电极和多个互连线(42),其互连晶体管和驱动晶体管的外围电路。 源极和漏极区域(26和28)离子注入砷离子。 多晶硅层(16)的暴露的侧壁在氮化硅层(18)的外侧被氧化。 氧化在多晶硅层(16)上形成氧化物(32)的横向带,并且有效地减小了多晶硅层(16)的导电宽度。 降低的导电宽度减小了重叠电容。 然后去除氮化硅层(18),并通过热壁,低压化学气相沉积(LPCVD)沉积一层钨(34)。 钨层(34)选择性地粘附到多晶硅层(18),为导体提供低电阻路径。 钨层(18)形成栅极电极和低电阻互连线路(42)或“运行”两者。 然后可以对组合的钨层(34)和多晶硅层(16)施加热处理以形成硅化钨的复合导体。 此后,互连线(42)和栅电极被低温氧化物(36)覆盖。