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1. 发明授权

US5492615A Cyclodextrin stabilization of organic metal finishing additives in aqueous metal treating baths 失效
标题翻译：有机金属精加工添加剂在含水金属处理液中的环糊精稳定化
公开(公告)号：US5492615A
公开(公告)日：1996-02-20
申请号：US343198
申请日：1994-11-22
申请人： John Houman
发明人： John Houman
IPC分类号： C23C18/31 , C25D3/02 , C25D11/08 , C23C16/00 , C23C18/00 , C25D3/00
CPC分类号： C25D3/02 , C23C18/31
摘要： A method for stabilizing organic metal finishing additives in aqueous metal treating baths by dissolving the organic metal finishing additive with a cyclodextrin and a common solvent therefor, so that an inclusion compound of the organic metal finishing additive in the cyclodextrin is formed, and then dissolving the inclusion compound in an aqueous metal treating bath. Aqueous metal treating baths having dissolved therein inclusion compounds of organic metal finishing additives in cyclodextrins are also described.
摘要翻译：一种通过用环糊精及其常用溶剂溶解有机金属整理添加剂来在含水金属处理槽中稳定有机金属精加工添加剂的方法，从而形成环糊精中的有机金属整理添加剂的包合物，然后将包合物在含水金属处理浴中。还描述了在环糊精中溶解有机金属整理添加剂的包合物的水性金属处理浴。

2. 发明授权

US5312539A Electrolytic tin plating method 失效
标题翻译：电解锡电镀法
公开(公告)号：US5312539A
公开(公告)日：1994-05-17
申请号：US76750
申请日：1993-06-15
申请人： Donald Thomson
发明人： Donald Thomson
IPC分类号： C25D3/30 , C25D21/14 , C25D21/22 , C25D21/18
CPC分类号： C25D3/30 , Y10S204/13
摘要： A method for plating tin onto the surface of steel strip in an acidic electrolyte bath utilizing insoluble anodes is disclosed. Free acid in the bath is extracted from the bath and concentrated. Tin is dissolved in the concentrated extract and the extract is returned to the bath to replenish the tin in the bath.
摘要翻译：公开了一种在使用不溶性阳极的酸性电解液槽中将锡镀在钢带表面上的方法。浴中的游离酸从浴中提取并浓缩。将锡溶解在浓缩的提取物中，并将提取物返回到浴中以补充浴中的锡。

3. 发明授权

US4761304A Process for printed circuit board manufacture 失效
公开(公告)号：US4761304A
公开(公告)日：1988-08-02
申请号：US17413
申请日：1987-02-24
申请人： William R. Brasch , Carlo Favini
发明人： William R. Brasch , Carlo Favini
IPC分类号： H05K3/18 , H05K3/38 , H05K3/42 , B05D5/12
CPC分类号： H05K3/184 , H05K2203/0716 , H05K2203/122 , H05K2203/1415 , H05K3/381 , H05K3/427
摘要： The method for the manufacture of printed circuit boards which have been imaged by means of a polymeric resist which comprises selectively catalyzing those areas not covered by the image by treating the imaged circuit board with a catalyst having a charge higher than the charge on the non-imaged areas and sufficiently lower than the charge on the resist image to cause the catalyst to be repelled therefrom, but sufficiently close to the charge on the non-imaged areas to cause adsorption of the catalysts thereon.

4. 发明授权

US4759952A Process for printed circuit board manufacture 失效
标题翻译：印刷电路板制造工艺
公开(公告)号：US4759952A
公开(公告)日：1988-07-26
申请号：US898073
申请日：1986-08-20
申请人： William R. Brasch , Carlo Favini
发明人： William R. Brasch , Carlo Favini
IPC分类号： H05K3/18 , H05K3/38 , H05K3/42 , B05D5/12
CPC分类号： H05K3/184 , H05K2203/0716 , H05K2203/122 , H05K2203/1415 , H05K3/381 , H05K3/427
摘要： The method for the manufacture of printed circuit boards which have been imaged by means of a polymeric resist which comprises selectively catalyzing those areas not covered by the image by treating the imaged circuit board with a catalyst having a charge higher than the charge on the non-imaged areas and sufficiently lower than the charge on the resist image to cause the catalyst to be repelled therefrom, but sufficiently close to the charge on the non-imaged areas to cause adsorption of the catalysts thereon.
摘要翻译：用于制造已经通过聚合物抗蚀剂成像的印刷电路板的方法，其包括通过用具有高于非磁性材料上的电荷的电荷的催化剂处理成像电路板来选择性催化那些未被图像覆盖的区域，并且足够低于抗蚀剂图像上的电荷以使催化剂从其上排斥，但足够接近非成像区域上的电荷以引起其上的催化剂的吸附。

5. 发明授权

US4681670A Bath and process for plating tin-lead alloys 失效
标题翻译：电镀锡铅合金的浴和工艺
公开(公告)号：US4681670A
公开(公告)日：1987-07-21
申请号：US903528
申请日：1986-09-04
申请人： Fred I. Nobel , David N. Schram
发明人： Fred I. Nobel , David N. Schram
IPC分类号： C25D3/60 , C25D5/02 , H05K3/34 , C25D3/32 , C25D3/36 , C25D3/56
CPC分类号： C25D5/02 , C25D3/60 , H05K3/3473
摘要： An electroplating bath and process for electroplating substrates with a tin-lead alloy from an electrolyte containing a soluble tin compound, a soluble lead compound and a complexing agent in an amount sufficient to maintain the metals in solution. Th electrolyte has a pH range of about 1.5 to 5.5 and is free from substantial amounts of free acid or free base components.
摘要翻译：一种电镀槽和用于由含有可溶性锡化合物的电解质，可溶性铅化合物和络合剂的锡 - 铅合金电镀基底的方法，其量足以将金属保持在溶液中。电解质的pH范围为约1.5至5.5，并且不含大量的游离酸或游离碱组分。

6. 发明授权

US4520046A Metal plating on plastics 失效
标题翻译：塑料镀金
公开(公告)号：US4520046A
公开(公告)日：1985-05-28
申请号：US510428
申请日：1983-06-30
申请人： John E. McCaskie , Chris Tsiamis
发明人： John E. McCaskie , Chris Tsiamis
IPC分类号： C23C18/28 , H05K3/18 , H05K3/38 , C23C3/02
CPC分类号： C23C18/28 , H05K3/181 , H05K3/381
摘要： A simple and highly effective process for preparing the surface and plating a plastic or elastomer material is disclosed by the present invention.A uniform, highly adherent metal layer is deposited by the claimed process. The surface of the materials to be plated is prepared by exposure to a gas etch atmosphere and activation of the etched surface by providing a metal colloid thereon. Another aspect relates to the use of a one-step or two-step conditioner treatment in the process for improved results.After the surface preparation and activation, a desired metal coating can be electroless metal plated in a conventional manner.
摘要翻译：本发明公开了一种用于制备表面和镀覆塑料或弹性体材料的简单且高效的方法。通过要求保护的方法沉积均匀的，高附着的金属层。要镀覆的材料的表面通过暴露在气体蚀刻气氛中并通过在其上提供金属胶体来激活蚀刻表面来制备。另一方面涉及在该方法中使用一步或两步调理剂处理以获得改进的结果。在表面制备和活化之后，所需的金属涂层可以以常规方式进行无电金属镀覆。

7. 发明授权

US4399006A Silver plating 失效
标题翻译：镀银
公开(公告)号：US4399006A
公开(公告)日：1983-08-16
申请号：US59116
申请日：1979-07-19
申请人： Fred I. Nobel , William Brasch
发明人： Fred I. Nobel , William Brasch
IPC分类号： C25D3/46 , C25D5/34 , C25D5/10
CPC分类号： C25D3/46 , C25D5/34
摘要： The invention relates to silver plating utilizing low cyanide or non-cyanide silver plating baths by treating the substrate to be plated with a mercaptan and to low cyanide or non-cyanide baths containing a bath soluble mercaptan in a sufficient amount to eliminate or effectively reduce immersion plating of the silver onto the substrate.
摘要翻译：本发明涉及使用低氰化物或非氰化物银镀浴的银镀处理，该镀银处理要镀硫醇的基材和含有足够量的可溶性硫醇的低氰化物或非氰化物浴以消除或有效减少浸渍将银镀在基底上。

8. 发明授权

US4247372A Silver plating 失效
标题翻译：镀银
公开(公告)号：US4247372A
公开(公告)日：1981-01-27
申请号：US937849
申请日：1978-08-29
申请人： Fred I. Nobel , William Brasch
发明人： Fred I. Nobel , William Brasch
IPC分类号： C25D3/46 , C25D5/34 , C25D5/02 , C25D5/08
CPC分类号： C25D5/34 , C25D3/46
摘要： The invention relates to silver plating utilizing low cyanide or non-cyanide silver plating baths by treating the substrate to be plated with a mercaptan and to low cyanide or non-cyanide baths containing a bath soluble mercaptan in a sufficient amount to eliminate or effectively reduce immersion plating of the silver onto the substrate.
摘要翻译：本发明涉及使用低氰化物或非氰化物银镀浴的银镀处理，该镀银处理要镀硫醇的基材和含有足够量的可溶性硫醇的低氰化物或非氰化物浴以消除或有效减少浸渍将银镀在基底上。

9. 发明授权

US5480517A Electrolytic production of hypophosphorous acid 失效
公开(公告)号：US5480517A
公开(公告)日：1996-01-02
申请号：US307923
申请日：1994-09-16
申请人： Fred I. Nobel , William Brasch , Donald Thomson , Luis H. Garay
发明人： Fred I. Nobel , William Brasch , Donald Thomson , Luis H. Garay
IPC分类号： B01D61/44 , C01B25/165 , C25B1/22
CPC分类号： C25B1/22 , B01D61/44 , C01B25/165
摘要： Methods for preparing hypophosphorous acid are disclosed comprising contacting an insoluble anode with an aqueous solution of hypophosphite anions and applying a current through the insoluble anode to a cathode in electrical contact with the aqueous solution to generate H+ ions in the aqueous solution thereby forming a hypophosphorous acid solution.

10. 发明授权

US5256275A Electroplated gold-copper-silver alloys 失效
标题翻译：电镀金 - 铜 - 银合金
公开(公告)号：US5256275A
公开(公告)日：1993-10-26
申请号：US869244
申请日：1992-04-15
申请人： William R. Brasch
发明人： William R. Brasch
IPC分类号： C25D3/56 , C25D3/62 , C25D5/08 , C25D5/18
CPC分类号： C25D3/62
摘要： A solution for electroplating gold-copper-silver alloys. The solution comprises gold, copper and silver, each in the form of a cyanide complex. The solution further comprises a divalent sulfur compound capable of brightening and leveling the electroplated deposit of the gold-copper-silver alloy. Optionally, a source of cyanide ions such as a free alkali cyanide, is included in the solution. In addition, additives such as surface active agents, buffers and/or conductivity salts may also be included to impart a particular feature or characteristic to the solution. The invention additionally comprises a process for electroplating up to about 20 microns of a gold-copper-silver alloy upon a substrate utilizing these novel solutions. The alloy is deposited upon a substrate which is immersed in the solution, by electroplating at a current density of between about 1 and 15 ASF, a pH of between about 8-11 at a temperature of between about 100.degree.-170.degree. F. for a time sufficient to obtain the desired thickness. Improved brightness results are obtained with the process of the invention by manipulating the electroplating current.

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