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1. 发明授权

US08278594B2 Method and apparatus for perforating printed circuit board 失效
标题翻译：印刷电路板穿孔方法和装置
公开(公告)号：US08278594B2
公开(公告)日：2012-10-02
申请号：US12396584
申请日：2009-03-03
申请人： Kunio Arai , Hiroyuki Sugawara , Hiroaki Ashizawa , Hiromi Nishiyawa
发明人： Kunio Arai , Hiroyuki Sugawara , Hiroaki Ashizawa , Hiromi Nishiyawa
IPC分类号： B23K26/06 , B23K26/38
CPC分类号： H05K3/0038 , B23K26/03 , B23K26/032 , B23K26/06 , B23K26/082 , C23F4/02 , H01L21/31116 , H01L21/32131 , H05K3/0035 , H05K2203/163
摘要： A method and an apparatus for perforating a printed circuit board are provided so that the processing efficiency and the board densification can be improved. In test processing, a conductor layer 50i is irradiated with a pulsed laser beam 4a whose energy density is set at a value high enough to process the conductor layer 50i while emission 23a from a processed portion is monitored. Thus, the number of pulses of irradiation required for processing a window in the conductor layer 50i is obtained. An insulating layer 51i is irradiated with a pulsed laser beam 5a whose energy density is set at a value high enough to process the insulating layer 51i but low enough not to process a conductor layer 50i+1 under the insulating layer 51i. Thus, the number of pulses of irradiation required for processing a window in the insulating layer 51i is obtained. The conductor layer 50i is irradiated with the laser beam 4a the obtained number of pulses of irradiation, and the insulating layer 51i is irradiated with the laser beam 5a the obtained number of pulses of irradiation. Thus, a hole is processed in the printed circuit board.
摘要翻译：提供了一种用于穿孔印刷电路板的方法和装置，从而可以提高处理效率和电路板致密化。在测试处理中，用脉冲激光束4a照射导体层50i，脉冲激光束4a的能量密度设定为足够高的值来处理导体层50i，同时监视来自处理部分的发射23a。因此，获得了在导体层50i中处理窗口所需的照射脉冲数。用脉冲激光束5a照射绝缘层51i，脉冲激光束5a的能量密度设定为足够高的值来处理绝缘层51i但足够低，不能在绝缘层51i下方处理导体层50i + 1。因此，获得了在绝缘层51i中处理窗口所需的照射脉冲数。导体层50i用激光束4a照射所获得的照射脉冲数，绝缘层51i用激光束5a照射获得的照射脉冲数。因此，在印刷电路板中处理孔。

2. 发明授权

US08151455B2 Printed circuit board and method of manufacturing the same 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US08151455B2
公开(公告)日：2012-04-10
申请号：US12143214
申请日：2008-06-20
申请人： Kazunori Hamada , Hiroshi Kawasaki , Tomoaki Ozaki
发明人： Kazunori Hamada , Hiroshi Kawasaki , Tomoaki Ozaki
IPC分类号： H05K3/02
CPC分类号： H05K3/0047 , H05K1/0237 , H05K1/0268 , H05K3/429 , H05K2203/0207 , H05K2203/0242 , Y10T29/49124 , Y10T29/49156 , Y10T29/49167
摘要： A method of manufacturing a printed circuit board is provided. The method includes preliminarily forming a plurality of test pattern layers for detecting the depth of an inner layer in a multilayer printed circuit board such that at least a part of a lower test pattern layer is not overlaid with any upper test pattern layer when viewed from a drill entrance side, and preliminarily forming a surface conductor layer; applying a voltage between the surface conductor layer and the test pattern layers; performing drilling toward one test pattern layer, and detecting a current produced when the drill comes into contact with the test pattern to measure the depth of the layer (D1); performing drilling toward the other test pattern layer, and measuring the depth of the layer (D2); and performing drilling up to just before the conductor-wiring layer based on a depth calculated from D1 and D2.
摘要翻译：提供一种制造印刷电路板的方法。该方法包括预先形成多个用于检测多层印刷电路板中的内层的深度的测试图案层，使得当从一个多层印刷电路板观察时，下部测试图案层的至少一部分不与任何上部测试图案层重叠钻入口侧，并预先形成表面导体层; 在表面导体层和测试图案层之间施加电压; 对一个测试图案层执行钻孔，并且检测当钻头与测试图案接触时产生的电流以测量层（D1）的深度; 对另一测试图案层执行钻孔，并测量层的深度（D2）; 并且基于从D1和D2计算的深度，在导体布线层之前执行钻孔。

3. 发明申请

US20110136265A1 Method of Manufacturing Thin-Film Solar Panel and Laser Scribing Apparatus 审中-公开
标题翻译：制造薄膜太阳能电池板和激光划线设备的方法
公开(公告)号：US20110136265A1
公开(公告)日：2011-06-09
申请号：US12962212
申请日：2010-12-07
申请人： Keigo SHIGENOBU , Hiroshi HONDA , Yasuhiko KANAYA
发明人： Keigo SHIGENOBU , Hiroshi HONDA , Yasuhiko KANAYA
IPC分类号： H01L21/66 , B23K26/00
CPC分类号： H01L31/208 , B23K26/364 , H01L31/0463 , Y02E10/50 , Y02P70/521
摘要： The present invention provides a method of manufacturing a thin-film solar panel with a laser scribing process to perform linear groove processing by irradiating a thin-film layer formed on a substrate with laser light to be separated from adjacent structure, including steps of: specifying an accurate position, size, shape of a adhered foreign matter on a glass substrate, a glass scratch, an air-bubble in the glass substrate causing an imperfection by inspecting a scribe line; and performing repair processing to form a new scribe line to bypass a portion of the imperfection after a final scribe line is formed.
摘要翻译：本发明提供一种制造具有激光划线工艺的薄膜太阳能电池板的方法，通过用形成在衬底上的薄膜层进行线性沟槽处理，该激光与相邻结构分离，包括以下步骤：指定在玻璃基板上的粘合异物的精确位置，尺寸，形状，玻璃刮痕，玻璃基板中的气泡，通过检查划线而导致不完美; 并且在形成最终划线之后进行修复处理以形成新的划线以绕过缺陷的一部分。

4. 发明授权

US07933675B2 Machining apparatus for drilling printed circuit board 有权
标题翻译：印刷电路板钻孔加工设备
公开(公告)号：US07933675B2
公开(公告)日：2011-04-26
申请号：US12034317
申请日：2008-02-20
申请人： Yasunobu Ueno
发明人： Yasunobu Ueno
IPC分类号： G06F19/00 , B23K26/16 , B23K26/02 , B23K26/14
CPC分类号： B23K26/382 , B23K2101/42 , B23K2103/50 , H05K1/0266 , H05K3/0008 , H05K3/0026 , H05K2201/09063
摘要： A machining apparatus in which the machining efficiency can be improved even if characters are machined in a printed circuit board. A coordinate transformation unit is provided for transforming central coordinates of each dot d of each character of a character string into coordinates in a machining coordinate system with which the holes will be machined. Prior to machining, based on a character string and position information of the character string described in a machining program, central coordinates of each dot of each character of the character string are transformed into coordinates in the machining coordinate system with which the holes will be machined. Each dot d is regarded as a hole and machined. The number of times of movement of a table can be thus minimized so that the machining efficiency can be improved.
摘要翻译：即使在印刷电路板中加工了字符，也能够提高加工效率的加工装置。提供了一个坐标变换单元，用于将字符串的每个字符的每个点d的中心坐标转换成加工坐标系中加工孔的坐标。在加工之前，基于加工程序中描述的字符串的字符串和位置信息，将字符串的每个字符的每个点的中心坐标转换成加工坐标系中的加工坐标系的坐标，其中将加工孔。每个点d被认为是一个孔并加工。因此，能够使台的移动次数最小化，能够提高加工效率。

5. 发明授权

US07897894B2 Laser machining apparatus for sheet-like workpiece 有权
标题翻译：激光加工装置用于片状工件
公开(公告)号：US07897894B2
公开(公告)日：2011-03-01
申请号：US11100521
申请日：2005-04-07
申请人： Yasushi Ito , Tatsuo Sato
发明人： Yasushi Ito , Tatsuo Sato
IPC分类号： B23K26/02
CPC分类号： B23K26/0846 , B23K26/0853 , B23K26/10 , B23K37/0426 , B23K2101/16 , B23K2101/42 , H05K1/0393 , H05K3/0026 , H05K2203/1545
摘要： There is provided a laser machining apparatus for sheet-like workpieces that allows an installation area to be reduced and that may be readily controlled. The laser machining apparatus includes a Y-table movable in X- and Y-plane directions orthogonal to a laser beam irradiated from an fθ lens, a supply reel for holding a supply-side roll which contains a sheet-like workpiece, and a take-up reel for holding a take-up side roll containing a finished sheet-like workpiece. Machining is carried out by fixing the sheet-like workpiece in the machining area on the movable table and by irradiating the laser beam while moving the movable table relative to the laser beam. At least one of the supply reel and the take-up reel is disposed on the movable table.
摘要翻译：提供了一种用于片状工件的激光加工装置，其允许减小安装面积并且可以容易地控制。所述激光加工装置具有与从所述激光照射的激光束正交的X方向和Y方向移动的Y台，透镜，用于保持包含片状工件的供给侧辊的供给卷轴和用于保持包含成品片状工件的卷取侧辊的卷取卷轴。通过将片状工件固定在可移动台上的加工区域中并通过在相对于激光束移动可移动台的同时照射激光束来进行加工。供给卷轴和卷取卷轴中的至少一个设置在可动台上。

6. 发明授权

US07897893B2 Method for drilling holes in a substrate, in particular an electrical circuit substrate, by means of a laser beam 有权
标题翻译：用于通过激光束在基板，特别是电路基板中钻孔的方法
公开(公告)号：US07897893B2
公开(公告)日：2011-03-01
申请号：US11117414
申请日：2005-04-29
申请人： Alexander Kilthau , Hans Jürgen Mayer , Marc Van Biesen
发明人： Alexander Kilthau , Hans Jürgen Mayer , Marc Van Biesen
IPC分类号： B23K26/06
CPC分类号： H05K3/0032 , B23K26/389 , H05K2203/0554
摘要： Disclosed is a valve having a housing with a valve seat for a two-piece flap which is rotatably mounted on a drive shaft. An annular piston seal and an adjacent cover disk are disposed between the first part and the second part of the two-piece flap so as to revolve therearound. The diameter of the cover disk is smaller than the diameter of the annular piston seal which is embodied as a metal ring that is provided with a gap. The invention also relates to the use of the valve as a gas recirculation valve.
摘要翻译：公开了一种阀，其具有壳体，该壳体具有可旋转地安装在驱动轴上的两件式挡片的阀座。环形活塞密封件和相邻的盖盘设置在两件式挡板的第一部分和第二部分之间以便在其周围旋转。盖盘的直径小于环形活塞密封件的直径，其被实施为设置有间隙的金属环。本发明还涉及阀作为气体再循环阀的用途。

7. 发明授权

US07839484B2 Exposure apparatus and exposure method, and method of manufacturing electrical wiring board 有权
标题翻译：曝光装置和曝光方法以及制造电气接线板的方法
公开(公告)号：US07839484B2
公开(公告)日：2010-11-23
申请号：US11492790
申请日：2006-07-26
申请人： Yoshihide Yamaguchi , Masakazu Kishi
发明人： Yoshihide Yamaguchi , Masakazu Kishi
IPC分类号： G03B27/42
CPC分类号： G03B27/54 , B33Y80/00 , G03F7/7005 , G03F7/70466
摘要： This invention provides: an exposure apparatus and exposure method based on a maskless exposure technique which uses a two-dimensional optical modulator, in which maskless exposure technique, the exposure apparatus and exposure method employ a first irradiation source optics for drawing a pattern based on exposure pattern data, and a second irradiation source optics for irradiating an energy ray onto a desired area of space on a region inclusive of a region in which the pattern has been drawn; and a method of manufacturing a wiring Substrate (Board); thus, highly accurate pattern forming based on the exposure pattern data is achieved at high throughput and at low costs.
摘要翻译：本发明提供：一种基于无掩模曝光技术的曝光装置和曝光方法，所述曝光装置和曝光方法使用二维光调制器，其中无掩模曝光技术，曝光装置和曝光方法采用基于曝光的图案绘制的第一照射源光学器件以及第二照射源光学器件，用于将能量射线照射到包括已经绘制图案的区域的区域上的期望的空间区域上; 和布线基板（板）的制造方法。因此，以高产量和低成本实现基于曝光图案数据的高精度图案形成。

8. 发明授权

US07777898B2 Workpiece machining apparatus 有权
标题翻译：工件加工设备
公开(公告)号：US07777898B2
公开(公告)日：2010-08-17
申请号：US12071356
申请日：2008-02-20
申请人： Kaoru Matsumura , Fumiaki Kimura
发明人： Kaoru Matsumura , Fumiaki Kimura
IPC分类号： G01B11/14
CPC分类号： B23Q17/22 , B23Q17/24 , H05K1/0269 , H05K3/0008 , H05K2201/09063 , H05K2201/09918
摘要： A laser machining apparatus is capable of improving workpiece machining precision. The laser machining apparatus has a movable table for supporting a workpiece to be machined, and a camera for detecting the position of the workpiece by reflection light from an alignment mark formed through the workpiece. The apparatus also includes a jig plate provided between the table and the workpiece, and has light-receiving holes that overlap with the alignment mark (through-hole) and that are larger than the alignment mark (through hole).
摘要翻译：激光加工设备能够提高工件加工精度。激光加工装置具有用于支撑待加工的工件的可移动工作台和用于通过来自通过工件形成的对准标记的反射光来检测工件的位置的照相机。该设备还包括设置在工作台和工件之间的夹具板，并且具有与对准标记（通孔）重叠并且比对准标记（通孔）大的光接收孔。

9. 发明授权

US07666320B2 Manufacturing method of printed wiring board as well as copper-clad laminate and treatment solutions used therefor 失效
标题翻译：印刷电路板的制造方法以及用于其的覆铜层压板和处理溶液
公开(公告)号：US07666320B2
公开(公告)日：2010-02-23
申请号：US11443013
申请日：2006-05-31
申请人： Toshinori Kawamura , Haruo Akahoshi , Kunio Arai
发明人： Toshinori Kawamura , Haruo Akahoshi , Kunio Arai
IPC分类号： B23K26/00 , H05K3/00
CPC分类号： B23K26/18 , B23K26/009 , B23K26/382 , B23K26/389 , B23K26/40 , B23K2101/35 , B23K2101/42 , B23K2103/12 , B23K2103/172 , B23K2103/42 , B23K2103/50 , H05K3/0035 , H05K3/0038 , H05K3/0055 , H05K3/06 , H05K3/4652 , H05K2203/0315 , H05K2203/0346 , H05K2203/0793 , Y10T428/31678
摘要： There is provided a method for removing molten and scattered Cu and overhang that are generated around a via opening during laser machining in a direct laser via forming method of directly machining an outer-layer copper foil. In a manufacturing method of a printed wiring board of machining the via by laser directly through the copper foil of a copper-clad laminate in which the copper foil is clad on a base material resin, a process for machining the via is carried out in a sequence of (a) a copper foil surface treatment step of forming an oxide film on the surface of said copper foil, (b) a laser via machining step, (c) an alkali treatment step and (d) a molten and scattered Cu etching step. It is desirable to carry out (e) a de-smearing treatment after the molten and scattered Cu etching.
摘要翻译：提供了一种用于在直接加工外层铜箔的直接激光通孔形成方法的激光加工期间在通孔开口周围产生的熔融和分散的Cu和悬垂线的方法。在通过激光直接通过铜箔被覆在基材树脂上的覆铜层压板的铜箔进行加工通孔的印刷线路板的制造方法中，将通孔的加工过程（a）在所述铜箔的表面形成氧化膜的铜箔表面处理工序的顺序，（b）激光通孔机械加工工序，（c）碱处理工序和（d）熔融和散射的Cu蚀刻步。期望在熔融和散射的Cu蚀刻之后进行（e）去涂抹处理。

10. 发明授权

US07637702B2 Drilling method 有权
标题翻译：钻孔方法
公开(公告)号：US07637702B2
公开(公告)日：2009-12-29
申请号：US11489491
申请日：2006-07-20
申请人： Takao Furukawa , Hiroshi Kawasaki , Toshiyuki Iwata , Katsuhiro Nagasawa , Takahiko Yamashita
发明人： Takao Furukawa , Hiroshi Kawasaki , Toshiyuki Iwata , Katsuhiro Nagasawa , Takahiko Yamashita
IPC分类号： B23B35/00
CPC分类号： B23B35/00 , B23B39/161 , B23B39/24 , B23B2228/36 , B23B2270/486 , B23B2270/54 , H05K3/0008 , H05K3/0047 , H05K3/0097 , Y10T408/03 , Y10T408/175
摘要： There is provided a drilling method capable of improving machining accuracy of a printed board drilling apparatus as a whole by decreasing dispersion of the machining accuracy even if it is a multi-spindle printed board drilling apparatus. A misalignment of an axial center of a drill with respect to a designed axial center in X and Y directions is detected in advance per a certain number of revolutions of each spindle that rotates the drill. Holes of two or more types of diameter are made on a printed board by making holes of at least one diameter, e.g., an exposure master hole, per each spindle and by making holes of all other diameters almost simultaneously by all of the spindles.
摘要翻译：提供了一种能够通过降低加工精度的分散来提高印刷板钻孔设备的加工精度的钻孔方法，即使它是多轴印刷板钻孔设备。在旋转钻头的每个主轴的一定转数中，预先检测钻头的轴心在X和Y方向上相对于设计的轴向中心的偏移。通过为每个主轴制造至少一个直径的孔，例如曝光主孔，并且通过所有其他直径的孔几乎同时由所有主轴制成两个或更多种直径的孔。

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