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1. 发明授权

US11674239B2 Gallium oxide crystal manufacturing device 有权
公开(公告)号：US11674239B2
公开(公告)日：2023-06-13
申请号：US17183753
申请日：2021-02-24
申请人： Fujikoshi Machinery Corp. , SHINSHU UNIVERSITY , Novel Crystal Technology, Inc.
发明人： Keigo Hoshikawa , Takumi Kobayashi , Yoshio Otsuka , Toshinori Taishi
IPC分类号： C30B35/00 , C30B11/00
CPC分类号： C30B35/002 , C30B11/002 , C30B11/003 , C30B11/006
摘要： A gallium oxide crystal manufacturing device includes a crucible to hold a gallium oxide source material therein, a crucible support that supports the crucible from below, a crucible support shaft that is connected to the crucible support from below and vertically movably supports the crucible and the crucible support, a tubular furnace core tube that surrounds the crucible, the crucible support and the crucible support shaft, a tubular furnace inner tube that surrounds the furnace core tube, and a resistive heating element including a heat-generating portion placed in a space between the furnace core tube and the furnace inner tube. Melting points of the furnace core tube and the furnace inner tube are not less than 1900° C. A thermal conductivity of a portion of the furnace core tube located directly next to the crucible in a radial direction thereof is higher than a thermal conductivity of the furnace inner tube.

2. 发明授权

US11674238B2 Crucible for growing metal oxide single crystal 有权
公开(公告)号：US11674238B2
公开(公告)日：2023-06-13
申请号：US17158652
申请日：2021-01-26
申请人： Fujikoshi Machinery Corp.
发明人： Keigo Hoshikawa , Takumi Kobayashi , Yoshio Otsuka
IPC分类号： C30B35/00 , C30B29/16
CPC分类号： C30B35/002 , C30B29/16
摘要： A crucible for growing a metal oxide single crystal is provided that can facilitate the balance between the thickness and the strength (hardness) of the constant diameter portion of the crucible and is capable of performing growth of a crystal having a large diameter. The crucible according to the present invention is a crucible for growing a metal oxide single crystal, including a reinforcing belt material provided on an outer periphery of a constant diameter portion of the crucible. It is possible that the crucible has an upper portion having a thickness that is smaller than a thickness of a lower portion of the crucible, and the upper portion of the crucible is the constant diameter portion.

3. 发明授权

US10668593B2 Work polishing head 审中-公开
公开(公告)号：US10668593B2
公开(公告)日：2020-06-02
申请号：US15834983
申请日：2017-12-07
申请人： Fujikoshi Machinery Corp.
发明人： Masayuki Tsukada , Kazutaka Shibuya , Takayuki Fuse
IPC分类号： B24B37/10 , B24B37/30 , B24B37/32 , B24B37/005 , B24B37/04 , H01L21/304
摘要： The polishing head comprises: a head main body part; a carrier being connected to the head main body part; a pressure chamber; a fluid supplying section; a linear motion guide having an outer cylindrical body and a spline shaft, which is provided in the outer cylindrical body and capable of moving in an axial direction thereof, and which is prohibited to rotate with respect to the outer cylindrical body so as to transmit a rotational force to the spline shaft through the outer cylindrical body; and a rotation transmitting plate being provided between a lower end of the spline shaft and an upper face of the carrier, the rotation transmitting plate being capable of tiltably supporting the carrier and transmitting a rotational force of the spline shaft to the carrier.

4. 发明授权

US10464186B2 Method of polishing work and method of dressing polishing pad 有权
公开(公告)号：US10464186B2
公开(公告)日：2019-11-05
申请号：US15394274
申请日：2016-12-29
申请人： Fujikoshi Machinery Corp. , Kanazawa Institute of Technology
发明人： Kazutaka Shibuya , Jun Yanagisawa , Yoshio Nakamura , Michio Uneda , Kenichi Ishikawa
IPC分类号： B24B49/18 , B24B37/005 , B24B53/007 , B24B53/017 , B24B37/20 , B24B37/04 , B24B53/06 , B24B53/08
摘要： The method of the present invention comprises the steps of: previously obtaining correlation data between surface properties of the polishing pad dressed under a plurality of stages of dressing conditions and polishing effects of the work polished by the polishing pad dressed under the dressing conditions; determining an assumed dressing condition capable of achieving an object polishing effect from the correlation data; dressing the polishing pad under the assumed dressing condition determined; polishing the work; cleaning the polishing pad which has been used for polishing the work; and measuring a surface property of the cleaned polishing pad.

5. 发明授权

US10286521B2 Dressing apparatus and dressing method of polishing pad of double-side polishing apparatus 有权
公开(公告)号：US10286521B2
公开(公告)日：2019-05-14
申请号：US15200156
申请日：2016-07-01
申请人： Fujikoshi Machinery Corp.
发明人： Mitsuhiro Hara , Ryosuke Yoda
IPC分类号： B24B53/017
摘要： To provide a dressing apparatus capable of uniformly dressing a polishing pad. The apparatus includes first and second dressing grind stones 51 and 52 which grind polishing pads 17 and 18 by moving in a radial direction of upper and lower polishing plates 12 and 14 while abutting on corresponding polishing pads 17 and 18, in which the first and second dressing grind stones 51 and 52 are set so as to have: an inner side region portion P; an outer side region portion Q; and an intermediate region portion R, wherein the length of each of the inner side region portion P and the outer side region portion Q extending in a circumferential direction of the polishing plates 12 and 14 is longer than the length of the intermediate region portion R extending in a circumferential direction of the polishing plates.

6. 发明申请

US20170304992A1 POLISHING APPARATUS AND WAFER POLISHING METHOD 审中-公开
公开(公告)号：US20170304992A1
公开(公告)日：2017-10-26
申请号：US15512957
申请日：2015-09-25
申请人： SHIN-ETSU HANDOTAI CO., LTD. , FUJIKOSHI MACHINERY CORP.
发明人： Michito SATO , Junichi UENO , Kaoru ISHII , Hiromi KISHIDA , Yuya NAKANISHI , Ryosuke YODA , Yosuke KANAI
IPC分类号： B24B37/34 , B24B37/04 , B24B53/017 , H01L21/304
摘要： A polishing apparatus which is an index system polishing apparatus which includes a polishing head for holding a wafer, a plurality of turn tables to which polishing pads for polishing the wafer are attached, and a loading/unloading stage for loading the wafer to the polishing head or unloading the wafer from the polishing head, and which polishes the wafer while switching the turn tables to be used for polishing the wafer held at the polishing head by causing the polishing head to perform rotation movement, the polishing apparatus including a turn table upward and downward movement mechanism which allows the turn table to move upward and downward. With this polishing apparatus, it is possible to reduce an amount of displacement caused when moment load is applied on the polishing head during polishing.

7. 发明申请

US20170008147A1 DRESSING APPARATUS AND DRESSING METHOD OF POLISHING PAD OF DOUBLE-SIDE POLISHING APPARATUS 审中-公开
标题翻译：双面抛光装置抛光垫的连接装置和连接方法
公开(公告)号：US20170008147A1
公开(公告)日：2017-01-12
申请号：US15200156
申请日：2016-07-01
申请人： Fujikoshi Machinery Corp.
发明人： Mitsuhiro HARA , Ryosuke YODA
IPC分类号： B24B53/017
CPC分类号： B24B53/017
摘要： To provide a dressing apparatus capable of uniformly dressing a polishing pad. The apparatus includes first and second dressing grind stones 51 and 52 which grind polishing pads 17 and 18 by moving in a radial direction of upper and lower polishing plates 12 and 14 while abutting on corresponding polishing pads 17 and 18, in which the first and second dressing grind stones 51 and 52 are set so as to have: an inner side region portion P; an outer side region portion Q; and an intermediate region portion R, wherein the length of each of the inner side region portion P and the outer side region portion Q extending in a circumferential direction of the polishing plates 12 and 14 is longer than the length of the intermediate region portion R extending in a circumferential direction of the polishing plates.
摘要翻译：提供能够均匀地修整抛光垫的敷料装置。该设备包括第一和第二修整磨石51和52，其通过沿着上和下抛光板12和14的径向移动同时抵靠在相应的抛光垫17和18上来研磨抛光垫17和18，其中第一和第二修整磨石51和52被设定为具有：内侧区域部分P; 外侧区域部分Q; 和中间区域部R，其中，沿着研磨板12和14的周向延伸的内侧区域部分P和外侧区域部分Q的长度比中间区域部分R延伸的长度长在研磨板的圆周方向上。

8. 发明授权

US09431262B2 Method for polishing work and work polishing apparatus 有权
标题翻译：抛光工件和抛光装置的方法
公开(公告)号：US09431262B2
公开(公告)日：2016-08-30
申请号：US14637546
申请日：2015-03-04
申请人： FUJIKOSHI MACHINERY CORP.
发明人： Kazutaka Shibuya , Yoshio Nakamura
IPC分类号： H01L21/306 , B24B37/04 , B24B57/02 , C23F1/08 , C23F1/12 , C23F1/14 , H01L21/67 , H01J37/32 , H01L21/02 , H01L29/16 , H01L29/20
CPC分类号： B24B37/04 , B24B57/02 , C23F1/08 , C23F1/12 , C23F1/14 , H01J37/32055 , H01J37/32073 , H01J37/32348 , H01L21/02024 , H01L21/30625 , H01L21/67075 , H01L21/67092 , H01L29/1602 , H01L29/1608 , H01L29/2003
摘要： The method of the present invention is capable of polishing a high hardness work at high polishing efficiency. The method comprises the steps of: pressing a surface of the work onto a polishing part of a rotating polishing plate; and supplying slurry while performing the pressing step. The method is characterized in that an activated gas, which has been activated by gas discharge, is turned into bubbles and mixed into the slurry.
摘要翻译：本发明的方法能够以高抛光效率抛光高硬度的工件。该方法包括以下步骤：将工件的表面压在旋转的抛光板的抛光部分上; 并在进行压制步骤时供给浆料。该方法的特征在于，已经通过气体排出而活化的活性气体变成气泡并混合到浆料中。

9. 发明授权

US08888563B2 Polishing head capable of continuously varying pressure distribution between pressure regions for uniform polishing 有权
标题翻译：抛光头能够连续地改变压力区域之间的压力分布，以进行均匀抛光
公开(公告)号：US08888563B2
公开(公告)日：2014-11-18
申请号：US13195220
申请日：2011-08-01
申请人： Norihiko Moriya
发明人： Norihiko Moriya
IPC分类号： B24B29/00 , B24B37/30
CPC分类号： B24B37/30
摘要： A polishing apparatus which includes a polishing head for holding a work, and a polishing plate on which a polishing pad is adhered. The polishing head includes a holding plate, an elastic sheet member fixed to an edge of the holding plate, a ring-shaped template fixed to an outer edge of a lower face of the elastic sheet member, a pressure chamber formed between a lower face of the holding plate and an upper face of the elastic sheet member, a seal ring having a main body part which is fitted to a supporting plate, a seal lip, which slidelingly contacts the elastic sheet member and divides the inside of the pressure chamber into an inner divided chamber and an outer divided chamber; and a fluid supply section for individually supplying a fluid to the divided chambers.
摘要翻译：一种抛光装置，其包括用于保持工件的抛光头和其上附着有抛光垫的抛光板。抛光头包括保持板，固定到保持板的边缘的弹性片构件，固定到弹性片构件的下表面的外边缘的环形模板，形成在弹性片构件的下表面之间的压力室所述保持板和所述弹性片构件的上表面，密封环，其具有装配到支撑板的主体部，密封唇，其与所述弹性片构件滑动接触并将所述压力室的内部分隔成为内分隔室和外分隔室; 以及用于将流体单独地供应到分隔室的流体供应部。

10. 发明授权

US08808061B2 Method and apparatus for dressing polishing pad 有权
标题翻译：抛光垫修整方法及装置
公开(公告)号：US08808061B2
公开(公告)日：2014-08-19
申请号：US13164081
申请日：2011-06-20
申请人： Harumichi Koyama
发明人： Harumichi Koyama
IPC分类号： B24B33/00
CPC分类号： B24B37/08 , B24B53/017
摘要： The method of the present invention are capable of stabilizing a polishing rate, reducing number of times of performing dressing operations, improving work efficiency and extending a span of life of the polishing pad. The method for dressing a polishing pad, which has been used to polish a surface of a work by pressing the work onto the polishing pad fixed on a polishing plate with supplying slurry thereto, by using a grind stone, comprises the steps of: cleaning the polishing pad by supplying high-pressure cleaning water to the polishing pad; and dressing the polishing pad by moving a dressing grind stone, in the radial direction of the polishing pad, along a surface profile thereof, while performing the cleaning step.
摘要翻译：本发明的方法能够稳定抛光速度，减少进行修整操作的次数，提高工作效率并延长抛光垫的使用寿命。通过使用磨石将已经用于将工件压在固定在研磨板上的抛光垫上的抛光垫上的用于抛光工件表面的抛光垫的方法包括以下步骤：清洁抛光垫，通过向抛光垫提供高压清洗水; 并且在执行清洁步骤的同时沿着抛光垫的径向移动修整研磨石沿其表面轮廓来修整抛光垫。

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