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1. 发明授权

US10668593B2 Work polishing head 审中-公开
公开(公告)号：US10668593B2
公开(公告)日：2020-06-02
申请号：US15834983
申请日：2017-12-07
申请人： Fujikoshi Machinery Corp.
发明人： Masayuki Tsukada , Kazutaka Shibuya , Takayuki Fuse
IPC分类号： B24B37/10 , B24B37/30 , B24B37/32 , B24B37/005 , B24B37/04 , H01L21/304
摘要： The polishing head comprises: a head main body part; a carrier being connected to the head main body part; a pressure chamber; a fluid supplying section; a linear motion guide having an outer cylindrical body and a spline shaft, which is provided in the outer cylindrical body and capable of moving in an axial direction thereof, and which is prohibited to rotate with respect to the outer cylindrical body so as to transmit a rotational force to the spline shaft through the outer cylindrical body; and a rotation transmitting plate being provided between a lower end of the spline shaft and an upper face of the carrier, the rotation transmitting plate being capable of tiltably supporting the carrier and transmitting a rotational force of the spline shaft to the carrier.

2. 发明授权

US10464186B2 Method of polishing work and method of dressing polishing pad 有权
公开(公告)号：US10464186B2
公开(公告)日：2019-11-05
申请号：US15394274
申请日：2016-12-29
申请人： Fujikoshi Machinery Corp. , Kanazawa Institute of Technology
发明人： Kazutaka Shibuya , Jun Yanagisawa , Yoshio Nakamura , Michio Uneda , Kenichi Ishikawa
IPC分类号： B24B49/18 , B24B37/005 , B24B53/007 , B24B53/017 , B24B37/20 , B24B37/04 , B24B53/06 , B24B53/08
摘要： The method of the present invention comprises the steps of: previously obtaining correlation data between surface properties of the polishing pad dressed under a plurality of stages of dressing conditions and polishing effects of the work polished by the polishing pad dressed under the dressing conditions; determining an assumed dressing condition capable of achieving an object polishing effect from the correlation data; dressing the polishing pad under the assumed dressing condition determined; polishing the work; cleaning the polishing pad which has been used for polishing the work; and measuring a surface property of the cleaned polishing pad.

3. 发明授权

US10286521B2 Dressing apparatus and dressing method of polishing pad of double-side polishing apparatus 有权
公开(公告)号：US10286521B2
公开(公告)日：2019-05-14
申请号：US15200156
申请日：2016-07-01
申请人： Fujikoshi Machinery Corp.
发明人： Mitsuhiro Hara , Ryosuke Yoda
IPC分类号： B24B53/017
摘要： To provide a dressing apparatus capable of uniformly dressing a polishing pad. The apparatus includes first and second dressing grind stones 51 and 52 which grind polishing pads 17 and 18 by moving in a radial direction of upper and lower polishing plates 12 and 14 while abutting on corresponding polishing pads 17 and 18, in which the first and second dressing grind stones 51 and 52 are set so as to have: an inner side region portion P; an outer side region portion Q; and an intermediate region portion R, wherein the length of each of the inner side region portion P and the outer side region portion Q extending in a circumferential direction of the polishing plates 12 and 14 is longer than the length of the intermediate region portion R extending in a circumferential direction of the polishing plates.

4. 发明申请

US20170304992A1 POLISHING APPARATUS AND WAFER POLISHING METHOD 审中-公开
公开(公告)号：US20170304992A1
公开(公告)日：2017-10-26
申请号：US15512957
申请日：2015-09-25
申请人： SHIN-ETSU HANDOTAI CO., LTD. , FUJIKOSHI MACHINERY CORP.
发明人： Michito SATO , Junichi UENO , Kaoru ISHII , Hiromi KISHIDA , Yuya NAKANISHI , Ryosuke YODA , Yosuke KANAI
IPC分类号： B24B37/34 , B24B37/04 , B24B53/017 , H01L21/304
摘要： A polishing apparatus which is an index system polishing apparatus which includes a polishing head for holding a wafer, a plurality of turn tables to which polishing pads for polishing the wafer are attached, and a loading/unloading stage for loading the wafer to the polishing head or unloading the wafer from the polishing head, and which polishes the wafer while switching the turn tables to be used for polishing the wafer held at the polishing head by causing the polishing head to perform rotation movement, the polishing apparatus including a turn table upward and downward movement mechanism which allows the turn table to move upward and downward. With this polishing apparatus, it is possible to reduce an amount of displacement caused when moment load is applied on the polishing head during polishing.

5. 发明申请

US20170008147A1 DRESSING APPARATUS AND DRESSING METHOD OF POLISHING PAD OF DOUBLE-SIDE POLISHING APPARATUS 审中-公开
标题翻译：双面抛光装置抛光垫的连接装置和连接方法
公开(公告)号：US20170008147A1
公开(公告)日：2017-01-12
申请号：US15200156
申请日：2016-07-01
申请人： Fujikoshi Machinery Corp.
发明人： Mitsuhiro HARA , Ryosuke YODA
IPC分类号： B24B53/017
CPC分类号： B24B53/017
摘要： To provide a dressing apparatus capable of uniformly dressing a polishing pad. The apparatus includes first and second dressing grind stones 51 and 52 which grind polishing pads 17 and 18 by moving in a radial direction of upper and lower polishing plates 12 and 14 while abutting on corresponding polishing pads 17 and 18, in which the first and second dressing grind stones 51 and 52 are set so as to have: an inner side region portion P; an outer side region portion Q; and an intermediate region portion R, wherein the length of each of the inner side region portion P and the outer side region portion Q extending in a circumferential direction of the polishing plates 12 and 14 is longer than the length of the intermediate region portion R extending in a circumferential direction of the polishing plates.
摘要翻译：提供能够均匀地修整抛光垫的敷料装置。该设备包括第一和第二修整磨石51和52，其通过沿着上和下抛光板12和14的径向移动同时抵靠在相应的抛光垫17和18上来研磨抛光垫17和18，其中第一和第二修整磨石51和52被设定为具有：内侧区域部分P; 外侧区域部分Q; 和中间区域部R，其中，沿着研磨板12和14的周向延伸的内侧区域部分P和外侧区域部分Q的长度比中间区域部分R延伸的长度长在研磨板的圆周方向上。

6. 发明授权

US09431262B2 Method for polishing work and work polishing apparatus 有权
标题翻译：抛光工件和抛光装置的方法
公开(公告)号：US09431262B2
公开(公告)日：2016-08-30
申请号：US14637546
申请日：2015-03-04
申请人： FUJIKOSHI MACHINERY CORP.
发明人： Kazutaka Shibuya , Yoshio Nakamura
IPC分类号： H01L21/306 , B24B37/04 , B24B57/02 , C23F1/08 , C23F1/12 , C23F1/14 , H01L21/67 , H01J37/32 , H01L21/02 , H01L29/16 , H01L29/20
CPC分类号： B24B37/04 , B24B57/02 , C23F1/08 , C23F1/12 , C23F1/14 , H01J37/32055 , H01J37/32073 , H01J37/32348 , H01L21/02024 , H01L21/30625 , H01L21/67075 , H01L21/67092 , H01L29/1602 , H01L29/1608 , H01L29/2003
摘要： The method of the present invention is capable of polishing a high hardness work at high polishing efficiency. The method comprises the steps of: pressing a surface of the work onto a polishing part of a rotating polishing plate; and supplying slurry while performing the pressing step. The method is characterized in that an activated gas, which has been activated by gas discharge, is turned into bubbles and mixed into the slurry.
摘要翻译：本发明的方法能够以高抛光效率抛光高硬度的工件。该方法包括以下步骤：将工件的表面压在旋转的抛光板的抛光部分上; 并在进行压制步骤时供给浆料。该方法的特征在于，已经通过气体排出而活化的活性气体变成气泡并混合到浆料中。

7. 发明申请

US20020056548A1 Heat exchanger 审中-公开
标题翻译：热交换器
公开(公告)号：US20020056548A1
公开(公告)日：2002-05-16
申请号：US10007820
申请日：2001-12-05
申请人： Fujikoshi Machinery Corp.
发明人： Yoshio Nakamura , Yoshio Otsuka
IPC分类号： F28D007/10
CPC分类号： F28D7/106 , B24B57/02 , F28F21/04 , Y10S165/905 , Y10T29/4935 , Y10T29/49361 , Y10T29/5176
摘要： The heat exchanger of the present invention is capable of easily adjusting temperature of a machining liquid, e.g., slurry, etching liquid. The heat exchanger of the present invention, which adjusts temperature of the machining liquid, comprises a ceramic heat exchanging tube, which is made by baking silicon carbide (SiC).
摘要翻译：本发明的热交换器能够容易地调节加工液体的温度，例如浆料蚀刻液体。调整加工液温度的本发明的热交换器包括通过烧结碳化硅（SiC）制成的陶瓷热交换管。

8. 发明授权

US10737365B2 Turn table transport carriage 有权
公开(公告)号：US10737365B2
公开(公告)日：2020-08-11
申请号：US15513477
申请日：2015-10-02
申请人： SHIN-ETSU HANDOTAI CO., LTD. , FUJIKOSHI MACHINERY CORP.
发明人： Michito Sato , Yosuke Kanai
IPC分类号： B24B37/34 , F16M11/10 , F16M11/42 , B24B37/24 , B62B3/02 , H01L21/677 , H01L21/687 , H01L21/304 , A47B3/10 , B24B37/04
摘要： A turn table transport carriage configured to carry a turn table removed from a polishing apparatus or turn table which is to be disposed to the polishing apparatus, turn table transport carriage including a turn table holding section configured to hold the turn table, support base which supports the turn table holding section from a lower side, elevating mechanism which moves up and down the turn table holding section, and inclination mechanism which inclines the turn table holding section holding the turn table, the turn table transport carriage being characterized by enabling carrying the turn table in a state where the turn table holding section holding the turn table is inclined by the inclination mechanism. Consequently, there is provided the turn table transport carriage which has a narrow width at the time of carrying the turn table and can reduce a width of a passage for carrying the turntable.

9. 发明授权

US10532442B2 Polishing apparatus and wafer polishing method 有权
公开(公告)号：US10532442B2
公开(公告)日：2020-01-14
申请号：US15512957
申请日：2015-09-25
申请人： SHIN-ETSU HANDOTAI CO., LTD. , FUJIKOSHI MACHINERY CORP.
发明人： Michito Sato , Junichi Ueno , Kaoru Ishii , Hiromi Kishida , Yuya Nakanishi , Ryosuke Yoda , Yosuke Kanai
IPC分类号： B24B37/34 , B24B27/00 , B24B25/00 , B24B37/04 , B24B53/017 , H01L21/304
摘要： A polishing apparatus which is an index system polishing apparatus which includes a polishing head for holding a wafer, a plurality of turn tables to which polishing pads for polishing the wafer are attached, and a loading/unloading stage for loading the wafer to the polishing head or unloading the wafer from the polishing head, and which polishes the wafer while switching the turn tables to be used for polishing the wafer held at the polishing head by causing the polishing head to perform rotation movement, the polishing apparatus including a turn table upward and downward movement mechanism which allows the turn table to move upward and downward. With this polishing apparatus, it is possible to reduce an amount of displacement caused when moment load is applied on the polishing head during polishing.

10. 发明授权

US10449655B2 Work polishing method and work polishing apparatus 有权
公开(公告)号：US10449655B2
公开(公告)日：2019-10-22
申请号：US15860794
申请日：2018-01-03
申请人： Fujikoshi Machinery Corp. , Kanazawa Institute of Technology
发明人： Kazutaka Shibuya , Yoshio Nakamura , Michio Uneda , Kenichi Ishikawa
IPC分类号： B24B53/017 , B24B37/10 , B24B49/12
摘要： The polishing apparatus comprises: a dressing section for dressing a polishing pad; a measuring section for measuring a surface property of the polishing pad; a polishing result measuring section for measuring a polishing result of a work; a storing section for storing correlation data between dressing condition data for dressing the polishing pad, surface property of the polishing pad and polishing results, which are learned by an artificial intelligence; and an input section for inputting an object polishing result. The artificial intelligence performs a first arithmetic process, in which the surface property of the polishing pad corresponding to the object polishing result is inversely estimated on the basis of the correlation data, and a second arithmetic process, in which the corresponding dressing condition is derived on the basis of the surface property of the polishing pad inversely estimated.

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