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81. 发明申请

US20060194521A1 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US20060194521A1
公开(公告)日：2006-08-31
申请号：US11386888
申请日：2006-03-23
申请人： Kenji Kamimura , Norio Kimura , Satoshi Okamura , Hideo Aizawa , Makoto Akagi , Katsuhiko Tokushige , Hisanori Matsuo , Manabu Tsujimura
发明人： Kenji Kamimura , Norio Kimura , Satoshi Okamura , Hideo Aizawa , Makoto Akagi , Katsuhiko Tokushige , Hisanori Matsuo , Manabu Tsujimura
IPC分类号： B24B1/00 , B24B29/00 , B24B21/18
CPC分类号： B24B53/017 , B24B29/005 , B24B53/003 , H01L21/30625
摘要： The present invention relates to a polishing apparatus for polishing a workpiece, such as a semiconductor wafer, to a flat mirror finish. The polishing apparatus comprises a polishing table having a polishing surface, and a top ring, and the workpiece is interposed between the polishing table and the top ring and pressed at a predetermined pressure to polish the workpiece. The polishing apparatus comprises at least two dressing units for dressing the polishing surface by being brought into contact with the ppolishing surface, which is a surface of a polishing cloth.
摘要翻译：本发明涉及一种用于将诸如半导体晶片的工件抛光成平面镜面抛光的抛光装置。抛光装置包括具有抛光表面的抛光台和顶环，并且将工件插入在抛光台和顶环之间并以预定压力被压制以抛光工件。抛光装置包括至少两个修整单元，用于通过与作为抛光布表面的抛光表面接触来修整抛光表面。

82. 发明申请

US20060183410A1 Diamond conditioning of soft chemical mechanical planarization/polishing (CMP) polishing pads 审中-公开
标题翻译：软化学机械平面化/抛光（CMP）抛光垫的金刚石调理
公开(公告)号：US20060183410A1
公开(公告)日：2006-08-17
申请号：US11402449
申请日：2006-04-12
申请人： Barak Yardeni , Boaz Eldad , Philip Slutsky , Dan Doron
发明人： Barak Yardeni , Boaz Eldad , Philip Slutsky , Dan Doron
IPC分类号： B24B1/00 , B24B29/00 , B24B21/18
CPC分类号： B24B53/017
摘要： Conditioning of chemical mechanical planarization (CMP) using conventional diamond-embedded abrasive strips are well suited to condition conventional “hard” polishing but not soft polishing pads because the diamonds not only remove waste material, but they also damage the polishing surface of the pad. Embodiments of the present invention condition soft polishing pads using diamond strips without damaging the soft polishing pad.
摘要翻译：使用传统的金刚石嵌入式磨料条调理化学机械平面化（CMP）非常适用于调节常规的“硬”抛光，但不适用于软抛光垫，因为金刚石不仅可以去除废料，而且还会损坏焊盘的抛光表面。本发明的实施例使用金刚石条而不损坏软抛光垫来调节软抛光垫。

83. 发明申请

US20060160474A1 Magnetically secured retaining ring 失效
公开(公告)号：US20060160474A1
公开(公告)日：2006-07-20
申请号：US11316413
申请日：2005-12-21
申请人： Ming-Kuei Tseng , Ralph Wadensweiler
发明人： Ming-Kuei Tseng , Ralph Wadensweiler
IPC分类号： B24B7/30 , B24B29/00
CPC分类号： B24B37/32
摘要： A retaining ring having a bottom portion that is removable from the ring's upper portion is described. The upper and lower portions of the retaining ring include one or more magnetic bodies and/or one or more bodies formed of a material that is attracted to magnets.

84. 发明申请

US20060154572A1 HIGH-PRESSURE POLISHING APPARATUS AND METHOD 审中-公开
标题翻译：高压抛光装置及方法
公开(公告)号：US20060154572A1
公开(公告)日：2006-07-13
申请号：US11033678
申请日：2005-01-13
申请人： Wen-Chung Huang
发明人： Wen-Chung Huang
IPC分类号： B24B7/30 , B24B29/00
CPC分类号： B24B53/017
摘要： A high-pressure polishing apparatus and method comprising a condenser having high-pressure nozzles for ejecting a solution on the polishing pad to perform a conditioning, thereby preventing damage to the wafer and destruction of the diamond condenser due to a larger force applied on the diamond condenser in order to obtain a better status of polishing pad. The present invention can be applied to a conventional machine.
摘要翻译：一种高压抛光装置和方法，包括具有用于在抛光垫上喷射溶液的高压喷嘴的冷凝器，以执行调节，从而防止由于施加在钻石上的较大的力而损坏晶片和破坏金刚石冷凝器冷凝器为了获得更好的抛光垫状态。本发明可以应用于传统的机器。

85. 发明申请

US20060148387A1 Vibration damping in chemical mechanical polishing system 失效
标题翻译：化学机械抛光系统中的振动阻尼
公开(公告)号：US20060148387A1
公开(公告)日：2006-07-06
申请号：US11333992
申请日：2006-01-17
申请人： Hung Chen , John White , Shijian Li , Fred Redeker , Ramin Emami
发明人： Hung Chen , John White , Shijian Li , Fred Redeker , Ramin Emami
IPC分类号： B24B29/00
CPC分类号： B24B37/30 , B24B37/12 , B24B37/32 , B24B41/007
摘要： A carrier head for chemical mechanical polishing, includes a base, a support structure attached to the base having a surface for contacting a substrate, and a retaining structure attached to the base to prevent the substrate from moving along the surface. The retaining structure and the surface define a cavity for receiving the substrate. The retaining structure includes an upper portion in contact with the base, a lower portion, and a vibration damper separating the upper portion and the lower portion. The vibration damper, the vibration damper includes a material that does not rebound to its original shape when subjected to a deformation.
摘要翻译：用于化学机械抛光的载体头包括基底，附着到具有用于接触基底的表面的基部的支撑结构以及附接到基部的保持结构，以防止基底沿着表面移动。保持结构和表面限定用于接收基底的空腔。保持结构包括与基座接触的上部，下部和分隔上部和下部的振动阻尼器。振动阻尼器，减震器包括当经受变形时不能反弹到其原始形状的材料。

86. 发明授权

US07048615B2 Pad backer and CMP process using the same 有权
标题翻译：垫片支架和CMP工艺使用相同
公开(公告)号：US07048615B2
公开(公告)日：2006-05-23
申请号：US10908781
申请日：2005-05-26
申请人： Li-Min Chang , Tong Liao , Chen-Wen Pao , Justin Huang
发明人： Li-Min Chang , Tong Liao , Chen-Wen Pao , Justin Huang
IPC分类号： B24B29/00
CPC分类号： B24B37/32 , B24B37/30
摘要： A pad backer is described, comprising a backing plate, an elastomer layer and a pad backing ring. The elastomer layer has a bottom surface bonded to the backing plate and an upper surface with a protrudent part at the edge portion thereof. The pad backing ring has an inner bottom surface with a recessed part thereon matching with the protrudent part on the upper surface of the elastomer layer, such that the elastomer layer is fixed onto the pad backing ring through engagement of the protrudent part and the recessed part.
摘要翻译：描述垫衬垫，其包括背板，弹性体层和衬垫背衬环。弹性体层具有与背板接合的底表面和在其边缘部分具有突出部分的上表面。垫衬环具有内底面，其内部的凹部与弹性体层的上表面上的突出部分匹配，使得弹性体层通过突出部和凹部的接合而固定到垫衬环上。

87. 发明申请

US20060099892A1 Substrate holding apparatus and polishing apparatus 有权
公开(公告)号：US20060099892A1
公开(公告)日：2006-05-11
申请号：US11312571
申请日：2005-12-21
申请人： Tetsuji Togawa , Osamu Nabeya , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Teruhiko Ichimura
发明人： Tetsuji Togawa , Osamu Nabeya , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Teruhiko Ichimura
IPC分类号： B24B47/00 , B24B29/00
CPC分类号： B24B37/30 , B24B41/061 , B24B49/105
摘要： The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and a vertically movable member which is vertically movable within the receiving space in the top ring body. An abutment member having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane of the abutment member comprises an abutment portion, having a flange projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion extending upwardly from a base portion of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than that of material of the abutment portion.

88. 发明授权

US07033253B2 Polishing pad conditioners having abrasives and brush elements, and associated systems and methods 失效
标题翻译：具有磨料和刷子元件的抛光垫调节器以及相关系统和方法
公开(公告)号：US07033253B2
公开(公告)日：2006-04-25
申请号：US10917180
申请日：2004-08-12
申请人： Freddie L. Dunn
发明人： Freddie L. Dunn
IPC分类号： B24B29/00
CPC分类号： B24B53/017 , B24B53/12
摘要： Systems and methods for conditioning polishing pads are disclosed. A system in accordance with one embodiment of the invention includes a polishing support configured to carry a microfeature workpiece polishing pad, and a conditioner positioned at least proximate to the support to condition a polishing pad carried by the support. The conditioner can include a first portion (e.g., an abrasive portion) having a first hardness and being positioned to contact a polishing pad carried by the support, and a second portion (e.g., a brush portion) having a second hardness less than the first hardness and being positioned proximate to the first portion.
摘要翻译：公开了用于调节抛光垫的系统和方法。根据本发明的一个实施例的系统包括配置成承载微特征工件抛光垫的抛光支撑件和至少靠近支撑件的调节器，以调节由支撑件承载的抛光垫。护发素可以包括具有第一硬度的第一部分（例如，磨料部分），并且定位成接触由支撑件承载的抛光垫，以及具有小于第一硬度的第二硬度的第二部分（例如，刷部分）硬度并靠近第一部分定位。

89. 发明申请

US20060079160A1 POLISHING PAD CONDITIONER WITH SHAPED ABRASIVE PATTERNS AND CHANNELS 有权
标题翻译：抛光垫调节器与形状磨砂图案和通道
公开(公告)号：US20060079160A1
公开(公告)日：2006-04-13
申请号：US10962890
申请日：2004-10-12
申请人： Venkata Balagani , George Lazari , Kenny Ngan
发明人： Venkata Balagani , George Lazari , Kenny Ngan
IPC分类号： B24B29/00
CPC分类号： B24B53/017 , B24B53/12
摘要： A polishing pad conditioner comprises a base and a pad conditioning face on the base. The conditioning face comprises central and peripheral regions. Abrasive spokes having a substantially constant width of abrasive particles, extend from the central to the peripheral region. The spokes are symmetric and radially spaced apart from one another, and may have a variety of shapes. The conditioning face can also have a cutout inlet channel to receive polishing slurry when the conditioning face is rubbed against a polishing pad, a conduit to receive the polishing slurry from the cutout inlet channel, and an outlet on the peripheral edge of the base to discharge the received polishing slurry.
摘要翻译：抛光垫调节器包括底座和底座上的垫调节面。调理面包括中央和周边区域。具有基本恒定的磨料颗粒宽度的研磨轮辐从中心延伸到周边区域。轮辐是对称的并且彼此径向间隔开，并且可以具有各种形状。调理面还可以具有切口入口通道，用于在将调理面摩擦抛光垫时接收抛光浆料，从切口入口通道接收抛光浆料的导管，以及在基部周边的出口排出接收的抛光浆料。

90. 发明授权

US06971951B2 Power tool with portable power source 有权
标题翻译：电动工具带便携式电源
公开(公告)号：US06971951B2
公开(公告)日：2005-12-06
申请号：US10247209
申请日：2002-09-19
申请人： Christopher T. Boyer
发明人： Christopher T. Boyer
IPC分类号： B24B23/00 , B24B23/02 , B24B29/00 , B24B31/12 , B25F5/02
CPC分类号： B24B29/00 , B24B23/00 , B25F5/02
摘要： A power tool in accordance with the invention includes a housing having an internal compartment with a motor therein, a handle connected to the housing for maneuvering the power tool, a working element connected to and driven by the motor to work on a workpiece, and a removable, portable power source having a first position wherein the power source is located primarily in the internal compartment of the housing and being electrically connected to the motor to provide power to the motor for driving the working element and a second position wherein the power source is located remotely from the housing and detached electrically from the motor. A preferred embodiment of the tool also includes a lock associated with the apparatus which has a lock position that prevents the removable, portable power source from unintentionally becoming separated from the power tool, and an unlock position that enables the removable portable power source to be selectively removed from the internal compartment of the housing and separated from the power tool. A preferred embodiment of the power tool includes the use of a rechargeable, removable, portable power source and an electrical connector which allows the power tool to be powered by an alternate power source located externally of the power tool.
摘要翻译：根据本发明的电动工具包括具有内部电动机的内部壳体的壳体，连接到壳体的手柄，用于操纵动力工具，连接到电动机并由其驱动以工作在工件上的工作元件，以及具有第一位置的可拆卸便携式电源，其中电源主要位于壳体的内部隔室中并且电连接到电动机以向电动机提供电力以驱动工作元件，以及第二位置，其中电源是远离壳体并与电机电气分离。该工具的优选实施例还包括与该装置相关联的锁，其具有防止可拆卸便携式电源与电动工具分离的锁定位置，以及解锁位置，其使得可移动便携式电源能够选择性地从壳体的内部隔间移除并与电动工具分离。电动工具的优选实施例包括使用可充电的，可移动的便携式电源和电连接器，其允许电动工具由位于电动工具外部的备用电源供电。

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