专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

81. 发明授权

US5599747A Method of making circuitized substrate 失效
标题翻译：制造电路化基板的方法
公开(公告)号：US5599747A
公开(公告)日：1997-02-04
申请号：US495248
申请日：1995-06-27
申请人： Ashwinkumar C. Bhatt , Thomas P. Duffy , David E. Houser , Gerald W. Jones , Jeffrey McKeveny , Kenneth L. Potter
发明人： Ashwinkumar C. Bhatt , Thomas P. Duffy , David E. Houser , Gerald W. Jones , Jeffrey McKeveny , Kenneth L. Potter
IPC分类号： H01L23/12 , H01L23/14 , H01L23/367 , H01L23/498 , H05K1/02 , H05K1/03 , H05K1/18 , H05K3/00 , H05K7/02 , H01L21/60
CPC分类号： H05K1/021 , H01L23/145 , H01L23/3677 , H01L23/49822 , H01L2224/45144 , H01L2224/48091 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/1532 , H05K1/182 , H05K2201/09127 , H05K2201/09981 , H05K2203/049 , H05K3/0061 , Y10T29/4913 , Y10T29/49155
摘要： A method of making a circuitized substrate which may be utilized as a chip carrier structure. The method involves the steps of providing a dielectric member and partially routing this member to define a temporary support portion therein. Metallization and circuitization may then occur, following which the temporary support portion is removed. This temporary support thus assures effective support for the photoresist used as part of the circuitization process. Thus, the photoresist is capable of being applied in sheetlike form for spanning the relatively small openings of the dielectric without sagging, bowing, etc., which may adversely impact subsequent processing steps.
摘要翻译：制造可用作芯片载体结构的电路化衬底的方法。该方法包括提供电介质构件并部分地布置该构件以在其中限定临时支撑部分的步骤。然后可以发生金属化和电路化，随后移除临时支撑部分。因此，这种临时支撑物确保了作为电路化过程的一部分使用的光致抗蚀剂的有效支撑。因此，光致抗蚀剂能够以片状形式施加以跨越电介质的相对小的开口而不会下垂，弯曲等，这可能不利地影响随后的处理步骤。

82. 发明授权

US5359168A Switching and control mechanisms 失效
标题翻译：切换和控制机制
公开(公告)号：US5359168A
公开(公告)日：1994-10-25
申请号：US174754
申请日：1993-12-29
申请人： Peter R. Cunningham
发明人： Peter R. Cunningham
IPC分类号： G01K3/04 , G07C11/00 , H01H3/00 , H05K1/00 , H05K5/02 , H01H85/00
CPC分类号： H05K5/0208 , G01K3/04 , G07C11/00 , H01H3/00 , H05K1/0293 , H05K1/029 , H05K2201/0909 , H05K2201/09127 , H05K2203/175
摘要： In FIG. 1, an electrical circuit on a circuit board 9 can be controlled by operation of switches 2B, 3B, 4B. These are operated by removing portions of the board 9, effected by the snapping off of respective corresponding cover member portions 2A, 3A and 4A.When used as a thermal log this control can respectively activate, deactivate and display the thermal data but avoid any tampering.
摘要翻译：在图如图1所示，可以通过开关2B，3B，4B的操作来控制电路板9上的电路。这些通过移除相应的相应的盖构件部分2A，3A和4A的扣合而移除板9的部分来操作。当用作热记录时，该控件可以分别激活，停用和显示热数据，但是避免任何篡改。

83. 发明授权

US5112230A Reconfigurable substrate for electric circuit connections 失效
标题翻译：用于电路连接的可重构衬底
公开(公告)号：US5112230A
公开(公告)日：1992-05-12
申请号：US728460
申请日：1991-07-11
申请人： Michael J. DeSimone
发明人： Michael J. DeSimone
IPC分类号： H05K1/00
CPC分类号： H05K1/0293 , H05K1/029 , H05K2201/0394 , H05K2201/09063 , H05K2201/0909 , H05K2201/09127 , H05K2203/0195 , H05K2203/175 , Y10T29/49156
摘要： A reconfigurable substrate is provided for supporting electrical elements. A conductive strip is disposed on the substrate for linking at least two electrical elements. The substrate has a portion has a portion proximate to the strip for permitting subsequent removal thereof, thereby severing the conductive strip. Thus, a connection of electrical elements may be selectively varied as a function of specification of options which become operative by subsequent removal of a portion of the substrate proximate to the conductive strip.
摘要翻译：提供了用于支撑电气元件的可重新配置的基板。导电带设置在基板上用于连接至少两个电气元件。衬底具有一部分靠近条带的部分，以允许随后的去除，从而切断导电条。因此，电气元件的连接可以根据选项的规格的选择而有选择地变化，这些选项通过随后移除靠近导电带的基板的一部分而变得有效。

84. 发明授权

US4985808A Printed circuit board switching system for resistor network 失效
标题翻译：用于电阻网络的印刷电路板开关系统
公开(公告)号：US4985808A
公开(公告)日：1991-01-15
申请号：US266140
申请日：1988-11-02
申请人： Jeffrey P. Zernov
发明人： Jeffrey P. Zernov
IPC分类号： H01C17/23 , H05K1/00 , H05K1/16
CPC分类号： H01C17/23 , H05K1/0293 , H05K1/029 , H05K1/167 , H05K2201/0909 , H05K2201/09127 , H05K2203/171 , H05K2203/175
摘要： A printed circuit or printed wire board has a resistor network thereon, wired through conductors that are arranged so that individual circuit paths for different resistor combinations pass onto one of a plurality of peripheral tabs on the printed circuit board. The tabs are joined to the main portion of the circuit board through a frangible connection which permits breaking off the tabs. The main circuit into which the board is to be connected is tested to determine the needed circuit characteristics, and all but one of the tabs on the board are removed to provide the required circuit connections for matching the printed wire board circuit to the main circuit. The breakaway tabs permit selecting a particular circuit impedance so that the board is matched to the main circuit in which it is connected. The board is primarily used for compensation of a communications network where the loop loss of a telephone system is set to the right value.
摘要翻译：印刷电路板或印刷线路板上具有电阻网络，布线通过导体布置成使得用于不同电阻器组合的各个电路路径通过印刷电路板上的多个外围接片中的一个。突片通过允许断开突片的易碎连接而连接到电路板的主要部分。测试电路板连接的主电路以确定所需的电路特性，除去电路板上的所有突出部分之外的所有电路，以提供所需的电路连接，以将印刷线路板电路与主电路匹配。分离片允许选择特定的电路阻抗，使得电路板与其连接的主电路匹配。电路板主要用于对电话系统的环路损耗设置为正确值的通信网络的补偿。

85. 发明授权

US4918573A Electrical circuit and an adjustable component spacer used therein 失效
标题翻译：电路和其中使用的可调部件间隔件
公开(公告)号：US4918573A
公开(公告)日：1990-04-17
申请号：US393154
申请日：1989-08-14
申请人： Dean J. Stavraka , John W. Swann
发明人： Dean J. Stavraka , John W. Swann
IPC分类号： H05K3/30
CPC分类号： H05K3/306 , H05K2201/09127 , H05K2201/09954 , H05K2201/10651 , H05K2201/2036 , H05K3/301
摘要： A component spacer is disposed in an electrical circuit between a circuit component such as a resistor having two leads and a printed circuit board to which the resistor leads are connected to maintain a gap between them. The component spacer has a generally flat partition with vertically extending projections for contacting the printed circuit board. An elongated slot defined by a bifurcated section and a spaced aperture extend through the partition for receiving the resistor leads.
摘要翻译：组件间隔件设置在诸如具有两个引线的电阻器的电路部件和连接有电阻器引线的印刷电路板之间的电路中，以在它们之间保持间隙。部件间隔件具有大致平坦的隔板，其具有用于接触印刷电路板的垂直延伸的突起。由分叉部分和间隔开的孔限定的细长槽延伸穿过隔板以接收电阻器引线。

86. 发明申请

US20180257364A1 USE OF NONSTICK MATERIAL FOR THE PRODUCTION OF CAVITIES IN A PRINTED CIRCUIT BOARD 审中-公开
公开(公告)号：US20180257364A1
公开(公告)日：2018-09-13
申请号：US15980864
申请日：2018-05-16
申请人： AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
发明人： Gerald Weidinger , Gunther Weichslberger , Markus Leitgeb , Johannes Stahr
IPC分类号： B32B37/26 , C08L91/06 , H05K3/46 , H05K1/18
CPC分类号： B32B37/26 , C08L91/06 , H05K1/183 , H05K3/4652 , H05K3/4691 , H05K2201/09127 , Y10T156/1064 , Y10T156/1153 , Y10T156/1195 , Y10T428/24802 , Y10T428/265
摘要： The invention relates to a nonstick material for use during removal of a part (11) of a substantially planar material layer (2) which is connected in a connecting step to at least on further, substantially planar material layer (9). According to the invention, the nonstick material (8) has a different polarity than the adjoining, substantially planar material layers (2, 9). The invention also relates to a method for removing a part (11) of a substantially planar material layer (2) which is connected in a connecting step to at least one further, substantially planar material layer (9), to a multilayer structure which consists of at least two substantially planar material layers (2, 9) to be interconnected, and to a use of the same, especially in a multilayer printed circuit board.

87. 发明申请

US20180242456A1 Conductor-Structure Element Having an Internal Layer Substrate Laminated into Same, and Method for the Production Thereof 审中-公开
公开(公告)号：US20180242456A1
公开(公告)日：2018-08-23
申请号：US15748100
申请日：2016-08-10
申请人： Schweizer Electronic AG
发明人： Thomas GOTTWALD , Christian RÖSSLE
IPC分类号： H05K1/18 , H05K3/46 , H05K1/02 , H05K1/11 , H01Q1/38
CPC分类号： H05K1/186 , H01Q1/38 , H05K1/024 , H05K1/0243 , H05K1/115 , H05K1/181 , H05K1/185 , H05K3/4614 , H05K3/4617 , H05K3/462 , H05K3/4694 , H05K3/4697 , H05K2201/015 , H05K2201/09127 , H05K2201/09509 , H05K2201/09936 , H05K2201/10098 , H05K2201/10378 , H05K2203/0285 , H05K2203/063 , H05K2203/166
摘要： Method for producing a conductor structural element with a layer sequence having an internal layer substrate, including the steps: providing a rigid carrier having an underside and a top side; defining a cut-out section on the rigid carrier; applying at least one electrically insulating layer with a recess in such a way that the cut-out section is exposed; placing an internal layer substrate above the cut-out section with formation of a cavity between the rigid carrier and the internal layer substrate; aligning and fixing the internal layer substrate relative to the rigid carrier; laminating the layer construction prepared in this manner such that resin material of the at least one electrically insulating layer liquefies and encloses the internal layer substrate with the cavity being left free; producing a cut-out by cutting the cut-out section out of the rigid carrier from the outer underside of the rigid carrier.

88. 发明授权

US10054300B2 Light board 有权
公开(公告)号：US10054300B2
公开(公告)日：2018-08-21
申请号：US15097946
申请日：2016-04-13
申请人： Hubbell Incorporated
发明人： Derek B. Baker , Cory A. Passerello , Thomas Clawson
IPC分类号： F21V23/00 , F21V23/06 , F21S8/04 , H05K1/02 , F21Y103/10 , F21Y115/10
CPC分类号： F21V23/003 , F21S8/04 , F21V23/009 , F21Y2103/10 , F21Y2115/10 , H05K1/0286 , H05K2201/09063 , H05K2201/09127 , H05K2201/10106
摘要： A light board for a light fixture includes a first portion and a second portion. The first portion includes at least one light emitting element, and the second portion includes at least one light emitting element. A first state is defined by the second portion being coupled to the first portion and a second state is defined by the second portion being detached from the first portion. In the first state, the light emitting elements of the first portion and the second portion are configured to provide an evenly distributed light output along at least the combined length of the first portion and the second portion. In the second state, the at least one light emitting element of the first portion is configured to provide an evenly distributed light output along at least the length of the first portion.

89. 发明申请

US20180233841A1 INTEGRATED CONNECTOR FOR ELECTRONIC DEVICE 审中-公开
公开(公告)号：US20180233841A1
公开(公告)日：2018-08-16
申请号：US15751018
申请日：2015-09-23
申请人： Intel Corporation
发明人： Kit Chew Chee , Ahmad Jalaluddin Yusof , Tin Poay Chuah
IPC分类号： H01R12/77 , H01R12/79
CPC分类号： H01R12/774 , H01R12/79 , H01R13/6275 , H01R2107/00 , H05K1/117 , H05K1/118 , H05K3/4697 , H05K2201/09127 , H05K2201/09163 , H05K2201/09481 , H05K2201/1034
摘要： In one example an electronic device comprises a chassis and a printed circuit board coupled to the chassis and comprising a body formed from a plurality of laminate layers, and at least one receptacle formed in the body and comprising at least one data connector positioned in the receptacle to provide a communication connection. Other examples may be described.

90. 发明申请

US20180220526A1 Radio-frequency antenna, radio-frequency substrate with radio-frequency antenna, and production method 审中-公开
公开(公告)号：US20180220526A1
公开(公告)日：2018-08-02
申请号：US15747820
申请日：2016-08-09
申请人： Schweizer Electronic AG
发明人： Thomas GOTTWALD , Christian RÖSSEL , Christian DOLD , Dirk GENNERMANN
IPC分类号： H05K1/02 , H01Q9/04 , H05K1/18 , H05K3/46
CPC分类号： H05K1/0243 , H01Q9/0407 , H05K1/185 , H05K3/4617 , H05K3/462 , H05K3/4694 , H05K3/4697 , H05K2201/015 , H05K2201/09072 , H05K2201/09127 , H05K2201/10098 , H05K2201/10378 , H05K2201/10977 , H05K2203/063
摘要： A method for producing a radio-frequency antenna in a conductor structural element with an encompassing layer sequence, including: providing a rigid carrier having an underside and a top side; defining an antenna assignment section on the rigid carrier; applying at least one electrically insulating layer with a recess in such a way that the antenna assignment section is exposed; placing a radio-frequency substrate above the antenna assignment section with formation of a cavity between the rigid carrier and the radio-frequency substrate; aligning and fixing the radio-frequency substrate relative to the rigid carrier; laminating the layer construction prepared in this manner such that resin material of the at least one electrically insulating layer liquefies and encloses the radio-frequency substrate with the cavity being left free; cutting the antenna assignment section out of the rigid carrier from the outer underside (remote from the layer construction) of the rigid carrier.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式