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1. 发明授权

US10993313B2 Non-uniform magnetic foil embedded in component carrier 有权
公开(公告)号：US10993313B2
公开(公告)日：2021-04-27
申请号：US16051204
申请日：2018-07-31
申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Gerald Weidinger , Jonathan Silvano de Sousa
IPC分类号： H05K1/02 , H05K3/46 , H05K1/18
摘要： A component carrier including a stack with a plurality of electrically insulating layer structures and/or a plurality of electrically conductive layer structures, and a non-uniform magnetic foil integrated in the stack.

2. 发明申请

US20210050141A1 Inductor Made of Component Carrier Material Comprising Electrically Conductive Plate Structures 有权
公开(公告)号：US20210050141A1
公开(公告)日：2021-02-18
申请号：US16949573
申请日：2020-11-04
申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Johannes Stahr , Gerald Weidinger , Heinz Moitzi
IPC分类号： H01F27/28 , H01F41/04 , H01F17/00 , H01F27/24
摘要： An inductor component includes a plurality of stacked layer structures made of component carrier material with electrically conductive plate structures, and a plurality of electrically conductive interconnect structures connecting the electrically conductive plate structures to thereby form an inductance with multiple windings.

3. 发明申请

US20180182532A1 Inductor Made of Component Carrier Material Comprising Electrically Conductive Plate Structures 审中-公开
公开(公告)号：US20180182532A1
公开(公告)日：2018-06-28
申请号：US15851177
申请日：2017-12-21
申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Johannes Stahr , Gerald Weidinger , Heinz Moitzi
IPC分类号： H01F27/28 , H01F27/24 , H01F41/04
CPC分类号： H01F27/2804 , H01F17/0013 , H01F17/0033 , H01F27/24 , H01F27/2847 , H01F41/041 , H01F41/042 , H01F41/046 , H05K1/181 , H05K1/185 , H05K2201/1003
摘要： An inductor component includes a plurality of stacked layer structures made of component carrier material with electrically conductive plate structures, and a plurality of electrically conductive interconnect structures connecting the electrically conductive plate structures to thereby form an inductance with multiple windings.

4. 发明申请

US20220037262A1 Component With Dielectric Layer for Embedding in Component Carrier 有权
公开(公告)号：US20220037262A1
公开(公告)日：2022-02-03
申请号：US17451012
申请日：2021-10-15
申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Gerald Weidinger , Andreas Zluc
IPC分类号： H01L23/538 , H01L23/31 , H01L23/373 , H01L23/00 , H01L21/48 , H01L21/56
摘要： A method for manufacturing a component carrier includes forming a stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, providing a component having one or more pads and at least one dielectric layer on at least one main surface of the component such that the dielectric layer at least partially covers one or more pads of the component, placing the component on a temporary carrier, and embedding the component between the temporary carrier and the at least one insulating layer structure by pressing the component into the at least one insulating layer structure.

5. 发明授权

US10187997B2 Method for making contact with a component embedded in a printed circuit board 有权
公开(公告)号：US10187997B2
公开(公告)日：2019-01-22
申请号：US15122114
申请日：2015-02-26
申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Gerald Weidinger , Andreas Zluc , Johannes Stahr
IPC分类号： H05K1/18 , H01L23/538 , H01L23/13 , H05K3/06 , H05K3/30 , H01L23/00 , H05K3/10
摘要： Methods for the bonding of a component embedded into a printed circuit board are provided. A printed circuit board is also provided with at least one insulated layer and at least one structured conductor layer with conductor paths, with at least one component, which, by means of an adhesive layer, is embedded into a recess of the printed circuit board, with its contacts essentially being situated in the plane of an outer surface of the printed circuit board exhibiting the at least one conductor layer, and with conductive connections between the contacts of the components and the conductor paths of the conductor layer.

6. 发明申请

US20180096912A1 Component Carrier Comprising at Least One Heat Pipe and Method for Producing Said Component Carrier 审中-公开
公开(公告)号：US20180096912A1
公开(公告)日：2018-04-05
申请号：US15721116
申请日：2017-09-29
申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Jonathan Silvano de Sousa , Bernhard Reitmaier , Erich Schlaffer , Johannes Stahr , Wolfgang Schrittwieser , Gerald Weidinger , Alexander Kasper , Gernot Grober
IPC分类号： H01L23/427 , F28D15/02 , H01L21/673 , F28D20/02 , F28F3/08 , F21V29/51
CPC分类号： H01L23/427 , F21V29/51 , F28D15/0275 , F28D20/023 , F28F3/086 , H01L21/673 , H05K1/0203 , H05K1/0206 , H05K1/0207 , H05K1/0272 , H05K2201/064
摘要： The invention refers to a component carrier comprising at least one heat pipe, wherein the at least one heat pipe has at least a largely cylindrical heat pipe section with a largely cylindrical profile with an outer diameter. The at least one heat pipe is embedded within a recess of at least one inner layer or is surface-mounted on an outer layer of said component carrier, wherein at least the largely cylindrical heat pipe section of the heat pipe is thermoconductively coupled by means of at least one adapter means that directly contacts the heat pipe with at least one layer of the component carrier. Furthermore the invention refers to several methods for producing said component carrier.

7. 发明申请

US20170339784A1 Circuit Board Having an Asymmetric Layer Structure 有权
公开(公告)号：US20170339784A1
公开(公告)日：2017-11-23
申请号：US15534897
申请日：2015-12-10
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Andreas Zluc , Gerald Weidinger , Mario Schober , Hannes Stahr , Timo Schwarz , Benjamin Gruber
IPC分类号： H05K1/02 , H01L21/48 , H01L23/14 , H01L23/00 , H05K3/46 , H05K3/00 , H05K1/18 , H05K1/03 , H05K1/11 , H01L23/538
CPC分类号： H05K1/0271 , H01L21/481 , H01L21/4857 , H01L21/568 , H01L23/145 , H01L23/5383 , H01L23/5385 , H01L23/5387 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L2224/2518 , H01L2224/32145 , H01L2224/73267 , H01L2224/9222 , H01L2924/0002 , H01L2924/18162 , H01L2924/19105 , H01L2924/3511 , H05K1/0353 , H05K1/0366 , H05K1/0373 , H05K1/0393 , H05K1/115 , H05K1/185 , H05K1/189 , H05K3/0017 , H05K3/0097 , H05K3/4602 , H05K2201/0129 , H05K2201/0133 , H05K2201/0187 , H05K2201/0191 , H05K2201/068 , H05K2201/09136 , H01L2924/00
摘要： A circuit board is described which includes a layer composite with at least one dielectric layer which includes a planar extension in parallel with respect to an xy-plane which is spanned by an x-axis and a y-axis perpendicular thereto, and which includes a layer thickness along a z-axis which is perpendicular with respect to the x-axis and to the y-axis; and at least one metallic layer which is attached to the dielectric layer in a planar manner. The layer composite along the z-axis is free from a symmetry plane which is oriented in parallel with respect to the xy-plane, and the dielectric layer includes a dielectric material which has an elastic modulus E in a range between 1 and 20 GPa and along the x-axis and along the y-axis a coefficient of thermal expansion in a range between 0 and 17 ppm/K. A method of manufacturing such a circuit board is also described. Further, a method of manufacturing a circuit board structure comprising two asymmetric circuit boards and a method of manufacturing two processed asymmetric circuit boards from a larger circuit board structure is described.

8. 发明申请

US20170339783A1 SemiFlexible Printed Circuit Board With Embedded Component 审中-公开
公开(公告)号：US20170339783A1
公开(公告)日：2017-11-23
申请号：US15534172
申请日：2015-12-10
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Hannes Stahr , Andreas Zluc , Timo Schwarz , Gerald Weidinger
IPC分类号： H05K1/02 , H01L21/48 , H01L23/14 , H01L23/00 , H05K3/46 , H05K3/00 , H05K1/18 , H05K1/03 , H05K1/11 , H01L23/538
CPC分类号： H05K1/0271 , H01L21/481 , H01L21/4857 , H01L21/568 , H01L23/145 , H01L23/5383 , H01L23/5385 , H01L23/5387 , H01L23/5389 , H01L23/562 , H01L24/19 , H01L24/20 , H01L2224/32145 , H01L2224/73267 , H01L2924/0002 , H01L2924/18162 , H01L2924/19105 , H01L2924/3511 , H05K1/0353 , H05K1/0366 , H05K1/0373 , H05K1/0393 , H05K1/115 , H05K1/185 , H05K1/189 , H05K3/0017 , H05K3/0097 , H05K3/4602 , H05K2201/0129 , H05K2201/0133 , H05K2201/0187 , H05K2201/0191 , H05K2201/068 , H05K2201/09136 , H01L2924/00
摘要： A circuit board and a method of manufacturing a circuit board or two circuit boards are illustrated and described. The circuit board includes (a) a dielectric layer with a planar extension in parallel with respect to an xy-plane which is spanned by an x-axis and a y-axis perpendicular thereto and a layer thickness along a z-direction which is perpendicular with respect to the x-axis and to the y-axis; (b) a metallic layer which is attached to the dielectric layer in a planar manner; and (c) a component which is embedded in the dielectric layer and/or in a dielectric core-layer of the circuit board. The dielectric layer includes a dielectric material which has (i) an elastic modulus E in a range between 1 and 20 GPa and (ii) a coefficient of thermal expansion in a range between 0 and 17 ppm/K along the x-axis and along the y-axis.

9. 发明申请

US20140373350A1 Method for the Production of a Circuit Board Involving the Removal of a Subregion thereof, and Use of such a Method 审中-公开
标题翻译：涉及除去其子区域的电路板的制造方法以及这种方法的使用
公开(公告)号：US20140373350A1
公开(公告)日：2014-12-25
申请号：US14363223
申请日：2012-12-03
申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Markus Leitgeb , Gerald Weidinger , Gregor Langer , Volodymyr Karpovych
IPC分类号： H05K3/46
CPC分类号： H05K3/46 , H05K3/0044 , H05K3/4691 , H05K2201/09127 , H05K2203/0191 , H05K2203/0264 , H05K2203/107 , Y10T29/49156
摘要： The invention relates to a method for producing a circuit board involving the removal of a subregion thereof. In said method, at least two layers or plies of the circuit board (1) are interconnected, the subregion (6) to be removed is prevented from being connected to an adjacent ply of the circuit board by providing a layer (7) of adhesion-preventing or bonding-preventing material, and peripheral zones (8) of the subregion (6) to be removed are separated from adjoining zones of the circuit board (1). According to the invention, a fissure formation and/or a detachment from the subregion (6) of the circuit board (1) to be removed is initiated in a subregion in or on the layer (7) of adhesion-preventing or bonding-preventing material, and the subregion (6) to be removed is then removed, thus making it possible to remove a subregion (6) to be removed from a circuit board (1) in a simple and reliable, and if necessary automated, manner. Also disclosed is a use of such a method for producing a multilayer circuit board (1) and especially for creating voids in such a circuit board (1).
摘要翻译：本发明涉及一种生产电路板的方法，该方法包括去除其子区域。在所述方法中，电路板（1）的至少两层或多层相互连接，通过提供粘合层（7），防止要移除的子区域（6）与电路板的相邻层相连接要除去的防止或接合防止材料和所述子区域（6）的周边区域（8）与电路板（1）的邻接区域分离。根据本发明，将要去除的电路板（1）的子区域（6）的裂缝形成和/或脱离开始于防粘附或防粘接层（7）中或其上的一个子区域材料和要除去的子区域（6）被去除，从而可以以简单可靠且如果需要的自动化方式去除要从电路板（1）移除的子区域（6）。还公开了这种用于制造多层电路板（1）的方法，特别是在这种电路板（1）中产生空隙的方法。

10. 发明授权

US11523520B2 Method for making contact with a component embedded in a printed circuit board 有权
公开(公告)号：US11523520B2
公开(公告)日：2022-12-06
申请号：US16184470
申请日：2018-11-08
申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Gerald Weidinger , Andreas Zluc , Johannes Stahr
IPC分类号： H05K3/46 , H05K1/18 , H05K1/11 , H05K3/06 , H05K3/32 , H05K3/26
摘要： The invention pertains to a method for the bonding of a component embedded into a printed circuit board exhibiting the following steps: Provision of a core exhibiting at least one insulating layer and at least one conductor layer applied to the insulating layer, Embedding of at least one component into a recess of the insulating layer, wherein the contacts of the component are essentially situated in the plane of an outer surface of the core exhibiting the at least one conductor layer, Application of a photoimageable resist onto the one outer surface of the core on which the component is arranged, while filling the spaces between the contacts of the component, Clearing of end faces of the contacts and of the areas of the conductor layer covered by the photoimageable resist by exposing and developing the photoimageable resist, by application of a semi-additive process, deposition of a layer of conductor material onto the cleared end faces of the contacts and the cleared areas of the conductor layer and formation of a conductor pattern on at least the one outer surface of the core on which the component is arranged, as well as the interconnecting paths between the contacts and the conductor pattern, and Removal of the areas of the conductor layer not belonging to the conductor pattern.

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