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    • 83. 发明申请
    • Semiconductor laser assembly
    • 半导体激光组件
    • US20050094687A1
    • 2005-05-05
    • US10505720
    • 2003-12-26
    • Kaori Naganuma
    • Kaori Naganuma
    • H01S3/04H01S5/02H01S5/022H01S5/024
    • H01S5/02236H01L2224/48091H01L2224/49175H01S5/02268H01S5/02272H01S5/02469H01L2924/00014
    • When a laser diode assembly is manufactured, bulb-shaped solder residue is not formed on a laser diode device, a submount, or a heatsink. A laser diode assembly (30) comprises a laser diode device (12). A submount (16) is jointed on a substrate side of the laser diode device (12) with a first solder layer (14) in between. A heatsink (20) is jointed on a rear face side of the submount (16) with a second solder layer (18) in between. The submount (16) is provided with a submount groove (32) formed along border of a joint area jointed with the laser diode device (12) and an extension groove (36) extending to edges of the submount (16). Several submount thin grooves (38) whose width is smaller and depth is shallower than of the submount groove (32) are formed in the joint area of the submount in the shape of lattice and in the direction diagonally to the submount groove (32) so that the submount thin grooves (38) are spaced from each other and at least one ends of the submount thin grooves (38) contact with the submount groove (32). When solder joint of the laser diode device (12) is performed, excessive solder flows into the submount groove (32) through the submount thin grooves (38). The submount groove (32) functions as a solder pool for the excessive solder, and the excessive solder is drained outside through the extension groove (36).
    • 当制造激光二极管组件时,在激光二极管器件,底座或散热器上不形成灯泡状焊料残留物。 激光二极管组件(30)包括激光二极管装置(12)。 在激光二极管器件(12)的衬底侧上用第一焊料层(14)将基座(16)连接在一起。 散热器(20)通过其间的第二焊料层(18)接合在基座(16)的背面侧。 底座(16)设置有沿与连接有激光二极管装置(12)的接合区域的边界形成的基座(32)和延伸到底座(16)的边缘的延伸槽(36)。 在基座的接合区域中,形成格子形状较小并且深度比底座槽(32)浅的多个基座薄槽(38),并且沿着与底座槽(32)对角的方向形成为 底座薄槽(38)彼此间隔开,并且底座薄槽(38)的至少一端与底座槽(32)接触。 当执行激光二极管装置(12)的焊点时,过多的焊料通过底座薄槽(38)流入底座槽32。 底座槽32用作过量焊料的焊料池,并且通过延伸槽(36)将过量的焊料排出到外部。