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81. 发明申请

US20140374467A1 CAPILLARY BONDING TOOL AND METHOD OF FORMING WIRE BONDS 审中-公开
标题翻译：毛细结合工具和形成线束的方法
公开(公告)号：US20140374467A1
公开(公告)日：2014-12-25
申请号：US13924625
申请日：2013-06-24
申请人： Jia Lin Yap , Yin Kheng Au , Lai Cheng Law
发明人： Jia Lin Yap , Yin Kheng Au , Lai Cheng Law
IPC分类号： H01L23/00 , B23K20/26
CPC分类号： H01L24/78 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/04042 , H01L2224/05611 , H01L2224/05624 , H01L2224/05644 , H01L2224/05655 , H01L2224/05664 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48451 , H01L2224/48456 , H01L2224/48463 , H01L2224/48465 , H01L2224/4847 , H01L2224/48478 , H01L2224/48811 , H01L2224/48824 , H01L2224/48844 , H01L2224/48855 , H01L2224/48864 , H01L2224/78304 , H01L2224/85203 , H01L2224/85207 , H01L2224/85411 , H01L2224/85424 , H01L2224/85444 , H01L2224/85455 , H01L2224/85464 , H01L2924/00011 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00015 , H01L2924/01033
摘要： A capillary bonding tool for wire bonding includes a first section, a second section and a bonding section. The first section has a first outer peripheral sidewall, an opposing first inner sidewall that extends generally parallel to the central longitudinal axis, and a first opening surrounded by the first inner sidewall. The second section has a second outer peripheral sidewall, an opposing second inner sidewall that extends at an angle with respect to the central longitudinal axis, and a second tapered opening surrounded by the second inner sidewall. The bonding section has a peripheral ridge extending axially outwardly from the second inner sidewall of the second section. The peripheral ridge has a third outer peripheral sidewall, a third inner tubular sidewall that extends generally parallel to the central longitudinal axis and radially outwardly of the first inner sidewall, and a third opening surrounded by the third inner tubular sidewall.
摘要翻译：用于引线接合的毛细管接合工具包括第一部分，第二部分和接合部分。第一部分具有第一外周侧壁，大体上平行于中心纵向轴线延伸的相对的第一内侧壁，以及由第一内侧壁包围的第一开口。第二部分具有第二外围侧壁，相对于中心纵向轴线以一定角度延伸的相对的第二内侧壁和由第二内侧壁包围的第二锥形开口。接合部具有从第二部分的第二内侧壁轴向向外延伸的周向脊。外围脊具有第三外周侧壁，第三内管状侧壁，其大致平行于中心纵向轴线延伸并且在第一内侧壁的径向向外延伸，第三开口被第三内管状侧壁包围。

82. 发明申请

US20140353822A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20140353822A1
公开(公告)日：2014-12-04
申请号：US14278300
申请日：2014-05-15
申请人： Renesas Electronics Corporation
发明人： Kenji OYACHI , Tamaki WADA , Yuichi MORINAGA
IPC分类号： H01L23/498 , H01L23/00
CPC分类号： H01L24/48 , G06K19/07718 , G06K19/0772 , G06K19/07722 , G06K19/07743 , G06K19/07745 , H01L23/053 , H01L23/3107 , H01L23/3114 , H01L23/3142 , H01L23/49811 , H01L23/49838 , H01L23/49855 , H01L24/05 , H01L24/14 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/49 , H01L24/78 , H01L24/83 , H01L24/85 , H01L24/97 , H01L2224/02166 , H01L2224/0401 , H01L2224/04042 , H01L2224/05124 , H01L2224/05155 , H01L2224/05554 , H01L2224/05624 , H01L2224/05644 , H01L2224/1401 , H01L2224/2919 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/4847 , H01L2224/48471 , H01L2224/48479 , H01L2224/48499 , H01L2224/48624 , H01L2224/48644 , H01L2224/48824 , H01L2224/48844 , H01L2224/49171 , H01L2224/73265 , H01L2224/78301 , H01L2224/83101 , H01L2224/83862 , H01L2224/85045 , H01L2224/85048 , H01L2224/85051 , H01L2224/85181 , H01L2224/85186 , H01L2224/85205 , H01L2224/85444 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/10161 , H01L2924/10253 , H01L2924/181 , H01L2924/18301 , H01L2924/0665 , H01L2924/00 , H01L2924/00012 , H01L2924/01079 , H01L2224/4554
摘要： Reliability of a semiconductor device is improved. A semiconductor device has a base material comprised of insulating material having a through hole, a terminal formed on a lower surface of the base material, and a semiconductor chip mounted on an upper surface of the base material in a face-up manner. Further, the semiconductor device has a conductive member such as a wire, which electrically connects a pad of the semiconductor chip with an exposed surface of the terminal which is exposed from the through hole of the base material, and has a sealing body for sealing the conductive member, inside of the through hole of the base material, and the semiconductor chip. An anchor means is provided in a region of the exposed surface of the terminal which is exposed from the through hole of the base material except for a joint portion joined with the conductive member such as the wire.
摘要翻译：提高了半导体器件的可靠性。半导体器件具有由具有通孔的绝缘材料，形成在基材的下表面上的端子和以面朝上的方式安装在基材的上表面上的半导体芯片构成的基材。此外，半导体器件具有诸如导线的导电构件，其将半导体芯片的焊盘与从基材的通孔露出的端子的暴露表面电连接，并且具有密封体导电构件，基材的通孔内部和半导体芯片。锚定装置设置在除了与诸如导线的导电构件连接的接合部分之外的从基材的通孔露出的端子的暴露表面的区域中。

83. 发明申请

US20140339290A1 WIRE BONDING METHOD AND SEMICONDUCTOR PACKAGE MANUFACTURED USING THE SAME 审中-公开
标题翻译：使用其制造的线接合方法和半导体封装
公开(公告)号：US20140339290A1
公开(公告)日：2014-11-20
申请号：US14278561
申请日：2014-05-15
申请人： Won-Gil HAN , Byongjoo KIM , Sangyoung KIM , Tae-Gyeong CHUNG , Sungbok HONG
发明人： Won-Gil HAN , Byongjoo KIM , Sangyoung KIM , Tae-Gyeong CHUNG , Sungbok HONG
IPC分类号： H01L23/00
CPC分类号： H01L24/85 , H01L23/3121 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L25/0657 , H01L2224/02166 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05567 , H01L2224/06135 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/4813 , H01L2224/48145 , H01L2224/48147 , H01L2224/48227 , H01L2224/48465 , H01L2224/48471 , H01L2224/49112 , H01L2224/49113 , H01L2224/49175 , H01L2224/73265 , H01L2224/78301 , H01L2224/85045 , H01L2224/85181 , H01L2224/85186 , H01L2224/85205 , H01L2224/85986 , H01L2224/92247 , H01L2225/06506 , H01L2225/0651 , H01L2225/06562 , H01L2924/00014 , H01L2924/181 , H01L2924/19107 , H01L2924/00012 , H01L2924/00 , H01L2924/00011 , H01L2224/85399 , H01L2224/05599
摘要： Provided is a wire bonding method. The method includes: positioning a capillary having a wire inserted on a substructure including at least three connection terminals spaced apart from each other; forming an adhesive ball at a tip of the wire; bonding the adhesive ball to one of the connection terminals by lowering the capillary; and connecting the other connection terminals to the same wire by moving the capillary.
摘要翻译：提供引线接合方法。该方法包括：将具有插入在包括彼此间隔开的至少三个连接端子的子结构的电线的毛细管定位; 在所述导线的尖端处形成粘合球; 通过降低毛细管将粘合球粘合到一个连接端子上; 并通过移动毛细管将其它连接端子连接到同一根线。

84. 发明申请

US20140332583A1 WIRE BONDING APPARATUS 审中-公开
标题翻译：电线连接装置
公开(公告)号：US20140332583A1
公开(公告)日：2014-11-13
申请号：US14339632
申请日：2014-07-24
申请人： SHINKAWA LTD.
发明人： Toru MAEDA
IPC分类号： H01L23/00
CPC分类号： H01L24/78 , B23K20/004 , H01L24/45 , H01L24/85 , H01L2224/45144 , H01L2224/45147 , H01L2224/7801 , H01L2224/78301 , H01L2224/78601 , H01L2224/78611 , H01L2224/85013 , H01L2924/00014 , H01L2924/00015 , H01L2224/48 , H01L2924/00
摘要： Provided is a wire bonding apparatus including: a base (11); a bonding head (13) configured to move a capillary (15) in X, Y, and Z directions with respect to the base (11); and a wire-cleaning plasma unit (30). The wire-cleaning plasma unit (30) includes: hollow casings (31a), (31b) in which an inert gas is introduced so that an internal pressure is higher than an atmospheric pressure; holes (33a), (33b) respectively provided in the casings (31a), (31b) so that the wire (21) is inserted therebetween; and electrodes for plasma respectively disposed within the casings (31a), (31b) around circumferences of the holes (33a), (33b). The wire (21) is cleaned by having the wire (21) be inserted into plasma generated within the casings (31a), (31b) in a state in which air is not contained. With this, a surface of the wire used for wire bonding can be effectively cleaned.
摘要翻译：提供一种引线接合装置，包括：基座（11）; 结合头（13），其构造成相对于所述基部（11）在X，Y和Z方向上移动毛细管（15）; 和线清洁等离子体单元（30）。线清洗等离子体单元（30）包括：中空壳体（31a），（31b），其中引入惰性气体以使内部压力高于大气压力; 分别设置在壳体（31a），（31b）中的孔（33a），（33b），使得线（21）插入其间; 以及分别设置在孔（33a），（33b）周围的壳体（31a），（31b）内的等离子体用电极。在未包含空气的状态下，通过使导线（21）插入在壳体（31a），（31b）内产生的等离子体来清洁导线（21）。由此，可以有效地清洁用于引线接合的线的表面。

85. 发明授权

US08881966B2 Method of manufacturing semiconductor device, and wire bonder 有权
标题翻译：制造半导体器件的方法和引线接合器
公开(公告)号：US08881966B2
公开(公告)日：2014-11-11
申请号：US12633830
申请日：2009-12-09
申请人： Kazuyuki Misumi , Hideyuki Arakawa , Shunji Yamauchi , Mitsuru Aoki
发明人： Kazuyuki Misumi , Hideyuki Arakawa , Shunji Yamauchi , Mitsuru Aoki
IPC分类号： B23K37/00 , B23K37/02 , B23K37/04 , B23K31/00 , H01L23/00
CPC分类号： H01L24/85 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/78 , H01L24/97 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/7825 , H01L2224/78301 , H01L2224/7865 , H01L2224/78703 , H01L2224/85181 , H01L2224/85447 , H01L2224/97 , H01L2924/00011 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/20752 , Y10S228/904 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An improvement in the quality of wire bonding is achieved by reducing the vibration of a lead frame or a wiring substrate after wire bonding. Over a heat block in a wire bond portion of a wire bonder, there is provided a cooling blower for cooling a wire-bonded matrix frame so that the temperature thereof may decrease stepwise. After wire bonding, cold air is blown from the cooling blower to the matrix frame, and temperature control of the matrix frame is performed so that the temperature of the matrix frame after wire bonding may decrease stepwise. Or, the wire-bonded matrix frame is fixed with a holding tool such as a frame holding member, a guide member, a roller means, or an elastic means until cooling is completed.
摘要翻译：通过在引线接合之后减少引线框架或布线基板的振动来实现引线接合质量的提高。在引线接合器的引线接合部分的热块上，设置有用于冷却引线键合矩阵框架的冷却鼓风机，使得其温度可以逐步降低。引线接合后，从冷却鼓风机向矩阵框架吹出冷空气，进行矩阵框架的温度控制，使得引线接合后的矩阵框架的温度可以逐步降低。或者，通过诸如框架保持构件，引导构件，滚子装置或弹性装置之类的保持工具将引线键合框架固定，直到冷却完成。

86. 发明申请

US20140311590A1 ANTIOXIDANT GAS SUPPLY UNIT 有权
标题翻译：抗氧化剂气体供应单元
公开(公告)号：US20140311590A1
公开(公告)日：2014-10-23
申请号：US14321134
申请日：2014-07-01
申请人： Shinkawa Ltd.
发明人： Toru MAEDA , Mitsuaki SAKAKURA
IPC分类号： B23K20/00
CPC分类号： B23K20/007 , B23K9/16 , B23K20/005 , B23K37/00 , H01L24/45 , H01L24/78 , H01L2224/45144 , H01L2224/45147 , H01L2224/781 , H01L2224/78268 , H01L2224/78301 , H01L2224/85045 , H01L2224/85054 , H01L2924/00014 , H01L2924/00015 , Y10T137/6416 , H01L2224/48
摘要： Provided is an antioxidant gas supply unit including: a base body (10) in a shape of a hollow plate having antioxidant gas flow paths (53) and (54) defined therein; an antioxidation gas inlet (20) for letting an antioxidant gas flow into the antioxidant gas flow paths (53) and (54); a through hole (30) penetrating through the base body (10) in a through-thickness direction so that a capillary (72) is allowed to be inserted into and removed from the hole, and communicating with the antioxidant gas flow paths (53) and (54) to let the antioxidant gas flow out; and a film heater (40) attached to an outer surface of the base body (10) around the through hole (30). The antioxidant gas supply unit has a compact structure and is capable of effectively heating a free air ball.
摘要翻译：提供一种抗氧化剂气体供给单元，包括：具有限定在其中的抗氧化剂气体流路（53）和（54）的中空板形状的基体（10）用于使抗氧化剂气体流入抗氧化剂气体流路（53）和（54）的抗氧化气体入口（20）; 穿过所述基体（10）的贯穿孔（30）的通孔（30），使得允许毛细管（72）从所述孔插入和移出，并与所述抗氧化剂气体流路（53）连通，和（54）使抗氧化剂气体流出; 以及围绕所述通孔（30）附接到所述基体（10）的外表面的膜加热器（40）。抗氧化剂气体供给装置结构紧凑，能够有效地加热空气球。

87. 发明申请

US20140305996A1 BONDING APPARATUS 有权
标题翻译：绑定装置
公开(公告)号：US20140305996A1
公开(公告)日：2014-10-16
申请号：US14364059
申请日：2013-07-23
申请人： KAIJO CORPORATION
发明人： Shuichi Takanami
IPC分类号： B23K20/10
CPC分类号： B23K20/106 , H01L24/78 , H01L2224/78301 , H01L2224/78309 , H01L2224/78349 , H01L2224/789 , H01L2924/00014 , H01L2224/45099 , H01L2224/05599
摘要： A bonding apparatus includes a bonding arm which has a receiving portion facing a center axis of a bonding tool; a pair of capillary holding portions in contact with the bonding tool; a pair of piezoelectric elements configured to generate an ultrasonic vibration in contact with the capillary holding portions; and a pressurizing device which has a pressurizing member arranged to face the receiving portion of the bonding arm and a moving device configured to move the pressurizing member toward the receiving portion of the bonding arm. The pressurizing member is moved in a state in which the pair of piezoelectric elements, the pair of capillary holding portions, and the bonding tool are placed between the receiving portion of the bonding arm to cause the bonding arm to hold the pair of capillary holding portion and the bonding tool.
摘要翻译：一种接合装置，包括：接合臂，其具有面向接合工具的中心轴的接收部; 与接合工具接触的一对毛细管保持部; 配置成产生与毛细管保持部接触的超声波振动的一对压电元件; 以及加压装置，其具有设置成面向接合臂的接收部分的加压构件和构造成使加压构件朝向接合臂的接收部分移动的移动装置。加压构件在将一对压电元件，一对毛细管保持部和接合工具放置在接合臂的接收部之间的状态下移动，以使接合臂保持一对毛细管保持部和粘合工具。

88. 发明授权

US08846455B2 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08846455B2
公开(公告)日：2014-09-30
申请号：US13776215
申请日：2013-02-25
申请人： Renesas Electronics Corporation
发明人： Kazuya Fukuhara , Kiyonori Yoshitomi , Takehiko Ikegami , Yujiro Kawasoe
IPC分类号： H01L21/00 , H01L23/495 , H01L23/00 , H01L23/31
CPC分类号： H01L23/49575 , H01L21/56 , H01L23/3107 , H01L23/4952 , H01L23/49541 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05556 , H01L2224/05647 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/48647 , H01L2224/48847 , H01L2224/4903 , H01L2224/49051 , H01L2224/49113 , H01L2224/49171 , H01L2224/49179 , H01L2224/73265 , H01L2224/78301 , H01L2224/85148 , H01L2224/85181 , H01L2224/85345 , H01L2224/92247 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/20752 , H01L2924/20753 , H01L2924/00 , H01L2924/00012 , H01L2224/43
摘要： A semiconductor device permitting the reduction of cost is disclosed. In a semiconductor package wherein electrode pads of a semiconductor chip and corresponding inner leads are electrically coupled with each other through a plurality of bonding wires, sensing wires (second and fourth bonding wires) are made thinner than other bonding wires (first and third bonding wires) coupled to inner leads same as those with the sensing wires coupled thereto, thereby reducing the cost of gold wires to attain the reduction in cost of the semiconductor package.
摘要翻译：公开了允许降低成本的半导体器件。在半导体封装中，半导体芯片的电极焊盘和对应的内部引线通过多根接合线彼此电耦合，使感测线（第二和第四接合线）比其它接合线（第一和第三接合线）耦合到与将感测线耦合到其上的内引线相同的内引线，从而降低金线的成本以实现半导体封装的成本降低。

89. 发明申请

US20140266242A1 SCREENING METHODOLOGY TO ELIMINATE WIRE SWEEP IN BOND AND ASSEMBLY MODULE PACKAGING 有权
标题翻译：消除绑定线束和组装模块包装的筛选方法
公开(公告)号：US20140266242A1
公开(公告)日：2014-09-18
申请号：US13834039
申请日：2013-03-15
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Stephen Peter Ayotte , Michael Russell Uy Gonzales , Mark Tiam Weng Lam
IPC分类号： G01R31/02
CPC分类号： G01R31/041 , G01R31/025 , G01R31/048 , G01R31/2896 , H01L24/78 , H01L24/85 , H01L2224/78901 , H01L2224/859 , H01L2924/00014 , H01L2924/3862 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： Quality control testing for a batch of electronic modules. A series of tests are performed on manufactured electronic modules, including tests sensitive to the failure rate of previously tested modules. Specifically, a first test comprised of two phases is performed on the module batch. Further screening is then performed responsive to detection of a wire sweep failure in a subset of failed modules from the first test phase. The further screening is on modules that passed the first test phase and excludes modules that failed the first test phase.
摘要翻译：一批电子模块的质量控制测试。对制造的电子模块进行一系列测试，包括对先前测试模块的故障率敏感的测试。具体来说，对模块批次进行由两相组成的第一测试。然后响应于在第一测试阶段的故障模块的子集中的线扫失失败的检测来执行进一步的筛选。进一步的筛选是通过第一个测试阶段的模块，并排除了第一个测试阶段失败的模块。

90. 发明授权

US08814054B2 Inclusion of chip elements in a sheathed wire 有权
标题翻译：将芯片元件包含在护套电线中
公开(公告)号：US08814054B2
公开(公告)日：2014-08-26
申请号：US13703255
申请日：2011-06-23
申请人： Jean Brun , Laurent Lancon , Dominique Vicard
发明人： Jean Brun , Laurent Lancon , Dominique Vicard
IPC分类号： G06K19/06 , D02G3/36 , G06K19/077 , H01L25/00 , H01L23/00
CPC分类号： G06K19/07749 , D02G3/362 , D10B2401/18 , G06K19/07718 , G06K19/07758 , G06K19/07786 , H01L24/78 , H01L24/85 , H01L25/0655 , H01L25/50 , H01L2224/78 , H01L2224/8517 , H01L2224/858 , H01L2924/00014 , H01L2924/01014 , H01L2924/01058 , Y10T29/49002 , H01L2224/48 , H01L2224/45099 , H01L2224/05599
摘要： A method for forming a sheathed wire includes the steps of: axially advancing a core through a sheathing zone; wrapping a sheathing fiber around the core in the sheathing zone; and providing, in the sheathing zone, a series of microelectronic chip elements each provided with a wire section, in such a way that the sheathing fiber that wraps around the core also wraps around a chip element and the wire section thereof to form a sheathed wire incorporating spaced-apart chip elements.
摘要翻译：一种用于形成护套线的方法包括以下步骤：使芯通过护套区域轴向推进; 在护套区域围绕芯部缠绕护套纤维; 并且在护套区域中提供一系列各自设置有线部分的微电子芯片元件，使得围绕芯部包覆的护套纤维也缠绕在芯片元件及其线部分上以形成护套线结合间隔开的芯片元件。

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