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1. 发明授权

US09772012B2 Drive mechanism and manufacturing device 有权
公开(公告)号：US09772012B2
公开(公告)日：2017-09-26
申请号：US14903800
申请日：2014-05-30
申请人： KAIJO CORPORATION
发明人： Shuichi Takanami
IPC分类号： B25J9/00 , F16H21/46 , H01L23/00
CPC分类号： F16H21/46 , B25J9/0033 , H01L24/742 , H01L24/78 , H01L2224/1134 , H01L2224/78353 , H01L2224/786 , H01L2224/78821 , H01L2924/00014 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A driving mechanism including a first rod (103a), a second rod (104a), a first planar motor (106) moving on a plane, a center planar motor (105) moving on the plane and a moving portion (101), in which one end of the first rod is rotatably connected to the moving portion by a first rotation fulcrum (125a), the other end of the first rod is rotatably connected to the first planar motor by a second rotation fulcrum (126a), one end of the second rod is rotatably connected by a third rotation fulcrum (128a) provided on the first rod. The other end of the second rod is rotatably connected to the center planar motor by a fourth rotation fulcrum (127a), and the moving portion is moved so as to recede from the center planar motor when the first planar motor is moved near to the center planar motor.

2. 发明授权

US09339888B2 Bonding apparatus 有权
标题翻译：接合装置
公开(公告)号：US09339888B2
公开(公告)日：2016-05-17
申请号：US14364059
申请日：2013-07-23
申请人： KAIJO CORPORATION
发明人： Shuichi Takanami
IPC分类号： B23K20/10 , H01L23/00
CPC分类号： B23K20/106 , H01L24/78 , H01L2224/78301 , H01L2224/78309 , H01L2224/78349 , H01L2224/789 , H01L2924/00014 , H01L2224/45099 , H01L2224/05599
摘要： A bonding apparatus includes a bonding arm which has a receiving portion facing a center axis of a bonding tool; a pair of capillary holding portions in contact with the bonding tool; a pair of piezoelectric elements configured to generate an ultrasonic vibration in contact with the capillary holding portions; and a pressurizing device which has a pressurizing member arranged to face the receiving portion of the bonding arm and a moving device configured to move the pressurizing member toward the receiving portion of the bonding arm. The pressurizing member is moved in a state in which the pair of piezoelectric elements, the pair of capillary holding portions, and the bonding tool are placed between the receiving portion of the bonding arm to cause the bonding arm to hold the pair of capillary holding portion and the bonding tool.
摘要翻译：一种接合装置，包括：接合臂，其具有面向接合工具的中心轴的接收部; 与接合工具接触的一对毛细管保持部; 配置成产生与毛细管保持部接触的超声波振动的一对压电元件; 以及加压装置，其具有设置成面向接合臂的接收部分的加压构件和构造成使加压构件朝向接合臂的接收部分移动的移动装置。加压构件在将一对压电元件，一对毛细管保持部和接合工具放置在接合臂的接收部之间的状态下移动，以使接合臂保持一对毛细管保持部和粘合工具。

3. 发明申请

US20140305996A1 BONDING APPARATUS 有权
标题翻译：绑定装置
公开(公告)号：US20140305996A1
公开(公告)日：2014-10-16
申请号：US14364059
申请日：2013-07-23
申请人： KAIJO CORPORATION
发明人： Shuichi Takanami
IPC分类号： B23K20/10
CPC分类号： B23K20/106 , H01L24/78 , H01L2224/78301 , H01L2224/78309 , H01L2224/78349 , H01L2224/789 , H01L2924/00014 , H01L2224/45099 , H01L2224/05599
摘要： A bonding apparatus includes a bonding arm which has a receiving portion facing a center axis of a bonding tool; a pair of capillary holding portions in contact with the bonding tool; a pair of piezoelectric elements configured to generate an ultrasonic vibration in contact with the capillary holding portions; and a pressurizing device which has a pressurizing member arranged to face the receiving portion of the bonding arm and a moving device configured to move the pressurizing member toward the receiving portion of the bonding arm. The pressurizing member is moved in a state in which the pair of piezoelectric elements, the pair of capillary holding portions, and the bonding tool are placed between the receiving portion of the bonding arm to cause the bonding arm to hold the pair of capillary holding portion and the bonding tool.
摘要翻译：一种接合装置，包括：接合臂，其具有面向接合工具的中心轴的接收部; 与接合工具接触的一对毛细管保持部; 配置成产生与毛细管保持部接触的超声波振动的一对压电元件; 以及加压装置，其具有设置成面向接合臂的接收部分的加压构件和构造成使加压构件朝向接合臂的接收部分移动的移动装置。加压构件在将一对压电元件，一对毛细管保持部和接合工具放置在接合臂的接收部之间的状态下移动，以使接合臂保持一对毛细管保持部和粘合工具。

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