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    • 89. 发明申请
    • Methods of Forming Capacitors
    • 形成电容器的方法
    • US20120100283A1
    • 2012-04-26
    • US13339692
    • 2011-12-29
    • Vassil AntonovVishwanath BhatChris Carlson
    • Vassil AntonovVishwanath BhatChris Carlson
    • B05D5/12
    • H01G4/1272H01G4/1209H01G4/1218H01G4/1227H01G4/1245H01G4/1254H01G4/33
    • Some embodiments include methods of forming capacitors. A metal oxide mixture may be formed over a first capacitor electrode. The metal oxide mixture may have a continuous concentration gradient of a second component relative to a first component. The continuous concentration gradient may correspond to a decreasing concentration of the second component as a distance from the first capacitor electrode increases. The first component may be selected from the group consisting of zirconium oxide, hafnium oxide and mixtures thereof; and the second component may be selected from the group consisting of niobium oxide, titanium oxide, strontium oxide and mixtures thereof. A second capacitor electrode may be formed over the first capacitor electrode. Some embodiments include capacitors that contain at least one metal oxide mixture having a continuous concentration gradient of the above-described second component relative to the above-described first component.
    • 一些实施例包括形成电容器的方法。 可以在第一电容器电极上形成金属氧化物混合物。 金属氧化物混合物可以具有相对于第一组分的第二组分的连续浓度梯度。 连续浓度梯度可以对应于与第一电容器电极的距离增加时第二组分的浓度降低。 第一组分可以选自氧化锆,氧化铪及其混合物; 并且第二组分可以选自氧化铌,氧化钛,氧化锶及其混合物。 可以在第一电容器电极上形成第二电容器电极。 一些实施方案包括相对于上述第一组分含有至少一种具有上述第二组分的连续浓度梯度的金属氧化物混合物的电容器。
    • 90. 发明申请
    • HIGH-STABILITY THIN-FILM CAPACITOR AND METHOD FOR MAKING THE SAME
    • 高稳定性薄膜电容器及其制造方法
    • US20100002358A1
    • 2010-01-07
    • US12311529
    • 2007-10-16
    • Emmanuel DefayJulie GuillanSerge Blonkowski
    • Emmanuel DefayJulie GuillanSerge Blonkowski
    • H01G4/00B05D5/12G01R27/26
    • H01G4/1218H01G4/1254H01G4/33H01L27/016H01L28/40H01L28/56
    • The dielectric of a capacitor is formed by superposition of at least two thin layers made from the same metal oxide, respectively in crystalline and amorphous form and respectively presenting quadratic voltage coefficients of capacitance of opposite signs. The respective thicknesses da and dc of the amorphous and crystalline thin layers comply with the following general formulas: d a = ɛ 0  ɛ a C s   0  ( 1 1 - ( ɛ c ɛ a ) 2  γ a γ c )   and   d c = ɛ 0  ɛ c C s   0  ( 1 1 - ( ɛ a ɛ c ) 2  γ c γ a ) in which ε0 corresponds to the electric constant, εc and εa correspond to the relative permittivity of the metal oxide respectively in crystalline form and in amorphous form, Cs0 corresponds to the total surface capacitance at zero field, and γc and γa correspond to the quadratic coefficient of capacitance with respect to the electric field of the metal oxide respectively in crystalline form and in amorphous form.
    • 电容器的电介质通过分别由相同金属氧化物制成的至少两个薄层分别以结晶和非晶形式叠加并且分别呈现相反符号的电容的二次电压系数而形成。 无定形和结晶薄层的各自的厚度da和dc符合以下通式:da =εεεa C s(0)(1 1 - (εcεa)2γ伽马c) 其中epsilon对应于电常数,epsilon和epsilona对应于 金属氧化物的结晶形式和无定形形式的相对介电常数Cs0对应于零场的总表面电容,并且gammac和γa分别对应于分别在金属氧化物中的金属氧化物的电场的二次系数 形式和非晶形式。