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81. 发明申请

US20140264191A1 Multi Shell Metal Particles and Uses Thereof 审中-公开
标题翻译：多壳金属颗粒及其用途
公开(公告)号：US20140264191A1
公开(公告)日：2014-09-18
申请号：US14217553
申请日：2014-03-18
申请人： Inkron Ltd
发明人： Juha Rantala
IPC分类号： H01B1/02 , H01B13/00
CPC分类号： H01L31/022425 , B22F1/02 , B22F1/025 , B32B15/01 , B32B15/018 , C09D5/24 , C09D11/52 , C22C1/0425 , C22C1/0433 , C22C9/00 , C22C9/06 , C23C18/1635 , C23C18/1651 , C23C18/1669 , C23C18/1692 , C23C18/1844 , C23C18/36 , C23C18/44 , H01B1/026 , Y02E10/50
摘要： A composition comprising a plurality of coated metal particles with a metal core surrounded by nested shells formed by an electrically conductive layer and by a barrier layer, at least one of the shells being formed by electroless plating. The invention also comprises a method of producing such compositions as well as the use of the composition in, for example, crystalline-silicon solar cell devices having contact structures formed on one or more surfaces of a solar cell device, such as those used in back contact solar cell devices or emitter wrap through (EWT) solar cell devices.
摘要翻译：一种组合物，其包含多个被涂覆的金属颗粒，其金属芯由被导电层形成的嵌套壳和被阻挡层包围，所述壳中的至少一个通过无电镀形成。本发明还包括制备这种组合物的方法以及组合物在例如具有形成在太阳能电池装置的一个或多个表面上的接触结构的结晶硅太阳能电池装置的用途，例如在背面接触式太阳能电池器件或发射器通过（EWT）太阳能电池器件。

82. 发明申请

US20140134345A1 PLATING APPARATUS, PLATING METHOD AND STORAGE MEDIUM 有权
标题翻译：电镀设备，镀层方法和储存介质
公开(公告)号：US20140134345A1
公开(公告)日：2014-05-15
申请号：US14129623
申请日：2012-06-04
申请人： Yuichiro Inatomi , Takashi Tanaka , Mitsuaki Iwashita
发明人： Yuichiro Inatomi , Takashi Tanaka , Mitsuaki Iwashita
IPC分类号： B05C5/00 , B05D1/02
CPC分类号： B05C5/001 , B05D1/02 , C23C18/1619 , C23C18/1669 , C23C18/1676 , C23C18/168
摘要： A plating apparatus of performing a plating process by supplying a plating liquid onto a substrate includes a substrate holding/rotating device configured to hold and rotate the substrate; a discharging device configured to discharge the plating liquid toward the substrate; a plating liquid supplying device configured to supply the plating liquid to the discharging device; and a controller configured to control the discharging device and the plating liquid supplying device. Further, the discharging device includes a first nozzle having a discharge opening, and a second nozzle having a discharge opening configured to be positioned closer to a central portion of the substrate than the discharge opening of the first nozzle. Furthermore, the plating liquid supplying device is configured to set a temperature of the plating liquid supplied to the first nozzle to be higher than a temperature of the plating liquid supplied to the second nozzle.
摘要翻译：通过将电镀液体供给到基板上进行电镀处理的电镀装置包括：基板保持旋转装置，其构造成保持和旋转基板; 排出装置，被配置为将所述电镀液体朝向所述基板排出; 电镀液供给装置，其配置为将电镀液体供给到排出装置; 以及控制器，其被配置为控制所述排出装置和所述电镀液供给装置。此外，排出装置包括具有排出口的第一喷嘴和具有排出口的第二喷嘴，其被配置为比第一喷嘴的排出口更靠近基板的中心部分。此外，电镀液供给装置被配置为将供给到第一喷嘴的电镀液的温度设定为高于供给到第二喷嘴的电镀液的温度。

83. 发明授权

US08298621B2 Stirring apparatus for combinatorial processing 失效
标题翻译：用于组合处理的搅拌装置
公开(公告)号：US08298621B2
公开(公告)日：2012-10-30
申请号：US13283444
申请日：2011-10-27
申请人： Rajesh Kelekar
发明人： Rajesh Kelekar
IPC分类号： H01L21/66 , C25D5/02 , C25B15/08 , B05B7/06
CPC分类号： C25D21/10 , C23C18/1628 , C23C18/1669 , C25D5/08 , C25D17/001 , C25D17/008 , H01L21/67023
摘要： An apparatus and system for stirring liquid inside a flow cell. In one implementation, the apparatus includes a rotatable disc configured to receive liquid at a top side of the disc and distribute the liquid substantially evenly around a periphery of the flow cell. The disc has a triangular cross sectional area. The apparatus may further include a set of fins attached to a bottom side of the disc, wherein the set of fins is configured to draw the liquid from the periphery of the flow cell into the center of the flow cell.
摘要翻译：用于在流动池内搅拌液体的装置和系统。在一个实施方案中，该装置包括可旋转盘，其构造成在盘的顶侧处接收液体，并将液体基本均匀地分布在流动池的周边周围。盘具有三角形横截面积。该装置还可以包括附接到盘的底侧的一组翅片，其中所述翅片组被配置为将液体从流动池的周边抽吸到流动池的中心。

84. 发明授权

US08058171B1 Stirring apparatus for combinatorial processing 有权
标题翻译：用于组合处理的搅拌装置
公开(公告)号：US08058171B1
公开(公告)日：2011-11-15
申请号：US12140926
申请日：2008-06-17
申请人： Rajesh Kelekar
发明人： Rajesh Kelekar
IPC分类号： H01L21/66 , C25D5/02 , C25B15/08 , B05B7/06
CPC分类号： C25D21/10 , C23C18/1628 , C23C18/1669 , C25D5/08 , C25D17/001 , C25D17/008 , H01L21/67023
摘要： An apparatus and system for stirring liquid inside a flow cell. In one implementation, the apparatus includes a rotatable disc configured to receive liquid at a top side of the disc and distribute the liquid substantially evenly around a periphery of the flow cell. The disc has a triangular cross sectional area. The apparatus may further include a set of fins attached to a bottom side of the disc, wherein the set of fins is configured to draw the liquid from the periphery of the flow cell into the center of the flow cell.
摘要翻译：用于在流动池内搅拌液体的装置和系统。在一个实施方案中，该装置包括可旋转盘，其构造成在盘的顶侧处接收液体，并将液体基本均匀地分布在流动池的周边周围。盘具有三角形横截面积。该装置还可以包括附接到盘的底侧的一组翅片，其中所述翅片组被配置为将液体从流动池的周边抽吸到流动池的中心。

85. 发明授权

US07456102B1 Electroless copper fill process 有权
标题翻译：无电镀铜工艺
公开(公告)号：US07456102B1
公开(公告)日：2008-11-25
申请号：US11248860
申请日：2005-10-11
申请人： Seshasayee Varadarajan , Jian Zhou
发明人： Seshasayee Varadarajan , Jian Zhou
IPC分类号： H01L21/44
CPC分类号： H05K3/422 , C23C18/1608 , C23C18/1651 , C23C18/1653 , C23C18/1669 , C23C18/31 , C23C18/40 , H01L21/288 , H01L21/76868 , H01L21/76874 , H01L21/76879 , H05K2201/09563 , H05K2203/1476
摘要： Disclosed is a procedure for bottom-up fill of electroless copper film in sub-micron integrated circuit features. By repeatedly placing an integrated circuit wafer in an electroless bath, a transient period of time of accelerated growth in the feature is repeated to achieve many small layers of deposition, each of which is thicker near the base of the feature. The net result is filing of the feature from the bottom-up fill without formation of voids. The electroless bath employed to form the continuous electroless copper film may include a reducing agent, a complexing agent, a source of copper ions, a pH adjuster, and optionally one or more surfactants and/or stabilizers.
摘要翻译：公开了一种亚微米集成电路特征中无电解铜膜的自下而上填充的程序。通过将集成电路晶片重复放置在无电镀浴中，重复特征中加速生长的瞬时时间段以实现许多小的沉积层，每个沉积层在特征的基部附近较厚。最终的结果是从自下而上的填充填充特征，而不形成空隙。用于形成连续无电镀铜膜的无电镀浴可以包括还原剂，络合剂，铜离子源，pH调节剂和任选的一种或多种表面活性剂和/或稳定剂。

86. 发明授权

US07160582B2 Method for forming on a metallic substrate a sulphur-free metallic coating 有权
标题翻译：在金属基材上形成无硫金属涂层的方法
公开(公告)号：US07160582B2
公开(公告)日：2007-01-09
申请号：US10240148
申请日：2001-03-26
申请人： Benoît Girard , Marie-Pierre Bacos , Eric Berger , Pierre Josso
发明人： Benoît Girard , Marie-Pierre Bacos , Eric Berger , Pierre Josso
IPC分类号： B05D1/18
CPC分类号： C23C18/1671 , C23C18/1637 , C23C18/165 , C23C18/1653 , C23C18/1662 , C23C18/1669 , C23C18/1676 , C23C18/1694 , C23C18/1696 , C23C18/34 , Y02T50/67
摘要： The invention concerns a method wherein the substrate (5) to be coated is immersed in an autocatalytic chemical deposit bath (4), for example nickel, contained in a stainless steel vessel (1) and wherein can be optionally mixed a suspended MCrAlY alloy, so as to form a metal deposit (nickel) wherein are optionally included powder particles. The invention is characterised in that, to provide a prolonged operation of the bath, it consists in measuring with a voltmeter (8) the difference of potential between the substrate (5) and a reference electrode (6) immersed in the bath (4), and in imposing between the substrate (5) and the vessel (1) an electric current produced by a generator (10), said current being adjusted by a regulator (11) so as to maintain said potential difference at a selected value.
摘要翻译：本发明涉及一种方法，其中待涂覆的基底（5）浸入包含在不锈钢容器（1）中的自动催化化学沉积浴（4），例如镍中，并且其中可以任选地将悬浮的MCrAlY合金，以形成金属沉积物（镍），其中任选地包括粉末颗粒。本发明的特征在于，为了提供浴的长时间操作，它包括用电压表（8）测量衬底（5）和浸入浴（4）中的参比电极（6）之间的电位差，并且在衬底（5）和容器（1）之间施加由发电机（10）产生的电流，所述电流由调节器（11）调节，以将所述电位差保持在选定值。

87. 发明申请

US20060091016A1 Method and apparatus for plating extrusion dies 审中-公开
标题翻译：电镀挤出模具的方法和装置
公开(公告)号：US20060091016A1
公开(公告)日：2006-05-04
申请号：US10978124
申请日：2004-10-29
申请人： James Avery , James Bernas , Mark Humphrey
发明人： James Avery , James Bernas , Mark Humphrey
IPC分类号： C25D21/18 , C25B15/00
CPC分类号： C23C18/1669 , C23C18/1616 , C23C18/1617 , C23C18/163
摘要： Method and apparatus are set forth for providing a substantially uniform coating on inner wall portions of a die having slots or openings formed in the face of the die. The die is supported by a fixture for up and down movement while it is immersed in a bath of a desired plating solution. A tube or cylinder positioned on an upper surface portion of the die repeatedly collects a column of plating material in a cylinder from the bath on downward movements of the die, so as to provide fresh or replenishment plating solution to the die. The column of plating solution in the cylinder functions as a hydrostatic head and forces the confined solution into the interior of the die on upward movements, thus promoting coating uniformity along inner walls of the die. The die may be rotated 180 degrees so that each face of the die may be subjected to the hydrostatic force flow of the plating solution, also resulting in a more uniform coating.
摘要翻译：阐述了在模具的内壁部分上提供基本上均匀的涂层的方法和装置，所述模具具有形成在模具表面上的槽或开口。模具由固定装置支撑，用于上下移动，同时将其浸入所需电镀液的浴中。定位在模具的上表面部分上的管或圆筒在模具的向下运动时，从浴中反复收集圆筒中的电镀材料柱，以便向模具提供新鲜的或补充的电镀溶液。气缸中的电镀溶液柱用作静水压头，并将限制的溶液推向模具的内部向上运动，从而提高模头内壁的涂层均匀性。模具可以旋转180度，使得模具的每个表面可能受到电镀液的静水力流动，还导致更均匀的涂层。

88. 发明申请

US20060037858A1 Electroless plating apparatus and electroless plating method 审中-公开
标题翻译：无电镀设备和化学镀方法
公开(公告)号：US20060037858A1
公开(公告)日：2006-02-23
申请号：US10528117
申请日：2003-05-23
申请人： Yoshinori Marumo , Miho Jomen , Takayuki Komiya , Hiroshi Sato , Gishi Chung
发明人： Yoshinori Marumo , Miho Jomen , Takayuki Komiya , Hiroshi Sato , Gishi Chung
IPC分类号： C25D17/06
CPC分类号： C23C18/1619 , C23C18/1669 , C23C18/1678
摘要： A plate is placed near a substrate held by a substrate holding section. A treating liquid is ejected from a treating liquid ejecting section, thereby plating the substrate electrolessly. The treating liquid flows through the gap between the substrate and the plate. Therefore a flow of the treating liquid occurs on the substrate. As a result, a fresh treating liquid can be supplied onto the substrate. Thus, a plating film can be formed very uniformly on the substrate even if the amount of treating liquid is small.
摘要翻译：将板放置在由基板保持部保持的基板附近。处理液从处理液喷射部喷出，由此无电解地镀覆基板。处理液体流过基板和板之间的间隙。因此，处理液的流动发生在基板上。结果，可以将新鲜的处理液体供应到基底上。因此，即使处理液的量少，也可以在基板上非常均匀地形成镀膜。

89. 发明申请

US20050217574A1 Fixture and method for uniform electroless metal deposition on integrated circuit bond pads 审中-公开
标题翻译：集成电路接合焊盘上均匀无电金属沉积的夹具和方法
公开(公告)号：US20050217574A1
公开(公告)日：2005-10-06
申请号：US11137013
申请日：2005-05-25
申请人： Gonzalo Amador , Roger Stierman
发明人： Gonzalo Amador , Roger Stierman
IPC分类号： C23C18/16 , C23C18/31 , C23C18/36 , H01L21/288 , H01L21/3205 , H01L21/60 , H01L23/52 , B05C3/00 , B05C19/02
CPC分类号： H01L21/288 , C23C18/1619 , C23C18/1669 , H01L24/02 , H01L24/11 , H01L2224/0401 , H01L2224/04042 , H01L2224/13099 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2924/00011 , H01L2924/01004 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/14 , H01L2924/3025 , H01L2924/00 , H01L2924/00014
摘要： A method and an apparatus for uniform electroless plating of layers onto exposed metallizations in integrated circuits such as bond pads. The apparatus provides means for holding a plurality of wafers, and rotating each wafer at constant speed and synchronous within the plurality. Immersed in a plating solution flowing in substantially laminar motion and at constant speed, the method creates periodic superposition of directions and speeds of the motion of the wafers and the motion of the plating solution. The invention creates periodically changing wafer portions where the directions and speeds are additive and where the directions and speeds are opposed and subtractive. Consequently, highly uniformly layers are electrolessly plated onto the exposed metallizations of bond pads. If the plated layers are bondable metals, the process transforms otherwise unbondable pad metallization into bondable pads.
摘要翻译：一种用于在诸如接合焊盘的集成电路中的均匀化学镀电镀到暴露的金属化的方法和装置。该装置提供用于保持多个晶片的装置，并且在多个晶片内以恒定速度和同步旋转每个晶片。浸入基本层流运动和恒定速度流动的镀液中，该方法产生晶片的运动方向和速度以及电镀液的运动的周期性重叠。本发明创造周期性变化的晶片部分，其中方向和速度是相加的，并且其方向和速度是相反的和减法的。因此，高度均匀的层被无电镀在接合焊盘的暴露的金属化上。如果镀层是可结合的金属，则该工艺将其它不可焊接的焊盘金属化转变成可粘合的焊盘。

90. 发明申请

US20040245106A1 Liquid tank 有权
标题翻译：液体罐
公开(公告)号：US20040245106A1
公开(公告)日：2004-12-09
申请号：US10847611
申请日：2004-05-18
申请人： Yamamoto-MS Co., Ltd.
发明人： Wataru Yamamoto
IPC分类号： C25D001/00 , C25D017/00
CPC分类号： C23C18/1619 , C23C18/1669 , C25D17/02 , C25D21/10
摘要： The present invention provides a liquid tank which has a compact construction comprising a process bath, an agitation service bath, an agitation room, a liquid supply tunnel, and a liquid supply outlet.
摘要翻译：本发明提供一种具有紧凑结构的液体罐，其包括处理槽，搅拌槽，搅拌室，液体供应通道和液体供应出口。

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