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81. 发明申请

US20100048102A1 POLISHING PAD 有权
标题翻译：抛光垫
公开(公告)号：US20100048102A1
公开(公告)日：2010-02-25
申请号：US12593206
申请日：2008-03-13
申请人： Yoshiyuki Nakai , Atsushi Kazuno , Tsuyoshi Kimura , Tetsuo Shimomura , Kazuyuki Ogawa
发明人： Yoshiyuki Nakai , Atsushi Kazuno , Tsuyoshi Kimura , Tetsuo Shimomura , Kazuyuki Ogawa
IPC分类号： B24B7/20 , C08J9/00
CPC分类号： B24B37/24 , B24D3/32 , C08G18/10 , C08G18/12 , C08G18/4833 , C08G18/4854 , C08G18/6674 , C08G18/724 , C08G2101/0025 , C08G18/3802 , C08G18/792 , C08G18/3206
摘要： A polishing pad capable of maintaining a high level of dimensional stability upon moisture absorption or water absorption and providing high polishing rate includes a polishing layer of a polyurethane foam having fine cells, wherein the polyurethane foam includes a cured product of a reaction of (1) an isocyanate-terminated prepolymer (A) that includes an isocyanate monomer, a high molecular weight polyol (a), and a low molecular weight polyol, (2) an isocyanate-terminated prepolymer (B) that includes a polymerized diisocyanate and a polyethylene glycol with a number average molecular weight of 200 to 1,000, and (3) a chain extender.
摘要翻译：能够在吸湿或吸水性上保持高水平的尺寸稳定性并提供高抛光速度的抛光垫包括具有细孔的聚氨酯泡沫的抛光层，其中聚氨酯泡沫包括（1）的反应的固化产物，包括异氰酸酯单体，高分子量多元醇（a）和低分子量多元醇的异氰酸酯封端的预聚物（A），（2）包含聚合二异氰酸酯和聚乙二醇的异氰酸酯封端的预聚物（B）数均分子量为200〜1000，（3）扩链剂。

82. 发明申请

US20090311946A1 SELF-BONDED FOAMED ABRASIVE ARTICLES AND MACHINING WITH SUCH ARTICLES 有权
标题翻译：自粘泡沫磨料文章和与这些文章的加工
公开(公告)号：US20090311946A1
公开(公告)日：2009-12-17
申请号：US12484059
申请日：2009-06-12
申请人： Muthu Jeevanantham , Xavier Orlhac
发明人： Muthu Jeevanantham , Xavier Orlhac
IPC分类号： B24B1/00 , B24D3/00
CPC分类号： B24B1/00 , B24D3/32
摘要： A self-bonded foamed abrasive article and a method of machining using such an article. The machining method includes providing a workpiece having a worksurface and removing material from the worksurface by moving an abrasive relative to the worksurface, wherein the abrasive comprises a foamed abrasive body consisting of abrasive grains and a porosity of at least about 66 vol %.
摘要翻译：自粘泡沫磨料制品和使用这种制品的机械加工方法。该加工方法包括提供具有工作面的工件，并通过相对于工件表面移动磨料而从工作表面移除材料，其中磨料包括由磨粒组成的泡沫磨料体和至少约66体积％的孔隙率。

83. 发明授权

US07527662B2 Abrasive body and method of manufacturing the same 有权
标题翻译：研磨体及其制造方法
公开(公告)号：US07527662B2
公开(公告)日：2009-05-05
申请号：US11039840
申请日：2005-01-24
申请人： Makoto Sato
发明人： Makoto Sato
IPC分类号： B24D3/00 , B24D3/32
CPC分类号： B24B37/245 , B24D3/32
摘要： An abrasive body for polishing includes a resin structure made of resin and a plurality of abrasive grains wherein a critical surface tension of the resin ranges from 1.6×10−2 to 4.0×10−2 N/m.
摘要翻译：用于抛光的研磨体包括由树脂制成的树脂结构和多个磨粒，其中树脂的临界表面张力为1.6×10 -2至4.0×10 -2 N / m。

84. 发明申请

US20090068614A1 Dental polishing article which contains spherical resin particles 有权
标题翻译：含有球形树脂颗粒的牙科抛光制品
公开(公告)号：US20090068614A1
公开(公告)日：2009-03-12
申请号：US11920133
申请日：2006-05-10
申请人： Syuji Sonoi , Osamu Asao
发明人： Syuji Sonoi , Osamu Asao
IPC分类号： A61C3/06
CPC分类号： A61C3/06 , B24D3/32
摘要： The present invention provides a dental polishing article having excellent polishability, which can polish dental composite resin, porcelain, dental restorative and prosthetic materials and teeth at a low cost, conveniently in a short time. More specifically, the present invention provides a dental polishing article which comprises a polishing portion formed by compounding polishing grains in an elastomer binder, and the polishing portion further comprising spherical resin particles.
摘要翻译：本发明提供了一种具有优异的抛光性的牙科研磨制品，其可以在短时间内方便地以低成本抛光牙科复合树脂，瓷器，牙修复材料和修复材料和牙齿。更具体地，本发明提供一种牙科研磨制品，其包括通过将弹性体粘合剂中的研磨颗粒配混而形成的抛光部分和进一步包含球形树脂颗粒的抛光部分。

85. 发明申请

US20080220701A1 Polishing Pad and Method for Making the Same 审中-公开
标题翻译：抛光垫及其制作方法
公开(公告)号：US20080220701A1
公开(公告)日：2008-09-11
申请号：US12123558
申请日：2008-05-20
申请人： Chung-Ching Feng , Chen-Hsiang Chao , I-Peng Yao , Yung-Chang Hung
发明人： Chung-Ching Feng , Chen-Hsiang Chao , I-Peng Yao , Yung-Chang Hung
IPC分类号： B32B33/00 , B05D5/00 , B24D13/00 , B24D11/00 , B24D3/32 , B24D3/28 , B24D18/00
CPC分类号： B32B5/18 , B24B37/24 , B24D3/32 , B24D11/02 , B24D18/00 , B32B5/24 , B32B27/12 , Y10T428/23914
摘要： A method for making a polishing pad includes providing a non-woven fabric made of a plurality of fibers. The non-woven fabric is submerged with a polymer resin solution. The polymer resin submerged in non-woven fabric is cured to form a porous polymer having an outer face adapted for polishing a workpiece. The outer face of the porous polymer is finished to form a polishing pad with a plurality of naps on the outer face. The plurality of naps on the outer face have a density ranging from 1.0 to 2.0 g/cm3, and the plurality of naps on the outer face have a length ranging from 50 to 600 μm.
摘要翻译：制造抛光垫的方法包括提供由多根纤维制成的无纺布。将无纺布浸入聚合物树脂溶液中。浸没在无纺布中的聚合物树脂被固化以形成具有适于抛光工件的外表面的多孔聚合物。多孔聚合物的外表面被完成以形成在外表面上具有多个绒毛的抛光垫。外表面上的多个绒毛的密度范围为1.0至2.0g / cm 3，外表面上的多个绒毛的长度范围为50至600μm。

86. 发明申请

US20070190909A1 THREE-DIMENSIONAL NETWORK FOR CHEMICAL MECHANICAL POLISHING 有权
标题翻译：化学机械抛光三维网络
公开(公告)号：US20070190909A1
公开(公告)日：2007-08-16
申请号：US11672703
申请日：2007-02-08
申请人： Gregory P. Muldowney
发明人： Gregory P. Muldowney
IPC分类号： B24B7/30 , B24B1/00
CPC分类号： B24B37/24 , B24B37/26 , B24D3/32
摘要： The polishing pad (104) is useful for polishing at least one of magnetic, optical and semiconductor substrates (112) in the presence of a polishing medium (120). The polishing pad (104) includes a three-dimensional network of interconnected unit cells (225). The interconnected unit cells (225) are reticulated for allowing fluid flow and removal of polishing debris. A plurality of polishing elements (208, 308 and 408) form the three-dimensional network of interconnected unit cells (225). The polishing elements (208, 308 and 408) have a first end connected to a first adjacent polishing element at a first junction (209, 309 and 409) and a second end connected to a second adjacent polishing element at a second junction (209, 309 and 409) and having a cross-sectional area (222, 322 and 422) that remains within 30% between the first and the second junctions (209, 309 and 409). The polishing surface (200, 300 and 400) formed from the plurality of polishing elements (208, 308 and 408) remains consistent for multiple polishing operations.
摘要翻译：抛光垫（104）可用于在抛光介质（120）的存在下抛光磁性，光学和半导体衬底（112）中的至少一种。抛光垫（104）包括互连单元电池（225）的三维网络。互连的单元电池（225）被网状以允许流体流动和去除抛光碎片。多个抛光元件（208,308和408）形成互连单元电池（225）的三维网络。抛光元件（208,308和408）具有在第一结（209,309和409）处连接到第一相邻抛光元件的第一端，以及在第二接合处连接到第二相邻抛光元件的第二端， 309和409），并且具有在第一和第二结（209,309和409）之间保持在30％内的横截面面积（222,322和422）。由多个抛光元件（208,308和408）形成的抛光表面（200,300和400）对于多次抛光操作保持一致。

87. 发明申请

US20070180778A1 CMP Porous Pad with Component-Filled Pores 失效
标题翻译： CMP多孔垫与组件填充孔
公开(公告)号：US20070180778A1
公开(公告)日：2007-08-09
申请号：US11690944
申请日：2007-03-26
申请人： Abaneshwar Prasad
发明人： Abaneshwar Prasad
IPC分类号： B24D3/02
CPC分类号： C09G1/02 , B24B37/24 , B24D3/32
摘要： This invention provides a method for polishing pad comprising a polymeric material having pores and a component that is disposed within the pores.
摘要翻译：本发明提供一种抛光垫的方法，其包括具有孔的聚合物材料和设置在孔内的成分。

88. 发明授权

US07160181B2 Polishing pad of CMP equipment for polishing a semiconductor wafer 有权
标题翻译：用于抛光半导体晶片的CMP设备抛光垫
公开(公告)号：US07160181B2
公开(公告)日：2007-01-09
申请号：US10866805
申请日：2004-06-15
申请人： Gun-Ig Jeung
发明人： Gun-Ig Jeung
IPC分类号： B24B1/00
CPC分类号： B24B37/205 , B24D3/32
摘要： A polishing pad used for polishing the surface of a semiconductor wafer in CMP equipment, includes a support layer adhered to the top of a rotary plate of the CMP equipment, a polishing layer disposed on top of the support layer, and an adhesive layer interposed between the support layer and the polishing layer and adhesively fixing the polishing layer to the support layer. In one embodiment, the polishing support layer is a plate-shaped molded article formed of a mixture including magnetic powder and a bonding agent containing synthetic resin. In another embodiment, a protective film extends along outer peripheral side walls of the adhesive layer and the support layer.
摘要翻译：用于抛光CMP设备中的半导体晶片的表面的抛光垫包括粘附到CMP设备的旋转板的顶部的支撑层，设置在支撑层顶部的抛光层，以及介于支撑层和抛光层，并将抛光层粘合固定在支撑层上。在一个实施方案中，抛光支撑层是由包括磁性粉末和含有合成树脂的粘合剂的混合物形成的板状模塑制品。在另一个实施例中，保护膜沿粘合剂层和支撑层的外周侧壁延伸。

89. 发明授权

US07118461B2 Smooth pads for CMP and polishing substrates 有权
公开(公告)号：US07118461B2
公开(公告)日：2006-10-10
申请号：US10397069
申请日：2003-03-24
申请人： Thomas E. West , Guangwei Wu , Donald P. Dietz
发明人： Thomas E. West , Guangwei Wu , Donald P. Dietz
IPC分类号： B24B1/00
CPC分类号： B24B53/017 , B24B53/12 , B24D3/32
摘要： Pads and methods of making the pads for applications such as polishing substrates and chemical mechanical planarization of substrates are provided. The pads include a substantially smooth surface for improved performance.

90. 发明授权

US07101501B2 Single-layer polishing pad and method producing the same 有权
标题翻译：单层抛光垫及其制造方法
公开(公告)号：US07101501B2
公开(公告)日：2006-09-05
申请号：US10908232
申请日：2005-05-03
申请人： Wen-Chang Shih , Yung-Chung Chang , Min-Kuei Chu
发明人： Wen-Chang Shih , Yung-Chung Chang , Min-Kuei Chu
IPC分类号： B29C44/02 , B29C37/00
CPC分类号： B24D11/001 , B24B37/24 , B24D3/32
摘要： A foamed plastic is cut to form a single-layer polishing pad having a desired rigidity and compressibility. A polishing surface of the polishing pad has a higher density than a mounting surface of the polishing pad. The polishing surface and the mounting surface may have different areas having different densities for achieving desired rigidity and compressibility property. Furthermore, methods of making such single-layer polishing pads are also disclosed.
摘要翻译：切割发泡塑料以形成具有所需刚度和压缩性的单层抛光垫。抛光垫的抛光表面具有比抛光垫的安装表面更高的密度。抛光表面和安装表面可以具有不同的具有不同密度的区域，以实现所需的刚性和可压缩性。此外，还公开了制造这种单层抛光垫的方法。

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