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81. 发明申请

US20080087709A1 Bumping Electronic Components Using Transfer Substrates 有权
标题翻译：使用转移衬底冲击电子元件
公开(公告)号：US20080087709A1
公开(公告)日：2008-04-17
申请号：US11925493
申请日：2007-10-26
申请人： John Mackay
发明人： John Mackay
IPC分类号： B23K37/04
CPC分类号： B23K37/00 , B23K3/0623 , B23K2101/36 , H01L21/6835 , H01L24/11 , H01L24/742 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01075 , H01L2924/014 , H01L2924/14 , H05K3/3478 , H01L2224/0401
摘要： A method for forming solder bumps on an electronic component. Providing a transfer substrate having a plurality of solder balls, disposing the transfer substrate on the surface of the electronic component, heating to reflow the solder balls onto the electronic component; and removing the sacrificial substrate. The transfer substrate may comprise a sacrificial film and a metal layer patterned with a mask which is used to form solder balls on the transfer substrate. Or, the transfer substrate may comprise a sheet of silicone rubber having solder balls embedded at least partially in the sheet. A method of aligning a part being bumped with a transfer substrate, using a shuttle mechanism and an alignment film is disclosed.
摘要翻译：一种在电子部件上形成焊料凸点的方法。提供具有多个焊球的转印衬底，将转印衬底设置在电子部件的表面上，加热以将焊球回流到电子部件上; 并去除牺牲衬底。转移衬底可以包括牺牲膜和用掩模图案化的金属层，该掩模用于在转移衬底上形成焊球。或者，转印衬底可以包括具有至少部分地嵌入片材中的焊球的硅橡胶片。公开了一种使用梭机构和取向膜将被凸起部分与转印衬底对准的方法。

82. 发明申请

US20080050209A1 CONDUCTIVE MEMBER SUPPLY APPARATUS AND CONDUCTIVE MEMBER SUPPLY METHOD 审中-公开
标题翻译：导电成员供应装置和导电成员供应方法
公开(公告)号：US20080050209A1
公开(公告)日：2008-02-28
申请号：US11842644
申请日：2007-08-21
申请人： Toru Mizuno , Kazuaki Takanuki , Tatsuya Wagou
发明人： Toru Mizuno , Kazuaki Takanuki , Tatsuya Wagou
IPC分类号： B65G53/12 , H01L21/67
CPC分类号： B23K3/0623 , H02G3/30 , H05K3/3478
摘要： A conductive member supply apparatus including a reservoir portion containing an internal space in which the conductive members are stored and a first gas-passing aperture communicating with the internal space, an alignment portion including an alignment path in which the conductive members are arranged in a row and which communicates with the internal space, and a second gas-passing aperture communicating with the alignment path, a stopper for closing/opening the alignment path, first gas supply unit which supplies gas to the alignment path from the first gas-passing aperture and through the internal space, second gas supply unit which supplies gas to the aligning direction of the conductive members from the second gas-passing aperture, and control unit which activates the first gas supply unit to supply gas in a state where the stopper is closed, wherein a distance between the second gas-passing aperture and the stopper along a direction of the alignment is substantially within a range of from a dimension of one conductive member to a dimension of one and a half conductive members.
摘要翻译：一种导电构件供给装置，包括储存部，该储存部包含存储有导电构件的内部空间和与内部空间连通的第一气体通过孔，对准部，其具有将导电构件排列成一列的取向路径和与内部空间连通的第二气体通过孔和与对准路径连通的第二气体通过孔，用于关闭/打开对准路径的止动件，从第一气体通过孔向对准路径供给气体的第一气体供给单元，通过内部空间，从第二气体通过孔向导电构件的排列方向供给气体的第二气体供给单元以及在止动器关闭的状态下启动第一气体供给单元供给气体的控制单元，其中所述第二气体通过孔和所述止动件沿着所述取向的方向之间的距离基本上在一定的范围内从一个导电构件的尺寸到一个半导电构件的尺寸。

83. 发明授权

US07285486B2 Ball transferring method and apparatus 有权
标题翻译：球转移方法和装置
公开(公告)号：US07285486B2
公开(公告)日：2007-10-23
申请号：US11094051
申请日：2005-03-30
申请人： Kenji Shimokawa , Eiji Hashino , Kohei Tatsumi
发明人： Kenji Shimokawa , Eiji Hashino , Kohei Tatsumi
IPC分类号： H01L21/44
CPC分类号： B23K3/0623 , B23K2101/40 , H01L21/4853 , H01L21/6838 , H01L24/11 , H01L2224/05573 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01023 , H01L2924/01033 , H01L2924/01037 , H01L2924/01051 , H01L2924/01074 , H01L2924/01079 , H01L2924/01087 , H01L2924/01088 , H01L2924/014 , H01L2924/04953 , H05K3/3478 , H05K2203/041 , H05K2203/082
摘要： Balls are sucked onto a carrier board so as to be temporarily arranged in a ball arrangement region of the board, and then the balls are transferred and bonded onto an objective substance with their positions being adjusted. Gas blow is applied to the temporarily arranged balls or alternatively the temporarily arranged balls are sucked, so as to remove excess balls other than balls that have been exactly sucked onto the ball arrangement region. Cooperation with application of fine vibration to the carrier board makes the removal of the excess balls more efficient.
摘要翻译：将球吸附到载体板上，以便暂时地布置在板的球形布置区域中，然后将球转移并粘合到目标物质上并调整它们的位置。对临时布置的球施加气体吹动，或者临时布置的球被吸入，以便去除已经精确吸入球配置区域的球以外的多余的球。携带精细振动的合作使得多余的滚珠更加有效的去除。

84. 发明授权

US07240822B2 Ball mounting method 失效
标题翻译：球安装方法
公开(公告)号：US07240822B2
公开(公告)日：2007-07-10
申请号：US11407536
申请日：2006-04-19
申请人： Masao Takeuchi , Yoshiharu Fujimori , Chuji Tomita
发明人： Masao Takeuchi , Yoshiharu Fujimori , Chuji Tomita
IPC分类号： B23K1/00 , B23K3/00
CPC分类号： H01L24/11 , B23K3/0623 , B23K2101/40 , H01L21/4853 , H01L2224/13099 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H05K3/3478 , H05K2203/0292 , H05K2203/041 , H05K2203/082
摘要： A ball mounting apparatus and method for mounting a plurality of balls sucked up and held by a head onto a workpiece. The apparatus includes a positioning mechanism for the workpiece, a ball supply device for supplying the balls, the head for sucking up the balls, a force generating device for urging the head upward, a clamping device for clamping the head in a condition in which this force generating device stores the force, and a moving mechanism for moving the head. The force of the force generating device is able to lift the head above a lower stop which is a component of the clamping device.
摘要翻译：一种用于安装被头部吸附并保持在工件上的多个球的球安装装置和方法。该装置包括用于工件的定位机构，用于供应球的球供给装置，用于吸入球的头部，用于向上推动头部的力产生装置，用于将头部夹紧的夹紧装置，力产生装置存储力，以及用于移动头部的移动机构。力产生装置的力能够将头抬起在作为夹紧装置的部件的下止动件上。

85. 发明申请

US20070086147A1 Printed wiring board 有权
标题翻译：印刷电路板
公开(公告)号：US20070086147A1
公开(公告)日：2007-04-19
申请号：US11476559
申请日：2006-06-29
申请人： Yoichiro Kawamura , Shigeki Sawa , Katsuhiko Tanno , Hironori Tanaka , Naoaki Fujii
发明人： Yoichiro Kawamura , Shigeki Sawa , Katsuhiko Tanno , Hironori Tanaka , Naoaki Fujii
IPC分类号： H02B1/00
CPC分类号： H05K3/3478 , B23K3/0623 , B23K2101/42 , H01L21/4853 , H01L23/49811 , H01L23/544 , H01L24/81 , H01L2223/54473 , H01L2224/05568 , H01L2224/05573 , H01L2224/11334 , H01L2224/16 , H01L2224/16225 , H01L2224/81192 , H01L2224/8121 , H01L2224/81815 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H05K3/3452 , H05K2201/0191 , H05K2201/099 , H05K2203/041 , H05K2203/0557 , H01L2924/00 , H01L2224/05599
摘要： A printed wiring board comprises a wiring substrate provided with at least one conductor circuit, a solder resist layer provided on the surface of the wiring substrate, at least one conductor pad formed from a part of the conductor circuit exposed from an opening provided in the solder resist layer, and at least one solder bump for mounting electronic parts. on the conductor pad. In the printed wiring board, since the at least one conductor pad is aligned at a pitch of about 200 μm or less, and a ratio (W/D) of a diameter W of the solder bump to an opening diameter D of the opening formed in the solder resist layer is about 1.05 to about 1.7, connection reliability and insulation reliability can be easily improved.
摘要翻译：一种印刷电路板，包括配置有至少一个导体电路的布线基板，设置在布线基板的表面上的阻焊层，至少一个导体焊盘，由导体电路的一部分露出，抗蚀剂层和用于安装电子部件的至少一个焊料凸块。在导体垫上。在印刷布线板中，由于至少一个导体焊盘以约200μm或更小的间距对准，并且焊料凸块的直径W与形成的开口的开口直径D的比（W / D）在阻焊层中约1.05〜约1.7，可以容易地提高连接可靠性和绝缘可靠性。

86. 发明申请

US20070075056A1 Soldering device and method for forming electrical solder connections in a disk drive unit 审中-公开
标题翻译：用于在盘驱动单元中形成电焊料连接的焊接装置和方法
公开(公告)号：US20070075056A1
公开(公告)日：2007-04-05
申请号：US11238997
申请日：2005-09-30
申请人： YiuSing Ho , GuoHong Lu
发明人： YiuSing Ho , GuoHong Lu
IPC分类号： B23K26/00
CPC分类号： B23K1/0056 , B23K1/0016 , B23K3/0623 , B23K26/123 , B23K26/14 , B23K26/1476 , B23K2101/42 , G11B5/4846 , G11B5/4853 , H05K3/3442 , H05K3/3447 , H05K3/3478 , H05K3/3494 , H05K2201/10727 , H05K2203/0195 , H05K2203/041 , H05K2203/081 , H05K2203/107
摘要： A soldering device for forming electrical solder connections in a disk drive unit includes a bond head, a laser unit, a pressurized gas supply, and a solder ball supply. The bond head includes a housing that provides a primary passage and two supplemental passages that communicate with the primary passage. The laser unit is operable to direct a laser beam through the primary passage. The pressurized gas supply is operable to deliver pressurized gas through one supplemental passage and into the primary passage. The solder ball supply is operable to deliver a single solder ball through the other supplemental passage and into the primary passage. The primary passage has a tapered configuration structured to maintain a solder ball within the primary passage to allow a laser beam from the laser unit to act upon the solder ball before the solder ball is discharged from the bond head by pressurized gas.
摘要翻译：用于在盘驱动单元中形成电焊料连接的焊接装置包括结合头，激光单元，加压气体供应和焊球供应。结合头包括提供主要通道的壳体和与主要通道连通的两个补充通道。激光单元可操作以将激光束引导通过主通道。加压气体供应可操作以将加压气体通过一个补充通道输送到主通道中。焊球供应可操作以将单个焊球输送通过另一补充通道并进入主通道。主通道具有锥形构造，其被构造成在主通道内保持焊球，以允许来自激光单元的激光束在焊球从加压气体从接合头排出之前作用在焊球上。

87. 发明申请

US20070068996A1 Continuous mode solder jet apparatus 审中-公开
公开(公告)号：US20070068996A1
公开(公告)日：2007-03-29
申请号：US11604442
申请日：2006-11-27
申请人： Warren Farnworth
发明人： Warren Farnworth
IPC分类号： A47J36/02
CPC分类号： H01L21/6715 , B22F2009/0836 , B23K3/0623 , B23K20/004 , B23K2101/40 , B41J2/085 , B41J2/09 , G01N33/6842 , H01L21/67144 , H05K3/3457 , H05K2203/013 , H05K2203/105
摘要： A solder jet apparatus is disclosed. The solder jet apparatus is a continuous mode solder jet that includes a blanking system and raster scan system. The use of the raster scan and blanking systems allows for a continuous stream of solder to be placed anywhere on the surface in any desired X-Y plane. This allows for greater accuracy as well as greater product throughput. Additionally, with the raster scan system, repairs to existing soldered surfaces can be quickly and easily performed using a map of the defects for directing the solder to the defects.

88. 发明申请

US20070052112A1 Support with solder ball elements and a method for populating substrates with solder balls 有权
标题翻译：支持焊球元件和用焊球填充基板的方法
公开(公告)号：US20070052112A1
公开(公告)日：2007-03-08
申请号：US10565259
申请日：2005-05-17
申请人： Michael Bauer , Thomas Bemmerl , Edward Fuergut , Simon Jerebic , Herman Vilsmeier
发明人： Michael Bauer , Thomas Bemmerl , Edward Fuergut , Simon Jerebic , Herman Vilsmeier
IPC分类号： H01L23/48
CPC分类号： H05K3/3478 , B23K3/0623 , B23K2101/40 , H01L21/4853 , H01L21/6835 , H01L23/3128 , H01L23/49805 , H01L24/11 , H01L24/12 , H01L24/16 , H01L25/105 , H01L2224/05571 , H01L2224/05573 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2224/16225 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01032 , H01L2924/01033 , H01L2924/01052 , H01L2924/01068 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/12042 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H05K2201/0108 , H05K2203/0338 , H05K2203/041 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： The invention relates to a support (4) with solder ball elements (1) for loading substrates (2) with ball contacts. Furthermore, the invention relates to a system for loading substrates (2) with ball contacts and to a method for loading substrates (2) with ball contacts. For this purpose, the support (4) has a layer of adhesive (5) applied on one side, the layer of adhesive (5) losing its adhesive force to the greatest extent when irradiated. Furthermore, the support (4) has solder ball elements (1), which are arranged closely packed in rows (6) and columns (7) on the layer of adhesive (5) in a prescribed pitch (w) for a semiconductor chip or a semiconductor component.
摘要翻译：本发明涉及一种具有用于加载具有球接触件的基板（2）的焊球元件（1）的支撑件（4）。此外，本发明涉及一种用于装载具有球接触件的基板（2）的系统以及用于将基板（2）与球接触件一起加载的方法。为此，支撑体（4）具有一侧施加的粘合剂层（5），当照射时，粘合剂层（5）最大程度地失去其粘合力。此外，支撑件（4）具有焊料球元件（1），其以规定的用于半导体芯片的间距（w）紧密地排列在粘合剂层（5）上的行（6）和列（7）中，或半导体元件。

89. 发明申请

US20070012749A1 Method of bonding metal ball for magnetic head assembly 有权
标题翻译：磁头组合金属球的方法
公开(公告)号：US20070012749A1
公开(公告)日：2007-01-18
申请号：US11480095
申请日：2006-06-30
申请人： Ooki Yamaguchi , Takao Haino
发明人： Ooki Yamaguchi , Takao Haino
IPC分类号： B23K31/02 , B23K26/00
CPC分类号： B23K3/0623 , B23K2101/40 , G11B5/4853 , H01L2224/742 , H05K3/3442 , H05K3/3494 , H05K2201/10727 , H05K2203/0195 , H05K2203/041 , H05K2203/086 , H05K2203/107 , Y02P70/613 , Y10T29/49032 , Y10T29/49043 , Y10T29/49046 , Y10T29/49048 , Y10T29/49052
摘要： A method of bonding a metal ball for a magnetic head assembly is provided. The method comprises: preparing a capillary; disposing the capillary so as to face a bonding surface of the electrode pad of the slider and that of the electrode pad of the flexible printed circuit board; carrying the metal ball to the bonding surfaces by introducing the metal ball and the inactive gas stream into the carrying route of the capillary; positioning and retaining the metal ball on the bonding surfaces by the inactive gas stream passing through the carrying route and issued radially from the cutoff portions; and melting the metal ball by directly applying laser beams via the cutoff portions of the capillary, and bonding the electrode pad of the slider and the electrode pad of the flexible printed circuit board by the melted metal.
摘要翻译：提供了一种粘合用于磁头组件的金属球的方法。该方法包括：制备毛细管; 布置毛细管以面对滑块的电极焊盘和柔性印刷电路板的电极焊盘的接合表面; 通过将金属球和惰性气体流引入毛细管的运送路径，将金属球携带到接合表面; 通过穿过承载路径的惰性气流将金属球定位并保持在接合表面上，并从切断部分径向发出; 并且通过直接通过毛细管的切断部分施加激光束来熔化金属球，并通过熔融金属将滑块的电极焊盘和柔性印刷电路板的电极焊盘接合。

90. 发明申请

US20070000976A1 Electrically-isolated interconnects and seal rings in packages using a solder preform 有权
公开(公告)号：US20070000976A1
公开(公告)日：2007-01-04
申请号：US11174409
申请日：2005-06-30
申请人： Leonel Arana , John Heck
发明人： Leonel Arana , John Heck
IPC分类号： B23K35/12 , B23K31/02
CPC分类号： B23K3/0623 , B23K2101/38 , H01L2224/17
摘要： Embodiments include electronic assemblies and methods for forming electronic assemblies. One embodiment includes a method of forming a MEMS device assembly, including forming an active MEMS region on a substrate. A plurality of bonding pads electrically coupled to the active MEMS region are formed. A seal ring wetting layer is also formed on the substrate, the seal ring wetting layer surrounding the active MEMS region. A single piece solder preform is positioned on the bonding pads and on the seal ring wetting layer, the single piece solder preform including a seal ring region and a bonding pad region. The seal ring region is connected to the bonding pad region by a plurality of solder bridges. The method also includes heating the single piece solder preform to a temperature above the reflow temperature, so that the bridges split and the solder from the preform accumulates on the seal ring wetting layer and the bonding pads. A lid is coupled to the solder. In certain embodiments the lid may include vias having conductive material therein for providing electrical contact to the MEMS device.

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