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1. 发明授权

US07810705B2 Apparatus and method for supplying electrically conductive material 有权
标题翻译：用于提供导电材料的设备和方法
公开(公告)号：US07810705B2
公开(公告)日：2010-10-12
申请号：US11854222
申请日：2007-09-12
申请人： Toru Mizuno , Kazuaki Takanuki , Tatsuya Wagou
发明人： Toru Mizuno , Kazuaki Takanuki , Tatsuya Wagou
IPC分类号： B23K35/12
CPC分类号： B23K3/0623 , B23K2101/38 , H05K3/3478 , H05K2203/0195 , H05K2203/041 , H05K2203/082 , H05K2203/086
摘要： In a conductive material supply apparatus that can connect a small slider electrode and a wiring electrode on a flexure in a miniaturized magnetic head, electrically conductive material is supplied, with the aid of flow of nitrogen gas that is pressurized to a first pressure, into the interior of a nozzle assembly that defines an interior space having a nozzle orifice through which the electrically conductive material can pass. After the electrically conductive material has been supplied, the flow of the nitrogen gas is stopped, and the interior space is temporarily brought into communication with the exterior space thereby decreasing the pressure in the interior space. Thereafter, nitrogen gas maintained at a second pressure that is designed to be lower than the first pressure is supplied to the interior space, whereby the electrically conductive material is ejected to the exterior from the nozzle orifice by the effect of the second pressure.
摘要翻译：在小型磁头中的弯曲部上可以连接小滑块电极和布线电极的导电材料供给装置中，借助于加压到第一压力的氮气流，供给导电材料，喷嘴组件的内部限定具有喷嘴孔的内部空间，导电材料可以通过该喷嘴孔通过。在提供导电材料之后，停止氮气的流动，并且内部空间暂时与外部空间连通，从而减小内部空间中的压力。此后，保持在设计为低于第一压力的第二压力的氮气被供应到内部空间，由此导电材料通过第二压力从喷嘴孔喷射到外部。

2. 发明申请

US20080050209A1 CONDUCTIVE MEMBER SUPPLY APPARATUS AND CONDUCTIVE MEMBER SUPPLY METHOD 审中-公开
标题翻译：导电成员供应装置和导电成员供应方法
公开(公告)号：US20080050209A1
公开(公告)日：2008-02-28
申请号：US11842644
申请日：2007-08-21
申请人： Toru Mizuno , Kazuaki Takanuki , Tatsuya Wagou
发明人： Toru Mizuno , Kazuaki Takanuki , Tatsuya Wagou
IPC分类号： B65G53/12 , H01L21/67
CPC分类号： B23K3/0623 , H02G3/30 , H05K3/3478
摘要： A conductive member supply apparatus including a reservoir portion containing an internal space in which the conductive members are stored and a first gas-passing aperture communicating with the internal space, an alignment portion including an alignment path in which the conductive members are arranged in a row and which communicates with the internal space, and a second gas-passing aperture communicating with the alignment path, a stopper for closing/opening the alignment path, first gas supply unit which supplies gas to the alignment path from the first gas-passing aperture and through the internal space, second gas supply unit which supplies gas to the aligning direction of the conductive members from the second gas-passing aperture, and control unit which activates the first gas supply unit to supply gas in a state where the stopper is closed, wherein a distance between the second gas-passing aperture and the stopper along a direction of the alignment is substantially within a range of from a dimension of one conductive member to a dimension of one and a half conductive members.
摘要翻译：一种导电构件供给装置，包括储存部，该储存部包含存储有导电构件的内部空间和与内部空间连通的第一气体通过孔，对准部，其具有将导电构件排列成一列的取向路径和与内部空间连通的第二气体通过孔和与对准路径连通的第二气体通过孔，用于关闭/打开对准路径的止动件，从第一气体通过孔向对准路径供给气体的第一气体供给单元，通过内部空间，从第二气体通过孔向导电构件的排列方向供给气体的第二气体供给单元以及在止动器关闭的状态下启动第一气体供给单元供给气体的控制单元，其中所述第二气体通过孔和所述止动件沿着所述取向的方向之间的距离基本上在一定的范围内从一个导电构件的尺寸到一个半导电构件的尺寸。

3. 发明申请

US20060237514A1 SOLDER DISPENSER 有权
标题翻译：焊接分配器
公开(公告)号：US20060237514A1
公开(公告)日：2006-10-26
申请号：US11279693
申请日：2006-04-13
申请人： Tatsuya WAGOU , Toru Mizuno , Osamu Shindo
发明人： Tatsuya WAGOU , Toru Mizuno , Osamu Shindo
IPC分类号： B23K1/08
CPC分类号： B23K3/0615 , H01L2224/11 , H05K3/3478
摘要： A solder dispenser provides a cylindrical dispensing container which has a solder inlet for introducing the above-mentioned solder member, and an opening portion for discharging the above-mentioned solder member to the external, and forms an internal space where the solder member can fall between the above-mentioned solder inlet and the above-mentioned opening portion, and a solder supply portion which is detachably mounted in the dispensing container and holds the solder member, wherein, in a state that the above-mentioned lid member is mounted in the above-mentioned dispensing container, the above-mentioned solder supply portion holds the above-mentioned solder member in the opening region of the above-mentioned solder inlet and the above-mentioned internal space becomes a closed space except the above-mentioned opening portion, and wherein, when holding of the solder member is released, the solder member falls inside a closed space to arrive at the opening portion.
摘要翻译：焊料分配器提供圆柱形分配容器，其具有用于引入上述焊料构件的焊料入口和用于将上述焊料部件排出到外部的开口部分，并形成内部空间，焊料部件可以落在上述焊料入口和上述开口部分，以及可拆卸地安装在分配容器中并保持焊料构件的焊料供应部分，其中，在上述盖构件安装在上述状态下上述焊料供给部将上述焊料保持在上述焊料入口的开口区域中，上述内部空间成为除上述开口部以外的封闭空间，其中，当焊料部件的保持被释放时，焊料部件落入封闭空间内以到达开口部分。

4. 发明申请

US20090001054A1 BONDING METHOD AND BONDING APPARATUS 审中-公开
标题翻译：接合方法和接合装置
公开(公告)号：US20090001054A1
公开(公告)日：2009-01-01
申请号：US12143267
申请日：2008-06-20
申请人： Toru Mizuno , Tatsuya Wagou , Hidetoshi Suzuki
发明人： Toru Mizuno , Tatsuya Wagou , Hidetoshi Suzuki
IPC分类号： B23K11/00 , B23K11/24
CPC分类号： B23K1/0056 , B23K3/0623 , B23K2101/36 , H01L2224/05568 , H01L2224/05573 , H01L2224/11334 , H01L2224/742 , H01L2924/00014 , H05K3/3478 , H05K3/3494 , H05K2203/0195 , H05K2203/041 , H05K2203/074 , H05K2203/107 , H01L2224/05599
摘要： The present invention relates to a bonding method or an apparatus for projecting a conductive element from a nozzle onto an object to be bonded and electrically bonding the object to be bonded and the conductive element. The method of invention comprises the steps of: preparing the conductive element having an outer diameter with a curvature radius larger than a curvature radius of a portion of an opening of the nozzle which is in contact with the conductive element; pressurizing and attaching the conductive element to the opening of the nozzle; and supplying a compressed gas into an inner space of the nozzle and projecting the conductive element in a solid phase state onto the object to be bonded.
摘要翻译：本发明涉及一种用于将导电元件从喷嘴突出到待接合物体上并将待接合物体与导电元件电接合的接合方法或装置。本发明的方法包括以下步骤：制备具有曲率半径大于与导电元件接触的喷嘴的开口部分的曲率半径的外径的导电元件; 将导电元件加压并附着到喷嘴的开口; 并将压缩气体供给到所述喷嘴的内部空间，并将所述导电元件以固相状态投影到所述被接合物上。

5. 发明授权

US07348515B2 Solder dispenser 有权
标题翻译：焊接机
公开(公告)号：US07348515B2
公开(公告)日：2008-03-25
申请号：US11279693
申请日：2006-04-13
申请人： Tatsuya Wagou , Toru Mizuno , Osamu Shindo
发明人： Tatsuya Wagou , Toru Mizuno , Osamu Shindo
IPC分类号： B23K26/00
CPC分类号： B23K3/0615 , H01L2224/11 , H05K3/3478
摘要： A solder dispenser provides a cylindrical dispensing container which has a solder inlet for introducing a solder member, and an opening portion for discharging the above-mentioned solder member to the external, and forms an internal space where the solder member can fall between the above-mentioned solder inlet and the above-mentioned opening portion, and a solder supply portion which is detachably mounted in the dispensing container and holds the solder member, wherein, in a state that a lid member is mounted in the above-mentioned dispensing container, the above-mentioned solder supply portion holds the above-mentioned solder member in the opening region of the above-mentioned solder inlet and the above-mentioned internal space becomes a closed space except the above-mentioned opening portion, and wherein, when holding of the solder member is released, the solder member falls inside a closed space to arrive at the opening portion.
摘要翻译：焊料分配器提供圆柱形分配容器，其具有用于引入焊料部件的焊料入口和用于将上述焊接部件排出到外部的开口部分，并且形成内部空间，上述焊料入口和上述开口部分，以及可拆卸地安装在分配容器中并保持焊料部件的焊料供给部，其中，在将盖部件安装在上述分配容器中的状态下，上述焊料供给部将上述焊料保持在上述焊料入口的开口区域中，上述内部空间除了上述开口部分之外成为封闭空间，并且其中，当保持焊料部件被释放，焊料部件落入封闭空间内以到达开口部分。

6. 发明申请

US20070228021A1 ADJOINING APPARATUS AND NOZZLE UNIT THEREFOR 审中-公开
标题翻译：调整装置和喷嘴装置
公开(公告)号：US20070228021A1
公开(公告)日：2007-10-04
申请号：US11686514
申请日：2007-03-15
申请人： Tatsuya Wagou , Osamu Shindo , Toru Mizuno
发明人： Tatsuya Wagou , Osamu Shindo , Toru Mizuno
IPC分类号： B23K26/00
CPC分类号： B23K3/0623 , B23K1/0056
摘要： A nozzle unit for use in an adjoining apparatus which places a heat fused electrically conductive member in an adjoining position for adjoining a first member and a second member, thereby electrically adjoining the first member and the second member, the nozzle unit including: a tubular nozzle assembly having a containing space which contains the conductive member and an aperture which communicates with the containing space, through which the conductive member, contained in the containing space, is ejected to the adjoining position, and which has a diameter larger than a diameter of the conductive member; and a hold member for releasably holding the conductive member in the containing space; wherein the nozzle assembly includes a tubular guide area of an internal diameter same as the diameter of the aperture, in a region from the position of the conductive member, supported by the support member, to the aperture.
摘要翻译：一种用于相邻装置的喷嘴单元，其将热熔接的导电构件放置在邻接位置以邻接第一构件和第二构件，从而与第一构件和第二构件电连接，喷嘴单元包括：管状喷嘴组件，其具有容纳空间的容纳导电构件和与容纳空间连通的孔，容纳在容纳空间中的导电构件通过该孔被排出到邻接位置，并且其直径大于导电构件; 以及保持构件，用于将导电构件可释放地保持在容纳空间中; 其中所述喷嘴组件包括与所述孔的直径相同的内径的管状引导区域，所述引导区域从所述导电构件的位置由所述支撑构件支撑到所述孔。

7. 发明授权

US08499924B2 Chip component carrying method and system, and visual inspection method and system 有权
标题翻译：芯片组件携带方法和系统，目视检查方法和系统
公开(公告)号：US08499924B2
公开(公告)日：2013-08-06
申请号：US13174001
申请日：2011-06-30
申请人： Masayoshi Kobayashi , Toru Mizuno
发明人： Masayoshi Kobayashi , Toru Mizuno
IPC分类号： B65G29/00
CPC分类号： G01N21/95 , G01N21/8803 , G01R31/013
摘要： A method and a system for stabilizing the sight line of a chip component being carried on two discs, for stabilizing delivery of the chip component between the two discs, and improving and stabilizing the inspection accuracy in the visual check of the chip component. This is achieved by employing a mechanism for carrying the chip component while supporting it on the horizontal plane of the first rotary disc and then carrying the chip component while suction-holding it on the vertical plane of the second rotary disc. When the chip component is carried on the first rotary disc, the upper surface and one side face of the chip component are imaged by first and second cameras. When the chip component is carried on the second rotary disc, the lower surface and the other side face of the chip component are imaged by third and fourth cameras.
摘要翻译：一种用于稳定在两个盘上承载的芯片部件的瞄准线的方法和系统，用于稳定两个盘之间的芯片部件的传递，并且改善和稳定芯片部件的视觉检查中的检查精度。这通过采用用于承载芯片部件的机构来实现，同时将其支撑在第一旋转盘的水平面上，然后在将其保持在第二旋转盘的垂直平面上的同时承载芯片部件。当芯片部件承载在第一旋转盘上时，芯片部件的上表面和一个侧面由第一和第二相机成像。当芯片部件承载在第二旋转盘上时，芯片部件的下表面和另一侧面由第三和第四相机成像。

8. 发明授权

US07987968B2 Chip component carrying method and system, and visual inspection method and system 有权
标题翻译：芯片组件携带方法和系统，目视检查方法和系统
公开(公告)号：US07987968B2
公开(公告)日：2011-08-02
申请号：US11578062
申请日：2004-09-07
申请人： Masayoshi Kobayashi , Toru Mizuno
发明人： Masayoshi Kobayashi , Toru Mizuno
IPC分类号： B65G29/00
CPC分类号： G01N21/95 , G01N21/8803 , G01R31/013
摘要： A method and a system for stabilizing the sight line of a chip component being carried on two discs, for stabilizing delivery of the chip component between the two discs, and improving and stabilizing the inspection accuracy in the visual check of the chip component. This is achieved by employing a mechanism for carrying the chip component while supporting it on the horizontal plane of the first rotary disc and then carrying the chip component while suction-holding it on the vertical plane of the second rotary disc. When the chip component is carried on the first rotary disc, the upper surface and one side face of the chip component are imaged by first and second cameras. When the chip component is carried on the second rotary disc, the lower surface and the other side face of the chip component are imaged by third and fourth cameras.
摘要翻译：一种用于稳定在两个盘上承载的芯片部件的瞄准线的方法和系统，用于稳定两个盘之间的芯片部件的传递，并且改善和稳定芯片部件的视觉检查中的检查精度。这通过采用用于承载芯片部件的机构来实现，同时将其支撑在第一旋转盘的水平面上，然后在将其保持在第二旋转盘的垂直平面上的同时承载芯片部件。当芯片部件承载在第一旋转盘上时，芯片部件的上表面和一个侧面由第一和第二相机成像。当芯片部件承载在第二旋转盘上时，芯片部件的下表面和另一侧面由第三和第四相机成像。

9. 发明授权

US07276673B2 Solder bonding method and solder bonding device 有权
标题翻译：焊接方法和焊接接合装置
公开(公告)号：US07276673B2
公开(公告)日：2007-10-02
申请号：US10947294
申请日：2004-09-23
申请人： Osamu Shindo , Toru Mizuno , Satoshi Yamaguchi
发明人： Osamu Shindo , Toru Mizuno , Satoshi Yamaguchi
IPC分类号： B23K26/00
CPC分类号： H05K3/3494 , B23K1/0056 , H01L2224/11003 , H01L2224/742 , H05K3/3442 , H05K2203/041 , H05K2203/107
摘要： A solder bonding method and a solder bonding device are provided, in which solder is melted, and heating of electrode portions is performed by irradiating laser light to an inner side of a region where electrodes portions are provided, making the temperature difference between the electrode portions and the melted solder smaller to improve the wettability of the solder and increase bonding reliability. The solder bonding method and the solder bonding device perform bonding of the electrode portions that are formed on an object to be bonded by melting the solder. After supplying the solder onto the electrode portions before melting, a laser is irradiated to the solder and to the electrode portions in the periphery of the solder. The solder melts, and the electrode portions are heated. The wettability of the solder with respect to the electrode portions thus improves, and the reliability of an electrical connection between the electrode portions can be increased.
摘要翻译：提供焊料接合方法和焊接接合装置，其中焊料熔化，并且通过向设置有电极部分的区域的内侧照射激光来进行电极部分的加热，使得电极部分之间的温度差并且熔化的焊料更小以改善焊料的润湿性并增加焊接可靠性。焊接接合方法和焊接接合装置通过熔化焊料进行形成在待接合物体上的电极部分的接合。在熔融之前将焊料供应到电极部分之后，激光照射到焊料和焊料周围的电极部分。焊料熔化，电极部分被加热。因此焊料相对于电极部的润湿性提高，可以提高电极部之间的电连接的可靠性。

10. 发明申请

US20070205084A1 Chip Component Carrying Method and System, and Visual Inspection Method and System 有权
标题翻译：芯片组件携带方法与系统，目视检查方法与系统
公开(公告)号：US20070205084A1
公开(公告)日：2007-09-06
申请号：US11578062
申请日：2004-09-07
申请人： Masayoshi Kobayashi , Toru Mizuno
发明人： Masayoshi Kobayashi , Toru Mizuno
IPC分类号： B65G29/00
CPC分类号： G01N21/95 , G01N21/8803 , G01R31/013
摘要： A method and a system for stabilizing the sight line of a chip component being carried on two discs, for stabilizing delivery of the chip component between the two discs, and improving and stabilizing the inspection accuracy in the visual check of the chip component. This is achieved by employing a mechanism for carrying the chip component while supporting it on the horizontal plane of the first rotary disc and then carrying the chip component while suction-holding it on the vertical plane of the second rotary disc. When the chip component is carried on the first rotary disc, the upper surface and one side face of the chip component are imaged by first and second cameras. When the chip component is carried on the second rotary disc, the lower surface and the other side face of the chip component are imaged by third and fourth cameras.
摘要翻译：一种用于稳定在两个盘上承载的芯片部件的瞄准线的方法和系统，用于稳定两个盘之间的芯片部件的传递，并且改善和稳定芯片部件的视觉检查中的检查精度。这通过采用用于承载芯片部件的机构来实现，同时将其支撑在第一旋转盘的水平面上，然后在将其保持在第二旋转盘的垂直平面上的同时承载芯片部件。当芯片部件承载在第一旋转盘上时，芯片部件的上表面和一个侧面由第一和第二相机成像。当芯片部件承载在第二旋转盘上时，芯片部件的下表面和另一侧面由第三和第四相机成像。

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