专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

81. 发明申请

US20110265773A1 Composition and Method for Reducing NOx and Smoke Emissions From Diesel Engines at Minimum Fuel Consumption 审中-公开
标题翻译：减少柴油发动机NOx和烟雾排放的最小燃料消耗量的组成和方法
公开(公告)号：US20110265773A1
公开(公告)日：2011-11-03
申请号：US12915908
申请日：2010-10-29
申请人： Yi Xu , Leslie R. Wolf , Shankar Kumar , Donald W. Stanton , Timothy R. Frazier , Bruce G. Bunting
发明人： Yi Xu , Leslie R. Wolf , Shankar Kumar , Donald W. Stanton , Timothy R. Frazier , Bruce G. Bunting
IPC分类号： F02D41/00 , C10L1/04 , F02D28/00
CPC分类号： F02D41/0025 , C10L1/08 , F02D19/061 , F02D19/0649 , F02D19/087 , F02M26/23 , F02M31/13 , F02M2200/95 , Y02T10/36
摘要： A diesel fuel composition is disclosed, as well as a method for reducing NOx and smoke emissions from a diesel engine at minimum fuel consumption which comprises adding to the diesel engine at least one diesel fuel or blending component for a diesel fuel which has a combination of a low T50 in the range of from 190° C. to 280° C., a high cetane number in the range of from 31 to 60, and optionally a high distillation curve slope in the range of from 58° C. to 140° C., which combination is effective to afford a combination of the lowest NOx and smoke emissions at the lowest fuel consumption at independent engine control values for the diesel engine that are optimum to afford production of a combination of the lowest NOx and smoke emissions at the lowest fuel consumption, whereby the NOx and smoke emissions from the diesel engine are reduced by at least 10% and 15%, respectively.
摘要翻译：公开了一种柴油燃料组合物，以及用于以最小燃料消耗量从柴油发动机减少NOx和烟雾排放的方法，其包括向柴油发动机添加至少一种用于柴油燃料的柴油燃料或混合组分，在190℃至280℃的范围内的低T50，在31至60范围内的高十六烷值，以及任选的在58℃至140℃范围内的高蒸馏曲线斜率 C.这种组合在柴油机的独立发动机控制值下以最低的燃料消耗提供最低的NOx和烟雾排放的组合是有效的，其最适于提供生产最低NOx和烟雾排放的组合燃油消耗最低，柴油发动机的NOx和烟气排放量分别降低了10％和15％。

82. 发明授权

US07979814B1 Model implementation on GPU 有权
标题翻译： GPU上的模型实现
公开(公告)号：US07979814B1
公开(公告)日：2011-07-12
申请号：US12047222
申请日：2008-03-12
申请人： Yutao Ma , Yi Xu
发明人： Yutao Ma , Yi Xu
IPC分类号： G06F17/50
CPC分类号： G06F17/5036 , G06T17/00 , G06T2200/28
摘要： Model evaluation and circuit simulation/verification is performed in a graphical processing unit (GPU). A multitude of first texture data corresponding to size parameters of devices are stored. A multitude of second texture data corresponding to instance parameters of the devices are stored. A multitude of third texture data corresponding to models of the devices are stored. A multitude of fourth texture data corresponding to terminal voltages received by the device are stored. A multitude of links linking each device instance to an associated device model, size parameters and instance parameters are stored. A quad having a size defined by the multitude of links is drawn by the quad in the GPU. Each thread in the quad is assigned to a different one of the multitude of links. The computations are carried out in each thread using the linked data to perform the model evaluation.
摘要翻译：在图形处理单元（GPU）中执行模型评估和电路仿真/验证。存储对应于设备的大小参数的多个第一纹理数据。存储对应于设备的实例参数的多个第二纹理数据。存储与设备的模型相对应的多个第三纹理数据。存储对应于由设备接收的端子电压的多个第四纹理数据。将每个设备实例链接到相关设备模型，大小参数和实例参数的多个链接被存储。具有由多个链接定义的大小的四边形由GPU中的四边形绘制。四角形中的每个线程都分配给多个链接中的一个。使用链接的数据在每个线程中执行计算以执行模型评估。

83. 发明申请

US20100246989A1 Multi-Image Deblurring 有权
标题翻译：多图像去角质
公开(公告)号：US20100246989A1
公开(公告)日：2010-09-30
申请号：US12414162
申请日：2009-03-30
申请人： Amit Agrawal , Yi Xu , Ramesh Raskar
发明人： Amit Agrawal , Yi Xu , Ramesh Raskar
IPC分类号： G06K9/40
CPC分类号： G06T5/003 , G06T5/20 , G06T5/50 , G06T2207/10016 , G06T2207/10148 , G06T2207/20201
摘要： Embodiments of the invention describe a method for reducing a blur in an image of a scene. First, we acquire a set of images of the scene, wherein each image in the set of images includes an object having a blur associated with a point spread function (PSF) forming a set of point spread functions (PSFs), wherein the set of PSFs is suitable for null-filling operation. Next, we invert jointly the set of images and the set of PSFs to produce an output image having a reduced blur.
摘要翻译：本发明的实施例描述了一种用于减少场景图像中的模糊的方法。首先，我们获取场景的一组图像，其中图像集合中的每个图像包括具有与形成一组点扩散函数（PSF）的点扩散函数（PSF）相关联的模糊的对象，其中， PSF适用于零填充操作。接下来，我们共同颠倒图像集合和PSF集合以产生具有减小的模糊的输出图像。

84. 发明授权

US07452808B2 Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding 失效
标题翻译：使用导电聚合物铜/铜表面键合方法应用于IC芯片接合
公开(公告)号：US07452808B2
公开(公告)日：2008-11-18
申请号：US10988768
申请日：2004-11-15
申请人： Simon Chooi , Yakub Aliyu , Mei Sheng Zhou , John Sudijono , Subhash Gupta , Sudipto Roy , Paul Ho , Yi Xu
发明人： Simon Chooi , Yakub Aliyu , Mei Sheng Zhou , John Sudijono , Subhash Gupta , Sudipto Roy , Paul Ho , Yi Xu
IPC分类号： H01L21/44
CPC分类号： H01L24/13 , H01L24/11 , H01L24/81 , H01L2224/05001 , H01L2224/05023 , H01L2224/0508 , H01L2224/05568 , H01L2224/1147 , H01L2224/1308 , H01L2224/13083 , H01L2224/13147 , H01L2224/1319 , H01L2224/1329 , H01L2224/133 , H01L2224/81801 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/014 , H01L2924/14 , H01L2924/15747 , H01L2924/00014 , H01L2224/13099 , H01L2924/00
摘要： A semiconductor chip having an exposed metal terminating pad thereover, and a separate substrate having a corresponding exposed metal bump thereover are provided. A conducting polymer plug is formed over the exposed metal terminating pad. A conforming interface layer is formed over the conducting polymer plug. The conducting polymer plug of the semiconductor chip is aligned with the corresponding metal bump. The conforming interface layer over the conducting polymer plug is mated with the corresponding metal bump. The conforming interface layer is thermally decomposed, adhering and permanently attaching the conducting polymer plug with the corresponding metal bump. Methods of forming and patterning a nickel carbonyl layer are also disclosed.
摘要翻译：提供了具有暴露的金属端接垫的半导体芯片，以及在其上具有对应的暴露的金属凸块的单独的基板。在暴露的金属端接垫上形成导电聚合物塞。在导电聚合物塞上形成一个符合标准的界面层。半导体芯片的导电聚合物插塞与相应的金属凸块对准。导电聚合物塞上的一致界面层与相应的金属凸块配合。一致的界面层被热分解，粘附和永久地附着导电聚合物塞与相应的金属凸块。还公开了形成和图案化羰基镍层的方法。

85. 发明授权

US07290189B2 Compilation of calibration information for plural testflows 有权
标题翻译：编辑多个测试流程的校准信息
公开(公告)号：US07290189B2
公开(公告)日：2007-10-30
申请号：US11091681
申请日：2005-03-28
申请人： Zhengrong Zhou , Yi Xu , Kai Yick
发明人： Zhengrong Zhou , Yi Xu , Kai Yick
IPC分类号： G01R31/28
CPC分类号： G01R35/005 , G01R31/2834
摘要： In one embodiment, a selection of plural testflows is first obtained. Each testflow specifies how automated test equipment (ATE) should test at least one device. Calibration information is then identified for each of the testflows, and redundancies in the identified calibration information are eliminated to compile a set of non-redundant information for performing a focused calibration over the ATE and selected testflows.
摘要翻译：在一个实施例中，首先获得多个测试流的选择。每个测试流程指定自动化测试设备（ATE）如何测试至少一个设备。然后为每个测试流程识别校准信息，并且消除所识别的校准信息中的冗余以编译一组用于在ATE和所选择的测试流上进行聚焦校准的非冗余信息。

86. 发明授权

US07195763B2 Surface proteins from gram-positive bacteria having highly conserved motifs and antibodies that recognize them 失效
标题翻译：来自具有高度保守基序的革兰氏阳性细菌的表面蛋白和识别它们的抗体
公开(公告)号：US07195763B2
公开(公告)日：2007-03-27
申请号：US10911507
申请日：2004-08-05
申请人： Yi Xu , Magnus A. O. Hook
发明人： Yi Xu , Magnus A. O. Hook
IPC分类号： A61K39/395 , A61K39/00 , A61K39/40 , A61K45/00 , A61K47/00
CPC分类号： C07K14/3156 , A61K39/00 , A61K2039/505 , C07K14/31 , C07K14/315 , C07K16/1267 , Y10S930/29
摘要： Isolated peptide sequences and proteins containing these sequences are provided which are useful in the prevention and treatment of infection caused by Gram-positive bacteria. The peptide sequences have been shown to be highly conserved motifs in the surface proteins of Gram-positive bacteria, and these consensus sequences include amino acid sequences such as LPXTG (SEQ ID NO:13), ALKTGKIDIIISGMTSTPERKK (SEQ ID NO:14), VEGAVVEKPVAEAYLKQN (SEQ ID NO:15), and EYAGVDIDLAKKIAK (SEQ ID NO:16). By virtue of the highly conserved regions, the sequences and the proteins including these sequences can be utilized to generate antibodies which can recognize these highly conserved motifs and the proteins containing them and thus be useful in the treatment or prevention of a wide range of infections caused by Gram-positive bacteria.
摘要翻译：提供了含有这些序列的分离的肽序列和蛋白质，其可用于预防和治疗由革兰氏阳性菌引起的感染。已经显示肽序列在革兰氏阳性细菌的表面蛋白中是高度保守的基序，并且这些共有序列包括氨基酸序列，例如LPXTG（SEQ ID NO：13），ALKTGKIDIIISGMTSTPERKK（SEQ ID NO：14），VEGAVVEKPVAEAYLKQN （SEQ ID NO：15）和EYAGVDIDLAKKIAK（SEQ ID NO：16）。由于高度保守的区域，包括这些序列的序列和蛋白质可用于产生能识别这些高度保守的基序和含有它们的蛋白质的抗体，因此可用于治疗或预防引起的广泛感染通过革兰氏阳性菌。

87. 发明授权

US06967162B2 Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding 有权
公开(公告)号：US06967162B2
公开(公告)日：2005-11-22
申请号：US10988769
申请日：2004-11-15
申请人： Simon Chooi , Yakub Aliyu , Mei Sheng Zhou , John Sudijono , Subhash Gupta , Sudipto Roy , Paul Ho , Yi Xu
发明人： Simon Chooi , Yakub Aliyu , Mei Sheng Zhou , John Sudijono , Subhash Gupta , Sudipto Roy , Paul Ho , Yi Xu
IPC分类号： H01L21/44 , H01L21/50 , H01L21/60 , H01L23/48 , H01L23/485 , H01L23/52 , H01L29/40
CPC分类号： H01L24/13 , H01L24/11 , H01L24/81 , H01L2224/05001 , H01L2224/05023 , H01L2224/0508 , H01L2224/05568 , H01L2224/1147 , H01L2224/1308 , H01L2224/13083 , H01L2224/13147 , H01L2224/1319 , H01L2224/1329 , H01L2224/133 , H01L2224/81801 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/014 , H01L2924/14 , H01L2924/15747 , H01L2924/00014 , H01L2224/13099 , H01L2924/00
摘要： A semiconductor chip having an exposed metal terminating pad thereover, and a separate substrate having a corresponding exposed metal bump thereover are provided. A conducting polymer plug is formed over the exposed metal terminating pad. A conforming interface layer is formed over the conducting polymer plug. The conducting polymer plug of the semiconductor chip is aligned with the corresponding metal bump. The conforming interface layer over the conducting polymer plug is mated with the corresponding metal bump. The conforming interface layer is thermally decomposed, adhering and permanently attaching the conducting polymer plug with the corresponding metal bump. Methods of forming and patterning a nickel carbonyl layer are also disclosed.

88. 发明授权

US06953839B2 Prokaryotic collagen-like proteins and uses thereof 有权
标题翻译：原核胶原蛋白及其用途
公开(公告)号：US06953839B2
公开(公告)日：2005-10-11
申请号：US10830792
申请日：2004-04-23
申请人： Magnus Höök , Slawomir Lukomski , Yi Xu
发明人： Magnus Höök , Slawomir Lukomski , Yi Xu
IPC分类号： C07H21/04 , C07K14/315 , C12N1/21 , C07K14/00
CPC分类号： C07H21/04 , C07K14/315
摘要： The present invention provides recombinant triple helical proteins or collagen-like proteins comprising a prokaryotic protein or one or more domains of a prokaryotic protein comprising a collagen-like peptide sequence of repeated Gly-Xaa-Yaa triplets and, optionally, one or more domains from a mammalian collagen. Also provided are expression vectors and host cells containing the expression vectors to produce these recombinant proteins and methods of production for the same. Additionally, antibodies are provided that are directed against a recombinant collagen-like protein that, preferably, binds an integrin. Furthermore, a method of screening for potential therapeutic compounds that inhibit the integrin-binding or -interacting activities of recombinant collagen-like proteins.
摘要翻译：本发明提供重组三螺旋蛋白或胶原样蛋白，其包含原核蛋白或原核蛋白的一个或多个结构域，其包含重复Gly-Xaa-Yaa三联体的胶原样肽序列和任选的一个或多个结构域哺乳动物胶原蛋白。还提供了含有表达载体以产生这些重组蛋白的表达载体和宿主细胞及其生产方法。此外，提供针对重组胶原样蛋白的抗体，其优选结合整联蛋白。此外，筛选抑制重组胶原样蛋白的整联蛋白结合或相互作用活性的潜在治疗化合物的方法。

89. 发明申请

US20050090102A1 Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding 有权
标题翻译：使用导电聚合物铜/铜表面键合方法应用于IC芯片接合
公开(公告)号：US20050090102A1
公开(公告)日：2005-04-28
申请号：US10988769
申请日：2004-11-15
申请人： Simon Chooi , Yakub Aliyu , Mei Zhou , John Sudijono , Subhash Gupta , Sudipto Roy , Paul Ho , Yi Xu
发明人： Simon Chooi , Yakub Aliyu , Mei Zhou , John Sudijono , Subhash Gupta , Sudipto Roy , Paul Ho , Yi Xu
IPC分类号： H01L21/44 , H01L21/50 , H01L21/60 , H01L23/48 , H01L23/485 , H01L23/52 , H01L29/40
CPC分类号： H01L24/13 , H01L24/11 , H01L24/81 , H01L2224/05001 , H01L2224/05023 , H01L2224/0508 , H01L2224/05568 , H01L2224/1147 , H01L2224/1308 , H01L2224/13083 , H01L2224/13147 , H01L2224/1319 , H01L2224/1329 , H01L2224/133 , H01L2224/81801 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/014 , H01L2924/14 , H01L2924/15747 , H01L2924/00014 , H01L2224/13099 , H01L2924/00
摘要： A semiconductor chip having an exposed metal terminating pad thereover, and a separate substrate having a corresponding exposed metal bump thereover are provided. A conducting polymer plug is formed over the exposed metal terminating pad. A conforming interface layer is formed over the conducting polymer plug. The conducting polymer plug of the semiconductor chip is aligned with the corresponding metal bump. The conforming interface layer over the conducting polymer plug is mated with the corresponding metal bump. The conforming interface layer is thermally decomposed, adhering and permanently attaching the conducting polymer plug with the corresponding metal bump. Methods of forming and patterning a nickel carbonyl layer are also disclosed.
摘要翻译：提供了具有暴露的金属端接垫的半导体芯片，以及在其上具有对应的暴露的金属凸块的单独的基板。在暴露的金属端接垫上形成导电聚合物塞。在导电聚合物塞上形成一个符合标准的界面层。半导体芯片的导电聚合物插塞与相应的金属凸块对准。导电聚合物塞上的一致界面层与相应的金属凸块配合。一致的界面层被热分解，粘附和永久地附着导电聚合物塞与相应的金属凸块。还公开了形成和图案化羰基镍层的方法。

90. 发明授权

US06627778B2 Selective hydrogenation process for removing C10-C16 diolefins 有权
标题翻译：用于去除C10-C16二烯烃的选择性氢化方法
公开(公告)号：US06627778B2
公开(公告)日：2003-09-30
申请号：US09837986
申请日：2001-04-19
申请人： Yi Xu , Peicheng Wu , Yu Wang , Dong Liu , Zhengguo Ling , Xiaolei Huang
发明人： Yi Xu , Peicheng Wu , Yu Wang , Dong Liu , Zhengguo Ling , Xiaolei Huang
IPC分类号： C07C503
CPC分类号： C07C11/02 , C07C7/163 , C07C2521/04 , C07C2523/04 , C07C2523/14 , C07C2523/44 , C07C2523/50 , C07C2523/52
摘要： The present invention provides an improved selective hydrogenation process for removing C10-C16 diolefins in the product from dehydrogenation of C10-C16 paraffins to mono-olefins, which process includes bringing the mixture stream of paraffins and olefins containing C10-C16 mono-olefins and C10-C16 diolefins into contact with a specific hydrogenation catalyst in a plurality of hydrogenation reactors connected in series under the reaction conditions for hydrogenation. Hydrogen is injected into each reactor respectively. To convert the diolefins in the mixture stream of paraffins and olefins into mono-olefins, &ggr;-alumina having a specific surface area of 50-300 m2/g and a pore volume of 0.2-2.0 cm3/g is used as the supporter of the hydrogenation catalyst, palladium is supported on the supporter as the main catalyst element and an element selected from silver, gold, tin, lead or potassium is supported on the supporter as the promoter.
摘要翻译：本发明提供了一种改进的选择性氢化方法，用于从C10-C16链烷烃脱氢成单烯烃中除去产物中的C 10 -C 16二烯烃，该方法包括使含有C 10 -C 16单烯烃和C 10 -C 16单烯烃的链烷烃和烯烃的混合物流 -C16二烯烃与在氢化反应条件下串联连接的多个氢化反应器中的特定氢化催化剂接触。将氢气分别注入每个反应器。为了将链烷烃和烯烃的混合物流中的二烯烃转化为单烯烃，比表面积为50-300m 2 / g，孔体积为0.2-2.0cm 3 / g的γ-氧化铝为作为氢化催化剂的载体，钯作为主要催化剂元素负载在载体上，并且选自银，金，锡，铅或钾的元素作为助催化剂负载在载体上。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式