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81. 发明申请

US20090166914A1 IMPRINT APPARATUS AND METHOD FOR FINE STRUCTURE LITHOGRAPHY 有权
标题翻译：用于精细结构光刻的印刷装置和方法
公开(公告)号：US20090166914A1
公开(公告)日：2009-07-02
申请号：US12343550
申请日：2008-12-24
申请人： Masahiko Ogino , Mitsuru Hasegawa , Akihiro Miyauchi
发明人： Masahiko Ogino , Mitsuru Hasegawa , Akihiro Miyauchi
IPC分类号： B29C59/04
CPC分类号： B29C59/04 , B29C35/16 , B29C2059/023 , B82Y10/00 , B82Y40/00 , G03F7/0002
摘要： An imprint apparatus for forming fine structure lithography comprises: a belt-like mold having a fine structure for imprint lithography formed on a surface of the belt-like mold; a cylindrical pressurizing mechanism including a pair of opposed rolls for pressurizing the belt-like mold against the surface of the imprinting object; and a supporting member for supporting the imprinting object at a position between the rolls of the cylindrical pressurizing mechanism. The belt-like mold, the imprinting object and the supporting member are configured to move to the cylindrical pressurizing mechanism in a mutually non-contact state, and then at the position between the rolls, be pressurized by the cylindrical pressurizing mechanism in a state where the imprinting object is positioned between the belt-like mold and the supporting member.
摘要翻译：用于形成精细结构光刻的压印装置包括：在带状模具的表面上形成具有用于压印光刻的精细结构的带状模具; 圆柱形加压机构，包括一对相对的辊，用于将带状模具压靠在压印对象的表面上; 以及用于将压印对象支撑在圆筒形加压机构的辊之间的位置处的支撑构件。带状模具，压印对象物和支撑构件被构造成在相互非接触状态下移动到圆柱形加压机构，然后在辊之间的位置被圆柱形加压机构加压，压印对象位于带状模具和支撑构件之间。

82. 发明申请

US20090087506A1 BELT-SHAPED MOLD AND NANOIMPRINT SYSTEM USING THE BELT-SHAPED MOLD 失效
标题翻译：带形模具和使用皮带模具的纳米薄膜系统
公开(公告)号：US20090087506A1
公开(公告)日：2009-04-02
申请号：US12191326
申请日：2008-08-14
申请人： Mitsuru Hasegawa , Masahiko Ogino
发明人： Mitsuru Hasegawa , Masahiko Ogino
IPC分类号： B29C33/36
CPC分类号： B29C59/04 , B29C2059/023 , B82Y10/00 , B82Y40/00 , G03F7/0002 , Y10S977/887
摘要： There is provided a fine pattern transfer, belt-shaped mold, with which a fine structure having a high aspect ratio can be formed rapidly and stably using nanoimprinting, and a fine pattern transfer system (a nanoimprint system) that employs this mold. According to the present invention, a nanoimprint mold includes: a belt-shaped support member; a plurality of stampers, for each of which a fine convex-and-concave pattern, to be transferred, is formed on one surface; and an adhesive member, to which the belt-shaped support member and the stampers are to be securely adhered, wherein the adhesive member includes a porous member and adhesive layers, which are deposited on either face of the porous member, for impregnating one part of the porous member, and wherein, for the porous member, a porous area that is not impregnated with the adhesive layers, is provided and positioned so as to sandwich the porous member between portions impregnated with the adhesive layers.
摘要翻译：提供了一种精细图案转印，带状模具，利用其可以使用纳米压印快速且稳定地形成具有高纵横比的精细结构，并且使用该模具的精细图案转印系统（纳米压印系统）。根据本发明，纳米压印模具包括：带状支撑构件; 在一个表面上形成多个刻印机，每个都要在其上形成要转印的细凹凸图案; 以及粘合构件，其中带状支撑构件和压模应牢固地粘附到该粘合构件上，其中粘合构件包括多孔构件和粘合剂层，其沉积在多孔构件的任一面上，用于浸渍一部分多孔构件，并且其中，对于多孔构件，设置并定位未浸渍有粘合剂层的多孔区域，以将多孔构件夹在浸渍有粘合剂层的部分之间。

83. 发明申请

US20080299247A1 Fine Pattern Mold and Method for Producing the Same 有权
标题翻译：精细图案模具及其制作方法
公开(公告)号：US20080299247A1
公开(公告)日：2008-12-04
申请号：US12129881
申请日：2008-05-30
申请人： Masahiko Ogino , Mitsuru Hasegawa , Kenya Ohashi , Akihiro Miyauchi , Hitoshi Suzuki , Toshio Haba , Haruo Akahoshi
发明人： Masahiko Ogino , Mitsuru Hasegawa , Kenya Ohashi , Akihiro Miyauchi , Hitoshi Suzuki , Toshio Haba , Haruo Akahoshi
IPC分类号： B29C33/42 , C25D1/10
CPC分类号： B29C33/3878 , B29C33/424 , C25D1/02 , C25D1/10 , Y10S425/81 , Y10T29/49549 , Y10T29/49552
摘要： There is provided a fine pattern mold capable of transferring a fine concave/convex pattern accurately without causing deformation of the fine concave/convex pattern itself.The fine patter mold comprises: a roll; a buffer tube whose inner peripheral surface is in contact with an outer peripheral surface of the roll; and a stamper tube in which its inner peripheral surface is in contact with an outer peripheral surface of the buffer tube and a fine concave/convex pattern is formed on its outer peripheral surface, wherein the buffer tube has a larger coefficient of linear expansion and a smaller elastic modulus than those of the stamper tube.
摘要翻译：提供了能够精确地转印精细凹凸图案的精细图案模具，而不会导致精细凹凸图案本身的变形。精细模具包括：卷; 缓冲管，其内周面与所述辊的外周面接触; 以及其内周面与缓冲管的外周面接触的压模管，在其外周面上形成微细的凹凸图案，其中缓冲管具有较大的线膨胀系数和比压模管的弹性模量小。

84. 发明授权

US07374417B2 Stamper and transfer apparatus 失效
标题翻译：压模和转印装置
公开(公告)号：US07374417B2
公开(公告)日：2008-05-20
申请号：US10802777
申请日：2004-03-18
申请人： Kosuke Kuwabara , Akihiro Miyauchi , Masahiko Ogino , Sigehisa Motowaki
发明人： Kosuke Kuwabara , Akihiro Miyauchi , Masahiko Ogino , Sigehisa Motowaki
IPC分类号： B29C43/10 , B32B3/00 , G11B7/26
CPC分类号： B82Y10/00 , B82Y40/00 , G03F7/0002 , G03F7/0017 , Y10S425/81
摘要： A stamper and a transfer apparatus that utilizes the stamper, which is capable of accurately transferring its own pattern onto an article, such as a substrate, without being affected by any distribution of convex portions on the stamper surface or any contour of the substrate. The stamper has a fine concave-convex pattern on a surface thereof for forming a fine structure on a substrate using a pressing machine. The stamper is flexible and includes a buffer formed on an opposite side to the side on which the concave-convex pattern is formed. The buffer has a longitudinal distribution of moduli of elasticity.
摘要翻译：一种压模和传送装置，其利用压模，其能够将其自身的图案精确地转印到诸如基板的物品上，而不受压模表面上的凸部的任何分布或基板的任何轮廓的任何分布的影响。压模在其表面上具有精细的凹凸图案，用于使用压制机在基板上形成精细结构。压模是柔性的，并且包括形成在其上形成有凹凸图案的一侧的相对侧上的缓冲器。缓冲液具有弹性模量的纵向分布。

85. 发明申请

US20080041248A1 IMPRINT APPARATUS AND IMPRINT METHOD 失效
标题翻译： IMPRINT设备和印刷方法
公开(公告)号：US20080041248A1
公开(公告)日：2008-02-21
申请号：US11774216
申请日：2007-07-06
申请人： KOSUKE KUWABARA , Takashi Ando , Masahiko Ogino , Hiroshi Yoshida , Yasuhiko Tada
发明人： KOSUKE KUWABARA , Takashi Ando , Masahiko Ogino , Hiroshi Yoshida , Yasuhiko Tada
IPC分类号： B41J9/00
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00 , G11B5/855 , H01L21/76817
摘要： The present invention provides an imprint apparatus transferring a surface structure of a stamper to material to be patterned by allowing the stamper come in contact with the material to be patterned. The imprint apparatus includes a holding means that holds the material to be patterned and the stamper with a distance therebetween, a pressure reduction means that reduces pressure of a chamber in which the material to be patterned and the stamper are placed, and an alignment means that aligns the stamper with the material to be patterned.
摘要翻译：本发明提供一种压印装置，通过允许压模与待图案化的材料接触，将压模的表面结构转移到待图案化的材料。压印装置包括保持装置，其保持要被图案化的材料和压模之间的距离;减压装置，其减小其中待图案化材料和压模放置的室的压力;以及对准装置，将压模与待图案化的材料对准。

86. 发明申请

US20070065757A1 Photo-curable resin composition and a method for forming a pattern using the same 有权
标题翻译：光固化树脂组合物和使用其形成图案的方法
公开(公告)号：US20070065757A1
公开(公告)日：2007-03-22
申请号：US11523559
申请日：2006-09-20
申请人： Masahiko Ogino , Ken Sawabe , Makoto Kaji , Hanako Yori
发明人： Masahiko Ogino , Ken Sawabe , Makoto Kaji , Hanako Yori
IPC分类号： G03C5/00
CPC分类号： G03F7/027 , B82Y10/00 , B82Y40/00 , G03F7/0002 , G03F7/0048
摘要： Provided is a new photo-curable resin composition which can be used in a photo nanoimprinting technology available for a photo nanoimprinting technology by which a substrate is processed with high accuracy. The photo-curable resin composition contains a photo-curable resin material essentially containing a (meth)acrylate, a reactive diluent, and a photo initiator. Preferably, the (meth)acrylate has a structure containing a benzene ring structure in its skeleton.
摘要翻译：提供了一种新的可光固化树脂组合物，其可用于可用于以高精度处理基底的光纳米压印技术的光纳米压印技术。光固化树脂组合物含有基本上含有（甲基）丙烯酸酯，反应性稀释剂和光引发剂的光固化树脂材料。优选地，（甲基）丙烯酸酯在其骨架中具有含有苯环结构的结构。

87. 发明授权

US07038325B2 Wiring tape for semiconductor device including a buffer layer having interconnected foams 失效
标题翻译：包括具有互连泡沫的缓冲层的半导体器件用布线
公开(公告)号：US07038325B2
公开(公告)日：2006-05-02
申请号：US10830051
申请日：2004-04-23
申请人： Masahiko Ogino , Shuji Eguchi , Akira Nagai , Takumi Ueno , Masanori Segawa , Hiroyoshi Kokaku , Toshiaki Ishii , Ichiro Anjoh , Asao Nishimura , Chuichi Miyazaki , Mamoru Mita , Norio Okabe
发明人： Masahiko Ogino , Shuji Eguchi , Akira Nagai , Takumi Ueno , Masanori Segawa , Hiroyoshi Kokaku , Toshiaki Ishii , Ichiro Anjoh , Asao Nishimura , Chuichi Miyazaki , Mamoru Mita , Norio Okabe
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/50 , H01L23/3107 , H01L23/49572 , H01L23/49816 , H01L24/32 , H01L2224/29111 , H01L2224/73215 , H01L2924/0001 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/10253 , H01L2924/15311 , H01L2924/1532 , H01L2924/30107 , H01L2924/351 , H01L2224/29099 , H01L2924/00
摘要： In a semiconductor device having a three-layered buffer layer comprising core layer 1 having interconnected foams such as a three-dimensional reticular structure and adhesive layers 2 provided on both sides of the core layer as a stress buffer layer between semiconductor chip 5 and wiring 4 to lessen a thermal stress generated between the semiconductor device and the package substrate, where a thickness ratio of the core layer 1 to total buffer layer is at least 0.2, the production process can be simplified by using such a buffer layer, thereby improving the mass production capacity and enhancing the package reliability.
摘要翻译：在具有三层缓冲层的半导体器件中，作为在半导体芯片5和布线4之间的应力缓冲层，芯层1具有三维网状结构的互连泡沫的芯层1和设置在芯层两侧的粘合层2 为了减小半导体器件与封装衬底之间产生的热应力，其中芯层1与总缓冲层的厚度比至少为0.2，可以通过使用这种缓冲层来简化制造工艺，从而提高质量生产能力和提高包装可靠性。

88. 发明申请

US20050212142A1 Semiconductor device and manufacturing metthod thereof 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：US20050212142A1
公开(公告)日：2005-09-29
申请号：US11116308
申请日：2005-04-28
申请人： Chuichi Miyazaki , Yukiharu Akiyama , Masnori Shibamoto , Tomoaki Kudaishi , Ichiro Anjoh , Kunihiko Nishi , Asao Nishimura , Hideki Tanaka , Ryosuke Kimoto , Kunihiro Tsubosaki , Akio Hasebe , Takehiro Ohnishi , Noriou Shimada , Shuji Eguchi , Hiroshi Koyama , Akira Nagai , Masahiko Ogino
发明人： Chuichi Miyazaki , Yukiharu Akiyama , Masnori Shibamoto , Tomoaki Kudaishi , Ichiro Anjoh , Kunihiko Nishi , Asao Nishimura , Hideki Tanaka , Ryosuke Kimoto , Kunihiro Tsubosaki , Akio Hasebe , Takehiro Ohnishi , Noriou Shimada , Shuji Eguchi , Hiroshi Koyama , Akira Nagai , Masahiko Ogino
IPC分类号： H01L23/31 , H01L23/495 , H01L23/498 , H01L23/48 , H01L21/44
CPC分类号： H01L24/50 , H01L23/3114 , H01L23/3128 , H01L23/49572 , H01L23/49816 , H01L23/49827 , H01L23/4985 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/86 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/06136 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/4824 , H01L2224/48465 , H01L2224/50 , H01L2224/85951 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00015 , H01L2224/05599
摘要： A semiconductor device includes a semiconductor chip formed with connection terminals, an elastic structure interposed between a main surface of the chip and a wiring substrate formed with wirings connected at first ends thereof to the connection terminals, and bump electrodes connected to the other ends of the wirings. The connection terminals may be at a center part or in peripheral part(s) of the chip main surface and both the elastic structure and wiring substrate are not provided at locations of connection terminals. A resin body seals at least the connection terminals and the exposed first ends of wirings (leads). In a scheme in which the connection terminals are located in a peripheral part of the chip main surface, the wiring substrate protrudes beyond the chip boundary where the connection terminals are arranged, and the resin body shape is restricted by the protruding part of the wiring substrate.
摘要翻译：半导体器件包括形成有连接端子的半导体芯片，插入在芯片的主表面之间的弹性结构和形成有连接到连接端子的布线的布线基板，以及连接到连接端子的另一端的凸起电极布线。连接端子可以在芯片主表面的中心部分或周边部分，并且弹性结构和布线基板都不设置在连接端子的位置处。树脂体至少密封连接端子和暴露的布线的第一端（引线）。在连接端子位于芯片主表面的周边部分的方案中，布线基板突出超过布置有连接端子的芯片边界，并且树脂体形状被布线基板的突出部分限制。

89. 发明授权

US06307269B1 Semiconductor device with chip size package 失效
标题翻译：具有芯片尺寸封装的半导体器件
公开(公告)号：US06307269B1
公开(公告)日：2001-10-23
申请号：US09113500
申请日：1998-07-10
申请人： Yukiharu Akiyama , Tomoaki Kudaishi , Takehiro Ohnishi , Noriou Shimada , Shuji Eguchi , Asao Nishimura , Ichiro Anjo , Kunihiro Tsubosaki , Chuichi Miyazaki , Hiroshi Koyama , Masanori Shibamoto , Akira Nagai , Masahiko Ogino
发明人： Yukiharu Akiyama , Tomoaki Kudaishi , Takehiro Ohnishi , Noriou Shimada , Shuji Eguchi , Asao Nishimura , Ichiro Anjo , Kunihiro Tsubosaki , Chuichi Miyazaki , Hiroshi Koyama , Masanori Shibamoto , Akira Nagai , Masahiko Ogino
IPC分类号： H01L2348
CPC分类号： H01L24/50 , H01L23/3114 , H01L23/49572 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/1433 , H01L2924/3025
摘要： A semiconductor device including a semiconductor chip having connection terminals in a peripheral part of a main surface thereof; an elastic body disposed on the main surface leaving the connection terminals exposed; an insulating tape formed on the elastic body and having openings in areas where the connection terminals are situated; plural leads formed on the top surface of the insulating tape, one end of each lead being connected to one of the connection terminals and the other end being disposed on the elastic body; plural bump electrodes formed on the other ends of the plural leads; and a resin body for sealing the connection terminals and one end of each of the leads, wherein the insulating tape protrudes beyond the chip where the plural connection terminals are arranged, and wherein the shape of the resin body is restricted by the protruding part of the insulating tape.
摘要翻译：一种半导体器件，包括在其主表面的周边部分中具有连接端子的半导体芯片; 设置在主表面上的弹性体，使连接端子露出; 绝缘带，形成在弹性体上并且在连接端子所在的区域中具有开口; 多个引线形成在绝缘带的顶表面上，每个引线的一端连接到一个连接端子，另一端设置在弹性体上; 形成在多个引线的另一端上的多个凸起电极; 以及用于密封连接端子和每个引线的一端的树脂体，其中绝缘带突出超过设置有多个连接端子的芯片，并且其中树脂体的形状受到绝缘胶带

90. 发明授权

US6114753A Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same 失效
标题翻译：具有粘合膜的电路带，半导体器件及其制造方法
公开(公告)号：US6114753A
公开(公告)日：2000-09-05
申请号：US857674
申请日：1997-05-16
申请人： Akira Nagai , Shuji Eguchi , Masahiko Ogino , Masanori Segawa , Toshiak Ishii , Nobutake Tsuyuno , Hiroyoshi Kokaku , Rie Hattori , Makoto Morishima , Ichiro Anjoh , Kunihiro Tsubosaki , Chuichi Miyazaki , Makoto Kitano , Mamoru Mita , Norio Okabe
发明人： Akira Nagai , Shuji Eguchi , Masahiko Ogino , Masanori Segawa , Toshiak Ishii , Nobutake Tsuyuno , Hiroyoshi Kokaku , Rie Hattori , Makoto Morishima , Ichiro Anjoh , Kunihiro Tsubosaki , Chuichi Miyazaki , Makoto Kitano , Mamoru Mita , Norio Okabe
IPC分类号： H01L21/60 , H01L23/12 , H01L23/31 , H01L23/495 , H01L23/485
CPC分类号： H01L24/06 , H01L23/3107 , H01L23/4951 , H01L2224/0401 , H01L2224/04042 , H01L2224/06136 , H01L2224/48091 , H01L2224/4824 , H01L24/48 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/30107 , H01L2924/351 , Y10T428/28 , Y10T428/2848
摘要： A semiconductor device having a superior connection reliability is obtained by providing a buffer body for absorbing the difference of thermal expansion between the mounting substrate and the semiconductor element in a semiconductor package structure, even if an organic material is used for the mounting substrate. A film material is used as the body for buffering the thermal stress generated by the difference in thermal expansion between the mounting substrate and the semiconductor element. The film material has modulus of elasticity of at least 1 MPa in the reflow temperature range (200-250.degree. C.).
摘要翻译：具有优异的连接可靠性的半导体器件通过在半导体封装结构中设置用于吸收安装基板和半导体元件之间的热膨胀差的缓冲体，即使将有机材料用于安装基板也是可以获得的。使用薄膜材料作为用于缓冲由安装基板和半导体元件之间的热膨胀差异产生的热应力的本体。膜材料的回流温度范围（200-250℃）的弹性模量至少为1MPa。

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