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    • 83. 发明申请
    • CONVERTER FOR ELECTRICAL POWER RECOVERY
    • 电力恢复转换器
    • US20090267415A1
    • 2009-10-29
    • US12095934
    • 2006-12-07
    • Kazuo SuekaneSatoshi Yamamoto
    • Kazuo SuekaneSatoshi Yamamoto
    • H02J3/00
    • H02J3/28Y10T307/25Y10T307/461Y10T307/469
    • This converter for electrical power recovery (1) for supplying power to a load (6) includes an in-house power generation device (5) for supplying power in cooperation with input terminal power at a power input terminal (2). Moreover, it includes a thermal storage unit (12) which, when surplus power is generated in a state in which a target value for input terminal power is set to zero, thermally stores this power. Furthermore, a control unit (9) is included which, when surplus power is generated, decides whether or not breakage of a wire of a CT (7) has occurred by raising the target value for the input terminal power from zero to a predetermined value, and by deciding whether or not the power input terminal current is somewhat elevated from zero.
    • 用于向负载(6)供电的用于电力回收(1)的转换器包括用于在电力输入端子(2)处与输入端子电力协同供电的内部发电装置(5)。 此外,它包括一个热存储单元(12),当在输入端子功率的目标值被设置为零的状态下产生剩余电力时,热存储该功率。 此外,包括控制单元(9),当产生剩余电力时,通过将输入端子功率的目标值从零增加到预定值来判定是否发生了CT(7)的导线断裂 ,并且通过确定电力输入端电流是否从零稍微升高。
    • 84. 发明申请
    • PRESSURE SENSOR MODULE AND ELECTRONIC COMPONENT
    • 压力传感器模块和电子元件
    • US20090266171A1
    • 2009-10-29
    • US12427954
    • 2009-04-22
    • Satoshi YamamotoHirokazu Hashimoto
    • Satoshi YamamotoHirokazu Hashimoto
    • G01L7/08G01L9/00
    • G01L9/0054G01L19/0069G01L19/148H01L2224/05001H01L2224/16225H01L2924/07811H01L2924/00
    • A pressure sensor module includes a pressure sensor, a bump, and a laminated substrate. The pressure sensor includes a semiconductor substrate; a cavity; a pressure-sensitive element; and a conductive section. The cavity is disposed inside the semiconductor substrate such that a thin-plate region of the semiconductor substrate is provided and the thin-plate region being defined as a diaphragm. The pressure-sensitive element is arranged at the diaphragm. The conductive section is electrically connected to the pressure-sensitive element and disposed on the face of the semiconductor substrate at a region excluding the diaphragm. The bump is electrically connected to the conductive section. The laminated substrate includes a wiring base material electrically connected to the pressure sensor via the bump. The wiring base material is disposed inside the laminated substrate. A face of the wiring base material is electrically connected to the bump and has an exposed area from the laminated substrate.
    • 压力传感器模块包括压力传感器,凸块和层压基板。 压力传感器包括半导体衬底; 一个空腔 压敏元件; 和导电部分。 空腔设置在半导体衬底的内部,使得设置半导体衬底的薄板区域,并且将薄板区域定义为膜片。 压敏元件设置在隔膜上。 导电部分电连接到压敏元件并且设置在除了隔膜之外的区域的半导体衬底的表面上。 凸块电连接到导电部分。 层压基板包括经由凸块与压力传感器电连接的布线基材。 配线基材配置在层叠基板的内部。 布线基材的表面电连接到凸块并具有来自层叠基板的露出区域。
    • 88. 发明授权
    • Pressure sensor package and electronic part
    • 压力传感器封装和电子部件
    • US07549344B2
    • 2009-06-23
    • US12175245
    • 2008-07-17
    • Satoshi YamamotoMikio HashimotoTakanao Suzuki
    • Satoshi YamamotoMikio HashimotoTakanao Suzuki
    • G01L9/00
    • G01L9/0042G01L9/0054G01L19/0069H01L2224/48091H01L2924/00014
    • A pressure sensor package of the present invention includes a pressure sensor including a cavity disposed within a semiconductor substrate, wherein a region of the substrate above the cavity comprises a diaphragm section; a plurality of pressure-sensitive elements, wherein at least of portion of each pressure-sensitive element is disposed on the diaphragm section; and a plurality of conductive portions laterally spaced from the cavity and electrically connected to the pressure sensitive elements, a plurality of electrically conductive bumps arranged on the conductive portions and electrically connected to the conductive portions, wherein a total thickness D1 of the semiconductor substrate, a thickness D2 of the diaphragm section, a thickness D3 of the cavity, and a thickness D4=D1−(D2+D3) satisfy the relationships: (D2+D3) in a range of approximately 5-20 μm, and D1 not less than about 100 μm.
    • 本发明的压力传感器封装包括压力传感器,该压力传感器包括设置在半导体衬底内的空腔,其中该腔体上方的区域包括隔膜部分; 多个压敏元件,其中每个压敏元件的至少一部分设置在隔膜部分上; 以及多个导电部分,其与所述腔体横向间隔开并电连接到所述压敏元件,多个导电凸块,其布置在所述导电部分上并电连接到所述导电部分,其中所述半导体衬底的总​​厚度D1, 隔膜部分的厚度D2,空腔的厚度D3和厚度D4 = D1-(D2 + D3)满足关系:(D2 + D3)在约5-20μm的范围内,D1不小于 约100麻
    • 90. 发明申请
    • Dna Amplification Method
    • Dna扩增方法
    • US20080102494A1
    • 2008-05-01
    • US11569686
    • 2005-05-30
    • Takeshi KoizumiSatoshi Yamamoto
    • Takeshi KoizumiSatoshi Yamamoto
    • C12P19/34
    • C12Q1/686C12Q2549/119
    • It is intended to provide a DNA amplification method whereby a single-stranded DNA in a desired direction and in a desired region can be conveniently and efficiently prepared. Namely, a DNA amplification method with the use of a DNA as a template which comprises: the first step wherein use is made of a first primer being complementary to the 3′-terminal side of a target base sequence, a second primer having a base sequence being homologous with the 5′-terminal side of the target base sequence, and a third primer having a base sequence in the 3′-terminal side being homologous with the second primer or a part of the 5′-terminal side base; sequence of the first primer, the melting temperature of the first primer Tm1, the melting temperature of the second primer Tm2 and the melting temperature of the third primer Tm3 have the relationships represented by the following formulae: (formulue) Tm1
    • 旨在提供DNA扩增方法,由此可以方便且有效地制备所需方向和期望区域中的单链DNA。 即,使用DNA作为模板的DNA扩增方法,其包括:第一步,其中使用与靶碱基序列的3'末端侧互补的第一引物,具有碱基的第二引物 序列与目标碱基序列的5'末端同源,3'-末端侧的碱基序列与第2引物或5'-端侧碱基的一部分同源的第3引物; 第一引物的序列,第一引物Tm 1的熔解温度,第二引物Tm 2的熔解温度和第三引物Tm 3 具有由以下式表示的关系:(formulue)Tm 1&lt; TM 3&gt;&gt;&lt; 2&gt;&lt; 并且在退火温度Ta(条件是Ta <= TM 1&gt;和Ta <2 TM 2)中进行PCR循环; 以及第二步骤,其中在退火温度Tb下进行PCR循环(条件是Tm1 )。