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    • 81. 发明授权
    • Method and apparatus for coupling to a source line in a memory device
    • 用于耦合到存储器件中的源极线的方法和装置
    • US07217964B1
    • 2007-05-15
    • US10658937
    • 2003-09-09
    • Richard M. FastowKuo-Tung Chang
    • Richard M. FastowKuo-Tung Chang
    • H01L27/10
    • H01L21/28273H01L27/115H01L27/11521H01L29/42324
    • A method and apparatus for coupling to a source line. Specifically, embodiments of the present invention disclose a memory device comprising an array of flash memory cells with a source line connection that facilitates straight word lines, and a method for producing the same. The array is comprised of a plurality of non-intersecting shallow trench isolation (STI) regions that isolate a plurality of memory cell columns. A source column implanted with n-type dopants is also isolated between an adjoining pair of STI regions. The source column is coupled to a plurality of common source lines that are coupled to a plurality of source regions in the array. A source contact is coupled to the source column for providing electrical coupling with the plurality of source regions. The source contact is located along a row of drain contacts that are coupled to drain regions of a row of memory cells.
    • 一种用于耦合到源极线的方法和装置。 具体地,本发明的实施例公开了一种包括具有促进直线字线的源极线连接的闪存单元阵列的存储器件及其制造方法。 阵列由隔离多个存储单元列的多个不相交的浅沟槽隔离(STI)区域组成。 植入n型掺杂剂的源极柱也在相邻的一对STI区域之间隔离。 源极列耦合到耦合到阵列中的多个源极区域的多个公共源极线。 源极触点耦合到源极列,以提供与多个源极区域的电耦合。 源极触点沿着一排漏极触点排列,这些漏极触点被耦合到一行存储器单元的漏极区域。
    • 82. 发明授权
    • Memory cell with reduced DIBL and Vss resistance
    • 具有降低的DIBL和Vss电阻的存储单元
    • US07170130B2
    • 2007-01-30
    • US10915771
    • 2004-08-11
    • Shenqing FangKuo-Tung ChangPavel FastenkoZhigang Wang
    • Shenqing FangKuo-Tung ChangPavel FastenkoZhigang Wang
    • H01L29/788
    • H01L29/66825
    • According to one exemplary embodiment, a method for fabricating a floating gate memory cell on substrate comprises a step of forming a spacer adjacent to a source sidewall of a stacked gate structure, where the stacked gate structure is situated over a channel region in substrate. The method further comprises forming a high energy implant doped region adjacent to the spacer in the source region of substrate. The method further comprises forming a recess in a source region of the substrate, where the recess has a sidewall, a bottom, and a depth, and where the sidewall of the recess is situated adjacent to a source of the floating gate memory cell. According to this exemplary embodiment, the spacer causes the source to have a reduced lateral straggle and diffusion in the channel region, which causes a reduction in drain induced barrier lowering (DIBL) in the floating gate memory cell.
    • 根据一个示例性实施例,用于在衬底上制造浮动栅极存储器单元的方法包括形成与层叠栅极结构的源极侧壁相邻的间隔物的步骤,其中堆叠的栅极结构位于衬底中的沟道区域之上。 该方法还包括在衬底的源区中形成与间隔物相邻的高能注入掺杂区。 该方法还包括在衬底的源极区域中形成凹部,其中凹部具有侧壁,底部和深度,并且凹部的侧壁位于与浮动栅极存储单元的源极相邻的位置。 根据该示例性实施例,间隔件导致源极在通道区域中具有减小的横向偏移和扩散,这导致浮动栅极存储单元中的漏极感应势垒降低(DIBL)的减小。
    • 85. 发明授权
    • Method of fabricating a floating gate
    • 制造浮栅的方法
    • US06919247B1
    • 2005-07-19
    • US10655936
    • 2003-09-04
    • Yider WuKuo-Tung Chang
    • Yider WuKuo-Tung Chang
    • H01L21/28H01L21/8247
    • H01L21/28273
    • A method of fabricating a floating gate for a semiconductor device is disclosed and provided. According to this method, an undoped polycrystalline silicon layer is deposited on a tunnel oxide layer. The undoped polycrystalline silicon layer has a first thickness. Moreover, a doped polycrystalline silicon layer is deposited on the undoped polycrystalline silicon layer. The doped polycrystalline silicon layer has a second thickness. The undoped polycrystalline silicon layer and the doped polycrystalline silicon layer form the floating gate having a third thickness. In an embodiment, the semiconductor device is a flash memory device.
    • 公开并提供了制造用于半导体器件的浮栅的方法。 根据该方法,在隧道氧化物层上沉积未掺杂的多晶硅层。 未掺杂的多晶硅层具有第一厚度。 此外,掺杂的多晶硅层沉积在未掺杂的多晶硅层上。 掺杂多晶硅层具有第二厚度。 未掺杂多晶硅层和掺杂多晶硅层形成具有第三厚度的浮动栅极。 在一个实施例中,半导体器件是闪存器件。
    • 90. 发明授权
    • Process for forming electrically programmable read-only memory cell with
a merged select/control gate
    • 用于形成具有合并的选择/控制门的电可编程只读存储器单元的处理
    • US5429969A
    • 1995-07-04
    • US251162
    • 1994-05-31
    • Kuo-Tung Chang
    • Kuo-Tung Chang
    • H01L21/8247H01L27/115H01L29/423
    • H01L27/11521H01L27/115H01L29/42324Y10S257/90
    • Flash EEPROM cells having merged select/control gates may be formed, so that the portions of the channel regions that correspond to select transistors are formed after spacers are formed but prior to patterning a merged select/control gate layer. Because the portions of the channel regions that correspond to the select transistors are not determined by the patterning of the merged select/control gate layer, misalignment of the mask used to pattern the merged select/control gate layer does not affect the size of the select transistor portion of the channel region. The spacers may be left on over the substrate in the finished devices thereby saving at least one processing step. The memory structure may also be used in other EPROM-type memory cells, such as individually erasable EEPROMs and EPROMs that are not electrically erasable.
    • 可以形成具有合并的选择/控制栅极的闪速EEPROM单元,使得对应于选择晶体管的沟道区域的部分在形成间隔物之后但在构图合并的选择/控制栅极层之前形成。 由于与选择晶体管相对应的沟道区域的部分不是通过合并选择/控制栅极层的构图来确定的,所以用于对合并的选择/控制栅极层进行图案化的掩模的未对准不会影响选择 晶体管部分。 间隔物可以留在成品装置中的衬底上,从而节省至少一个处理步骤。 存储器结构也可以用于其它EPROM型存储单元,例如不可电擦除的单独可擦除EEPROM和EPROM。