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81. 发明授权

US08269340B2 Curvilinear heat spreader/lid with improved heat dissipation 失效
标题翻译：曲线散热器/盖具有改善的散热
公开(公告)号：US08269340B2
公开(公告)日：2012-09-18
申请号：US11857812
申请日：2007-09-19
申请人： Michael A. Gaynes , Maurice McGlashan-Powell , Soojae Park , Edward Yarmchuk
发明人： Michael A. Gaynes , Maurice McGlashan-Powell , Soojae Park , Edward Yarmchuk
IPC分类号： H01L23/34 , H01L23/10
CPC分类号： H01L23/42 , H01L2224/05573 , H01L2224/16 , H01L2224/73253 , H01L2924/10253 , H01L2924/3511 , H01L2924/00
摘要： A heat spreader or lid for a microelectronic package, in which the heat spreader has an underside surface that includes at least one curvilinear contour, in which the curvilinear contour is selected from at least one positive or protruding curvilinear feature, at least one negative or recessed curvilinear feature, and a combination thereof. A microelectronic package that includes the heat spreader/lid, in which there is improved heat dissipation or reduced mechanical stress in an interface between the heat spreader/lid and a circuit chip.
摘要翻译：一种用于微电子封装的散热器或盖，其中散热器具有包括至少一个曲线轮廓的下表面，其中曲线轮廓选自至少一个正或突出的曲线特征，至少一个负或凹入曲线特征及其组合。包括散热器/盖的微电子封装，其中在散热器/盖和电路芯片之间的界面中改善了散热或降低了机械应力。

82. 发明申请

US20120063094A1 THERMAL INTERFACE MATERIAL APPLICATION FOR INTEGRATED CIRCUIT COOLING 有权
标题翻译：用于集成电路冷却的热接口材料应用
公开(公告)号：US20120063094A1
公开(公告)日：2012-03-15
申请号：US12882362
申请日：2010-09-15
申请人： Michael A. Gaynes , Dong G. Kam , Duixian Liu , Scott K. Reynolds
发明人： Michael A. Gaynes , Dong G. Kam , Duixian Liu , Scott K. Reynolds
IPC分类号： H05K7/20 , H05K3/20
CPC分类号： H05K3/30 , H01L2223/6677 , H01L2224/131 , H01L2224/16225 , H01L2224/73253 , H01L2924/15153 , H01L2924/15321 , H05K1/0206 , H05K1/141 , H05K1/183 , H05K3/0061 , H05K2201/10098 , H05K2201/10477 , Y10T29/49128 , Y10T29/49137 , H01L2924/014
摘要： Techniques provide improved thermal interface material application in an assembly associated with an integrated circuit package. For example, an apparatus comprises an integrated circuit module, a printed circuit board, and a heat transfer device. The integrated circuit module is mounted on a first surface of the printed circuit board. The printed circuit board has at least one thermal interface material application via formed therein in alignment with the integrated circuit module. The heat transfer device is mounted on a second surface of the printed circuit board and is thermally coupled to the integrated circuit module. The second surface of the printed circuit board is opposite to the first surface of the printed circuit board.
摘要翻译：技术在与集成电路封装相关联的组件中提供改进的热界面材料应用。例如，一种装置包括集成电路模块，印刷电路板和传热装置。集成电路模块安装在印刷电路板的第一表面上。印刷电路板具有与集成电路模块对准的至少一个热界面材料施加通孔。传热装置安装在印刷电路板的第二表面上，并且热耦合到集成电路模块。印刷电路板的第二表面与印刷电路板的第一表面相对。

83. 发明申请

US20120053874A1 USING IN SITU CAPACITANCE MEASUREMENTS TO MONITOR THE STABILITY OF INTERFACE MATERIALS IN COMPLEX PCB ASSEMBLIES AND OTHER STRUCTURES 失效
标题翻译：使用现场电容测量来监测接口材料在复合PCB组件和其他结构中的稳定性
公开(公告)号：US20120053874A1
公开(公告)日：2012-03-01
申请号：US13010854
申请日：2011-01-21
申请人： Timothy J. Chainer , Michael A. Gaynes , Edward J. Yarmchuk
发明人： Timothy J. Chainer , Michael A. Gaynes , Edward J. Yarmchuk
IPC分类号： G01N27/22 , G06F15/00 , H05K13/00 , G01R27/26
CPC分类号： G01N27/228 , H01L23/34 , H01L23/3733 , H01L23/42 , H01L2924/0002 , H05K3/30 , Y10T29/49002 , Y10T29/4913 , H01L2924/00
摘要： An electric potential is applied to first and second electrodes on opposite sides of a gap between an electronic component and a heat spreader. At least one of a thermal interface material in the gap, the electronic component and the heat spreader is subjected to a changing physical condition. The electrical capacitance between the electrodes is monitored during the changing physical condition. Such a method can be practiced using an array of components sharing a common heat spreader. An assembly for testing thermal interfaces includes a printed circuit board, a plurality of electronic components mounted to and operatively associated with the printed circuit board, a heat spreader positioned for absorbing heat generated by the electronic components, a first electrode associated with the heat spreader, a plurality of second electrodes associated, respectively, with the electronic component, and a device for monitoring electrical capacitances between the first and second electrodes. The technique may be employed for monitoring physical changes in electronic devices and other structures having interfaces between components.
摘要翻译：在电子部件和散热器之间的间隙的相对侧上的第一和第二电极上施加电位。间隙中的热界面材料，电子部件和散热器中的至少一个受到变化的物理条件的影响。在变化的物理条件期间监测电极之间的电容。可以使用共享共用散热器的部件阵列来实施这种方法。用于测试热界面的组件包括印刷电路板，安装到印刷电路板并且与印刷电路板可操作地相关联的多个电子部件，定位成用于吸收由电子部件产生的热量的散热器，与散热器相关联的第一电极，分别与电子部件相关联的多个第二电极和用于监测第一和第二电极之间的电容的装置。该技术可以用于监测电子设备中的物理变化以及具有组件之间的接口的其他结构。

84. 发明授权

US07645410B2 Thermoplastic adhesive preform for heat sink attachment 失效
标题翻译：用于散热器附件的热塑性粘合剂预制件
公开(公告)号：US07645410B2
公开(公告)日：2010-01-12
申请号：US10915374
申请日：2004-08-11
申请人： John G. Davis , Michael A. Gaynes , Joseph D. Poole
发明人： John G. Davis , Michael A. Gaynes , Joseph D. Poole
IPC分类号： B29C51/02
CPC分类号： H01L21/67132 , H01L23/36 , H01L23/3737 , H01L2924/0002 , Y10T428/24479 , H01L2924/00
摘要： Curved surfaces of a preform of thermoplastic adhesive provide improved regulation of heating and exclusion of gas as surfaces to be bonded are heated and pressed against the thermoplastic adhesive preform. Particulate or filamentary materials can be added to the thermoplastic adhesive for adjustment of coefficient of thermal expansion or further increase of heat transfer through the adhesive or both. The preform is preferably fabricated by molding, preferably in combination with die-cutting of a preform of desired volume from a web of approximately the same thickness as the completed bond.
摘要翻译：热塑性粘合剂预成型件的弯曲表面提供改进的气体加热和排除调节，因为待粘合的表面被加热并压靠在热塑性粘合剂预型件上。可以将微粒或丝状材料加入到热塑性粘合剂中以调节热膨胀系数或进一步增加通过粘合剂或两者的热传递。优选地通过模制来制造预成型件，优选地与从完全粘结的大致相同厚度的幅材对所需体积的预成型件进行模切而成型。

85. 发明申请

US20090072387A1 CURVILINEAR HEAT SPREADER/LID WITH IMPROVED HEAT DISSIPATION 失效
标题翻译： CURVILINEAR热传播器/带有改进的散热器
公开(公告)号：US20090072387A1
公开(公告)日：2009-03-19
申请号：US11857812
申请日：2007-09-19
申请人： Michael A. Gaynes , Maurice McGlashan-Powell , Soojae Park , Edward Yarmchuk
发明人： Michael A. Gaynes , Maurice McGlashan-Powell , Soojae Park , Edward Yarmchuk
IPC分类号： H01L23/34
CPC分类号： H01L23/42 , H01L2224/05573 , H01L2224/16 , H01L2224/73253 , H01L2924/10253 , H01L2924/3511 , H01L2924/00
摘要： A heat spreader or lid for a microelectronic package, in which the heat spreader has an underside surface that includes at least one curvilinear contour, in which the curvilinear contour is selected from at least one positive or protruding curvilinear feature, at least one negative or recessed curvilinear feature, and a combination thereof. A microelectronic package that includes the heat spreader/lid, in which there is improved heat dissipation or reduced mechanical stress in an interface between the heat spreader/lid and a circuit chip.
摘要翻译：一种用于微电子封装的散热器或盖，其中散热器具有包括至少一个曲线轮廓的下表面，其中曲线轮廓选自至少一个正或突出的曲线特征，至少一个负或凹入曲线特征及其组合。包括散热器/盖的微电子封装，其中在散热器/盖和电路芯片之间的界面中改善了散热或降低了机械应力。

86. 发明申请

US20080303021A1 Optimized Thermally Conductive Plate and Attachment Method for Enhanced Thermal Performance and Reliability of Flip Chip Organic Packages 有权
标题翻译：优化的导热板和附着方法，用于增强热性能和倒装芯片有机封装的可靠性
公开(公告)号：US20080303021A1
公开(公告)日：2008-12-11
申请号：US12116655
申请日：2008-05-07
申请人： Jeffrey T. Coffin , Michael A. Gaynes , David L. Questad , Kamal K. Sikka , Hilton T. Toy , Jamil A. Wakil
发明人： Jeffrey T. Coffin , Michael A. Gaynes , David L. Questad , Kamal K. Sikka , Hilton T. Toy , Jamil A. Wakil
IPC分类号： G01R31/28
CPC分类号： H01L23/34 , H01L23/3735 , H01L23/42 , H01L2224/73204 , H01L2224/73253 , H01L2924/3511 , Y10T29/49004 , Y10T29/49083 , Y10T29/49117 , Y10T29/49124 , Y10T29/4913 , Y10T29/49135 , Y10T29/4935
摘要： Disclosed are thermally conductive plates. Each plate is configured such that a uniform adhesive-filled gap may be achieved between the plate and a heat generating structure when the plate is bonded to the heat generating structure and subjected to a temperature within a predetermined temperature range that causes the heat generating structure to warp. Additionally, this disclosure presents the associated methods of forming the plates and of bonding the plates to a heat generating structure. In one embodiment the plate is curved and modeled to match the curved surface of a heat generating structure within the predetermined temperature range. In another embodiment the plate is a multi-layer conductive structure that is configured to undergo the same warpage under a thermal load as the heat generating structure. Thus, when the plate is bonded with the heat generating structure it is able to achieve and maintain a uniform adhesive-filled gap at any temperature.
摘要翻译：披露的是导热板。每个板被构造成使得当板结合到发热结构并经受使得发热结构的预定温度范围内的温度时，板和发热结构之间可以实现均匀的粘合剂填充的间隙经。另外，本公开提供了形成板并将板结合到发热结构的相关方法。在一个实施例中，板是弯曲的并被建模以使发热结构的弯曲表面在预定温度范围内匹配。在另一个实施例中，板是多层导电结构，其被配置为在与热产生结构相关的热负荷下经历相同的翘曲。因此，当板与发热结构接合时，能够在任何温度下实现和保持均匀的粘合剂填充间隙。

87. 发明授权

US07079393B2 Fluidic cooling systems and methods for electronic components 有权
标题翻译：流体冷却系统和电子部件的方法
公开(公告)号：US07079393B2
公开(公告)日：2006-07-18
申请号：US10904555
申请日：2004-11-16
申请人： Evan G. Colgan , Frank L. Pompeo , Glenn G. Daves , Hilton T. Toy , Bruce K. Furman , David L. Edwards , Michael A. Gaynes , Mukta G. Farooq , Sung K. Kang , Steven P. Ostrander , Jaimal M. Williamson , Da-Yuan Shih , Donald W. Henderson
发明人： Evan G. Colgan , Frank L. Pompeo , Glenn G. Daves , Hilton T. Toy , Bruce K. Furman , David L. Edwards , Michael A. Gaynes , Mukta G. Farooq , Sung K. Kang , Steven P. Ostrander , Jaimal M. Williamson , Da-Yuan Shih , Donald W. Henderson
IPC分类号： H05K7/20
CPC分类号： H01L23/4735 , H01L2224/16 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H01L2224/0401
摘要： A cooling system for an electronic component on a component carrier is provided. The system includes a frame, a spray manifold, and a sealing member. The frame has an opening and is connectable to the component carrier so that an annular area is defined between the opening and the electronic component. The spray manifold is sealed over the opening to define a spray area over a back surface of the electronic component. The spray manifold sprays a cooling fluid on the back surface. The sealing member seals the annular region so that input/output connectors on the component carrier are isolated from the cooling fluid.
摘要翻译：提供了一种用于组件载体上的电子部件的冷却系统。该系统包括框架，喷雾歧管和密封构件。框架具有开口并且可连接到部件载体，使得在开口和电子部件之间限定环形区域。喷雾歧管被密封在开口上以限定电子部件的后表面上方的喷射区域。喷雾歧管在后表面喷洒冷却液。密封构件密封环形区域，使得部件载体上的输入/输出连接器与冷却流体隔离。

88. 发明授权

US06981880B1 Non-oriented wire in elastomer electrical contact 失效
标题翻译：弹性体电接触无导线
公开(公告)号：US06981880B1
公开(公告)日：2006-01-03
申请号：US10873037
申请日：2004-06-22
申请人： William L. Brodsky , William E. Buchler, Jr. , Benson Chan , Michael A. Gaynes
发明人： William L. Brodsky , William E. Buchler, Jr. , Benson Chan , Michael A. Gaynes
IPC分类号： H01R9/09
CPC分类号： H01R13/2414 , H01R12/714 , H01R13/2407 , H05K7/1069
摘要： A method and apparatus for interconnecting an electronic module to a substrate through resilient wire conductors in an interposer arrangement. A carrier layer of insulating material with an array of apertures, arranged to align with both the electrical pads on an electronic module and electrical contacts on a substrate, each hold, for example, a resilient wadded wire connector. Each connector extends through the aperture provided and beyond the upper and lower surfaces of the carrier layer. Each resilient wadded wire connector and aperture is encapsulated with a elastomeric insulating material sufficiently deformable so as to allow said resilient wadded wire connector to deform upon application of a normal force from each side tending to depress the connector into its aperture. The encapsulation prevents loss or smear of a wadded wire connector when handling.
摘要翻译：一种用于通过插入件布置中的弹性导线将电子模块与衬底相互连接的方法和装置。具有孔阵列的绝缘材料的载体层，被布置成与电子模块上的电焊盘和基板上的电触点对准，每个保持例如弹性填充的电线连接器。每个连接器延伸穿过提供的并超出载体层的上表面和下表面的孔。每个弹性填充的电线连接器和孔被具有充分可变形的弹性体绝缘材料封装，从而允许所述弹性填充电线连接器在施加来自每个侧面的法向力时变形，以将连接器压入其孔。封装防止在处理时填充电线连接器的损坏或污迹。

89. 发明授权

US06949415B2 Module with adhesively attached heat sink 失效
标题翻译：模块带有粘附连接的散热器
公开(公告)号：US06949415B2
公开(公告)日：2005-09-27
申请号：US10787471
申请日：2004-02-26
申请人： David J. Alcoe , Thomas W. Dalrymple , Michael A. Gaynes , Randall J. Stutzman
发明人： David J. Alcoe , Thomas W. Dalrymple , Michael A. Gaynes , Randall J. Stutzman
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50 , H01L23/02 , H01L23/10 , H01L23/16 , H01L23/48
CPC分类号： H01L23/16 , H01L23/10 , H01L2224/16 , H01L2224/73253 , H01L2924/01012 , H01L2924/01019 , H01L2924/16195
摘要： A method and structure to adhesively couple a cover plate to a semiconductor device. A semiconductor device is electrically coupled to a substrate. A stiffener ring surrounding the semiconductor device is adhesively coupled to the substrate. A cover plate is adhesively coupled to both a top surface of the semiconductor device and a top surface of the stiffener ring using a first and second adhesive, respectively. The modulus of the first adhesive is less than the modulus of the second adhesive.
摘要翻译：一种用于将盖板粘合地耦合到半导体器件的方法和结构。半导体器件电耦合到衬底。围绕半导体器件的加强环粘合地耦合到衬底。分别使用第一和第二粘合剂将覆盖板粘合地耦合到半导体器件的顶表面和加强环的顶表面。第一粘合剂的模量小于第二粘合剂的模量。

90. 发明授权

US06893591B2 Thermoplastic adhesive preform for heat sink attachment 失效
公开(公告)号：US06893591B2
公开(公告)日：2005-05-17
申请号：US10191061
申请日：2002-07-10
申请人： John G. Davis , Michael A. Gaynes , Joseph D. Poole
发明人： John G. Davis , Michael A. Gaynes , Joseph D. Poole
IPC分类号： H01L21/00 , H01L23/36 , H01L23/373 , B28B7/14
CPC分类号： H01L21/67132 , H01L23/36 , H01L23/3737 , H01L2924/0002 , Y10T428/24479 , H01L2924/00
摘要： Curved surfaces of a preform of thermoplastic adhesive provide improved regulation of heating and exclusion of gas as surfaces to be bonded are heated and pressed against the thermoplastic adhesive preform. Particulate or filamentary materials can be added to the thermoplastic adhesive for adjustment of coefficient of thermal expansion or further increase of heat transfer through the adhesive or both. The preform is preferably fabricated by molding, preferably in combination with die-cutting of a preform of desired volume from a web of approximately the same thickness as the completed bond.

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