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1. 发明授权

US09268017B2 Near-field millimeter wave imaging 有权
公开(公告)号：US09268017B2
公开(公告)日：2016-02-23
申请号：US13545437
申请日：2012-07-10
申请人： Aydin Babakhani , Duixian Liu , Scott K. Reynolds , Mihai A. Sanduleanu
发明人： Aydin Babakhani , Duixian Liu , Scott K. Reynolds , Mihai A. Sanduleanu
IPC分类号： G01S13/89 , H01Q1/22 , H01Q7/00 , H01Q21/06
CPC分类号： G01S13/89 , H01Q1/2283 , H01Q7/00 , H01Q21/061
摘要： Systems and method for near-field millimeter wave imaging are provided, in particular, near-field millimeter wave imaging systems and methods that enable sub-wavelength resolution imaging by scanning objects with sub-wavelength probe elements and capturing and measuring phase and intensity of reflected energy to generate images.

2. 发明授权

US08558637B2 Circuit device with signal line transition element 有权
标题翻译：具有信号线过渡元件的电路装置
公开(公告)号：US08558637B2
公开(公告)日：2013-10-15
申请号：US12778130
申请日：2010-05-12
申请人： Duixian Liu , Ho-Chung Chen , Brian Allan Floyd
发明人： Duixian Liu , Ho-Chung Chen , Brian Allan Floyd
IPC分类号： H03H7/38
CPC分类号： H01P5/028 , H01L2223/6677 , H01L2224/16227 , H01L2224/73253 , H01L2924/15153 , H01L2924/15313 , H01L2924/15323
摘要： A circuit device includes a multilayer circuit carrier, a first signal transmission line, a second signal transmission line, a signal line transition element, a first impedance transformer, and a second impedance transformer. The multilayer circuit carrier includes a first layer and a second layer. The first signal transmission line is on the surface of the first layer. The second signal transmission line is on the surface of the second layer. The signal line transition element passes through the first layer and the second layer, and has a first signal terminal and a second signal terminal. The first impedance transformer is on the surface of the first layer and electrically connected between the first signal transmission line and the first signal terminal. The second impedance transformer is on the surface of the second layer and electrically connected between the second signal transmission line and the second signal terminal.
摘要翻译：电路装置包括多层电路载体，第一信号传输线，第二信号传输线，信号线过渡元件，第一阻抗变压器和第二阻抗变压器。多层电路载体包括第一层和第二层。第一信号传输线在第一层的表面上。第二信号传输线在第二层的表面上。信号线过渡元件通过第一层和第二层，并具有第一信号端和第二信号端。第一阻抗变换器位于第一层的表面上并电连接在第一信号传输线和第一信号端之间。第二阻抗变换器位于第二层的表面上并电连接在第二信号传输线和第二信号端之间。

3. 发明授权

US08294620B2 Integrated dual-band antenna for laptop applications 有权
标题翻译：用于笔记本电脑应用的集成双频天线
公开(公告)号：US08294620B2
公开(公告)日：2012-10-23
申请号：US10370976
申请日：2003-02-20
申请人： Ephraim B. Flint , Brian P. Gaucher , Duixian Liu
发明人： Ephraim B. Flint , Brian P. Gaucher , Duixian Liu
IPC分类号： H01Q1/24 , H01Q21/30
CPC分类号： H01Q1/2275 , H01Q1/22 , H01Q1/2266 , H01Q1/44 , H01Q5/378 , H01Q9/0421 , H01Q9/42
摘要： Dual-band antennas that are embedded within portable devices such as laptop computers. In one aspect, a dual-band antenna for a portable device (e.g., laptop computer) includes a first element having a resonant frequency in a first frequency band and a second element having a resonant frequency in a second frequency band, wherein the first element is connected to a signal feed, wherein the second element is grounded, and wherein the first and second elements are integrated within a portable device.
摘要翻译：嵌入便携式设备（如笔记本电脑）中的双频天线。一方面，用于便携式设备（例如，膝上型计算机）的双频天线包括在第一频带具有谐振频率的第一元件和在第二频带中具有谐振频率的第二元件，其中第一元件连接到信号馈送，其中第二元件接地，并且其中第一和第二元件被集成在便携式设备内。

4. 发明申请

US20120176281A1 Apparatus and Methods for Packaging Integrated Circuit Chips with Antennas Formed From Package Lead Wires 有权
标题翻译：用包装引线形成天线的集成电路芯片的装置和方法
公开(公告)号：US20120176281A1
公开(公告)日：2012-07-12
申请号：US13423772
申请日：2012-03-19
申请人： Brian P. Gaucher , Duixian Liu , Ullrich R. Pfeiffer , Thomas M. Zwick
发明人： Brian P. Gaucher , Duixian Liu , Ullrich R. Pfeiffer , Thomas M. Zwick
IPC分类号： H01Q1/24 , H05K13/00
CPC分类号： H01Q9/16 , H01L23/49555 , H01L23/66 , H01L24/48 , H01L24/49 , H01L2223/6677 , H01L2224/05554 , H01L2224/451 , H01L2224/45147 , H01L2224/48247 , H01L2224/49171 , H01L2924/00014 , H01L2924/01079 , H01L2924/10162 , H01L2924/14 , H01L2924/3011 , H01Q23/00 , Y10T29/49018 , H01L2924/00 , H01L2924/00015 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips with antennas having one or more radiating elements and tuning elements that are formed from package lead wires that are appropriated shaped and arranged to form antenna structures for millimeter wave applications.
摘要翻译：提供了用于将半导体IC（集成电路）芯片与具有一个或多个辐射元件和调谐元件整体封装的装置和方法，所述辐射元件和调谐元件由适于成形并布置成形成毫米波应用的天线结构的封装引线形成。

5. 发明申请

US20090256752A1 RADIO FREQUENCY (RF) INTEGRATED CIRCUIT (IC) PACKAGES WITH INTEGRATED APERTURE-COUPLED PATCH ANTENNA(S) IN RING AND/OR OFFSET CAVITIES 有权
标题翻译：无线电频率（RF）集成电路（IC）包装与环形和/或偏移CAVIENS中的集成光纤耦合天线
公开(公告)号：US20090256752A1
公开(公告)日：2009-10-15
申请号：US12102051
申请日：2008-04-14
申请人： Johannes A.G. Akkermans , Brian A. Floyd , Duixian Liu
发明人： Johannes A.G. Akkermans , Brian A. Floyd , Duixian Liu
IPC分类号： H01Q9/04 , H01P11/00
CPC分类号： H01Q21/065 , G06K19/07749 , G06K19/07786 , H01L23/3121 , H01L23/66 , H01L2223/6677 , H01L2224/16 , H01L2224/16227 , H01L2924/01079 , H01L2924/09701 , H01L2924/15153 , H01L2924/15323 , H01Q1/2283 , H01Q1/38 , H01Q9/0457 , H01Q21/061 , H01Q23/00 , Y10T29/49016
摘要： A radio-frequency integrated circuit chip package has N integrated aperture-coupled patch antennas, N being at least two, and includes N generally planar patches, and at least one generally planar ground plane spaced inwardly from the N generally planar patches and substantially parallel thereto. The ground plane is formed with at least N coupling aperture slots therein, and the slots are substantially opposed to the patches. N feed lines are spaced inwardly from the ground plane and substantially parallel thereto, and at least one radio frequency chip is spaced inwardly from the feed lines and coupled to the feed lines and the ground plane. A first substrate layer is spaced inwardly from the feed lines, and is formed with a chip-receiving cavity, with the chip located in the chip-receiving cavity. A second substrate layer is interposed in a region between the ground plane and a plane defined by the patch, the patch is formed in a first metal layer, the ground plane is formed in a second metal layer, and the second substrate layer defines an antenna cavity in which the N generally planar patches are located. “Island” and “offset” configurations, as well as fabrication methods, are also disclosed.
摘要翻译：射频集成电路芯片封装具有N个集成的孔耦合贴片天线，N为至少两个，并且包括N个通常为平面的贴片，以及至少一个大致平面的接地平面，与N个大致平坦的贴片间隔开并基本上与之平行。。接地平面在其中形成有至少N个耦合孔隙，并且槽基本上与贴片相对。 N个进料管线从接地平面向内隔开并基本上与其平行，并且至少一个射频芯片与进料管线向内间隔开并连接到进料管线和接地平面。第一衬底层从馈电线向内隔开，并且形成有芯片接收腔，芯片位于芯片接收腔中。第二基板层插入在接地平面和由贴片限定的平面之间的区域中，贴片形成在第一金属层中，接地平面形成在第二金属层中，第二基板层限定天线其中N个大体平面的贴片位于其中。还公开了“岛”和“偏移”结构以及制造方法。

6. 发明申请

US20090207080A1 Radio Frequency (RF) Integrated Circuit (IC) Packages with Integrated Aperture-Coupled Patch Antenna(s) 有权
标题翻译：具有集成光圈耦合贴片天线的射频（RF）集成电路（IC）封装
公开(公告)号：US20090207080A1
公开(公告)日：2009-08-20
申请号：US12034023
申请日：2008-02-20
申请人： Brian Floyd , Duixian Liu
发明人： Brian Floyd , Duixian Liu
IPC分类号： H01Q1/38
CPC分类号： H01Q23/00 , H01L23/66 , H01L2223/6677 , H01L2224/16225 , H01L2924/09701 , H01Q1/2283 , H01Q1/38 , H01Q9/0457
摘要： A radio-frequency integrated circuit chip package with at least one integrated aperture-coupled patch antenna includes at least one generally planar patch and at least one generally planar ground plane spaced inwardly from the generally planar patch and substantially parallel thereto. The ground plane is formed with at least one coupling aperture slot therein. The slot is substantially opposed to the patch. Also included are at least one feed line spaced inwardly from the ground plane and substantially parallel thereto, at least one radio frequency chip spaced inwardly from the feed line and coupled to the feed line and the ground plane, and a first substrate layer spaced inwardly from the feed line. The first substrate layer is formed with a chip-receiving cavity. The chip is located in the chip-receiving cavity.
摘要翻译：具有至少一个集成孔径耦合贴片天线的射频集成电路芯片封装包括至少一个基本上平面的贴片和至少一个大体上平面的接地平面，该接地平面与大致平坦的贴片间隔开并且与其基本平行。接地平面在其中形成有至少一个耦合孔隙。狭槽基本上与贴片相对。还包括至少一个从接地平面向内隔开并且基本上与其平行的馈电线，至少一个射频芯片，与馈电线路向内间隔开并耦合到馈电线路和接地平面，以及第一衬底层，喂料线。第一基板层形成有芯片接收腔。芯片位于芯片接收腔中。

7. 发明申请

US20090015496A1 PLANAR CIRCULARLY POLARIZED ANTENNAS 有权
标题翻译：平面圆极化天线
公开(公告)号：US20090015496A1
公开(公告)日：2009-01-15
申请号：US12031282
申请日：2008-02-14
申请人： Duixian Liu
发明人： Duixian Liu
IPC分类号： H01Q11/12
CPC分类号： H01Q21/065 , H01Q9/0457 , H01Q21/0006 , Y10T29/49016
摘要： A planar circularly polarized antenna comprises at least one coplanar waveguide feed line and a plurality of driven loops electrically connected to the feed line, wherein the driven loops and the feed line are substantially coplanar. At least one of the plurality of driven loops may be of a size different from at least another one of the plurality of driven loops and at least one of the plurality of driven loops may have a resonant frequency different from at least another one of the plurality of driven loops.
摘要翻译：平面圆极化天线包括至少一个共面波导馈线和电连接到馈电线的多个从动环路，其中驱动环路和馈电线基本共面。多个从动回路中的至少一个可以具有不同于多个从动回路中的至少另一个的大小的尺寸，并且多个从动回路中的至少一个可以具有与多个从动回路中的至少另一个驱动回路的共振频率不同的共振频率的驱动环路。

8. 发明申请

US20080272977A1 Apparatus and Methods for Constructing Antennas Using Vias as Radiating Elements Formed in a Substrate 有权
标题翻译：使用通孔作为辐射元件构成天线的装置和方法
公开(公告)号：US20080272977A1
公开(公告)日：2008-11-06
申请号：US12176975
申请日：2008-07-21
申请人： Brian Paul Gaucher , Duixian Liu , Ullrich Richard Rudolf Pfeiffer , Thomas Martin Zwick
发明人： Brian Paul Gaucher , Duixian Liu , Ullrich Richard Rudolf Pfeiffer , Thomas Martin Zwick
IPC分类号： H01Q1/38 , H01Q1/50
CPC分类号： H01Q9/0407 , H01L23/66 , H01L24/73 , H01L2223/6677 , H01L2224/48091 , H01L2224/73207 , H01L2924/12042 , H01L2924/14 , H01L2924/3011 , H01Q1/38 , H01Q1/48 , H01Q9/28 , H01Q9/40 , H01Q23/00 , Y10T29/49016 , Y10T29/49018 , H01L2924/00014 , H01L2924/00
摘要： Antennas are provided which are constructed using one or more conductive via stubs as radiating elements formed in a substrate. The antennas can be integrally packaged with IC chips (e.g., IC transceivers, receivers, transmitters, etc.) to build integrated wireless or RF (radio frequency) communications systems.
摘要翻译：提供天线，其使用一个或多个导电通路短截线作为形成在基板中的辐射元件构造。天线可以与IC芯片（例如，IC收发器，接收器，发射器等）整体封装，以构建集成的无线或RF（射频）通信系统。

9. 发明授权

US07372408B2 Apparatus and methods for packaging integrated circuit chips with antenna modules providing closed electromagnetic environment for integrated antennas 有权
标题翻译：用集成电路芯片封装集成天线的天线模块提供闭合电磁环境的装置和方法
公开(公告)号：US07372408B2
公开(公告)日：2008-05-13
申请号：US11332737
申请日：2006-01-13
申请人： Brian P. Gaucher , Janusz Grzyb , Duixian Liu , Ullrich R. Pfeiffer
发明人： Brian P. Gaucher , Janusz Grzyb , Duixian Liu , Ullrich R. Pfeiffer
IPC分类号： H01Q1/38
CPC分类号： H01Q1/38 , H01L2223/6677 , H01L2224/48091 , H01L2224/48227 , H01L2924/3025 , H01Q1/2283 , H01Q1/40 , H01Q7/00 , H01Q23/00 , H01L2924/00014
摘要： Apparatus and methods are provided for packaging IC chips together with integrated antenna modules designed to provide a closed EM (electromagnetic) environment for antenna radiators, thereby allowing antennas to be designed independent from the packaging technology.
摘要翻译：提供了用于将IC芯片与集成的天线模块一起封装的设备和方法，所述集成天线模块旨在为天线辐射器提供封闭的EM（电磁）环境，从而允许天线被独立于封装技术设计。

10. 发明授权

US07342299B2 Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications 有权
标题翻译：用于毫米波应用的具有集成电路芯片的天线封装的装置和方法
公开(公告)号：US07342299B2
公开(公告)日：2008-03-11
申请号：US11231919
申请日：2005-09-21
申请人： Brian P. Gaucher , Duixian Liu , Ullrich R. Pfeiffer , Thomas M. Zwick
发明人： Brian P. Gaucher , Duixian Liu , Ullrich R. Pfeiffer , Thomas M. Zwick
IPC分类号： H01L23/02
CPC分类号： H01L23/5227 , H01L23/4334 , H01L23/66 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2223/6677 , H01L2224/16145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49175 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/12041 , H01L2924/14 , H01L2924/1423 , H01L2924/181 , H01L2924/3011 , H01L2924/30111 , H01Q3/26 , H01Q9/16 , H01Q19/30 , H01Q23/00 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Apparatus and methods are provided for integrally packaging antennas with semiconductor IC (integrated circuit) chips to provide highly-integrated and high-performance radio/wireless communications systems for millimeter wave applications including, e.g., voice communication, data communication and radar applications. For example, wireless communication modules are constructed with IC chips having receiver/transmitter/transceiver integrated circuits and planar antennas that are integrally constructed from BEOL (back end of line) metallization structures of the IC chip.
摘要翻译：提供了用于将天线与半导体IC（集成电路）芯片整体封装在一起以提供用于毫米波应用的高集成度和高性能无线电/无线通信系统的装置和方法，包括例如语音通信，数据通信和雷达应用。例如，无线通信模块由具有接收器/发射器/收发器集成电路的IC芯片和由IC芯片的BEOL（后端）金属化结构一体构成的平面天线构成。

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