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    • 82. 发明授权
    • Light-emitting diode
    • 发光二极管
    • US08193548B2
    • 2012-06-05
    • US13284294
    • 2011-10-28
    • Hiroyuki TanakaNobuaki NagaoTakahiro HamadaEiji Fujii
    • Hiroyuki TanakaNobuaki NagaoTakahiro HamadaEiji Fujii
    • H01L33/00
    • H01L33/42H01L2933/0083H01L2933/0091
    • An light emitting diode includes an n-type nitride semiconductor layer, a multiple quantum well layer, a p-type nitride semiconductor layer, a window electrode layer, a p-side electrode, and an n-side electrode, which are stacked in this order. The n-side electrode is electrically connected to the n-type nitride semiconductor layer. The window electrode layer comprises an n-type single-crystalline ITO transparent film and an n-type single-crystalline ZnO transparent film. The p-type nitride semiconductor layer is in contact with the n-type single-crystalline ITO transparent film. The light-emitting diode further comprises a plurality of single-crystalline ZnO rods formed on the n-type single-crystalline ZnO transparent film. The respective lower portions of the single-crystalline ZnO rods have a shape of an inverted taper, which sharpens from the single-crystalline n-type ZnO transparent film toward the n-type nitride semiconductor layer.
    • 发光二极管包括堆叠在其中的n型氮化物半导体层,多量子阱层,p型氮化物半导体层,窗口电极层,p侧电极和n侧电极 订购。 n侧电极与n型氮化物半导体层电连接。 窗口电极层包括n型单晶ITO透明膜和n型单晶ZnO透明膜。 p型氮化物半导体层与n型单晶ITO透明膜接触。 发光二极管还包括形成在n型单晶ZnO透明膜上的多个单晶ZnO棒。 单晶ZnO棒的各自的下部具有从单晶n型ZnO透明膜朝向n型氮化物半导体层而锐化的倒锥形。
    • 83. 发明申请
    • PYROELECTRIC TEMPERATURE SENSOR AND A METHOD FOR MEASURING A TEMPERATURE WITH THE PYROELECTRIC TEMPERATURE SENSOR
    • 光伏温度传感器和用于测量温度传感器的方法
    • US20110299566A1
    • 2011-12-08
    • US13207940
    • 2011-08-11
    • Michihito UedaHiroyuki TanakaYukihiro KanekoEiji Fujii
    • Michihito UedaHiroyuki TanakaYukihiro KanekoEiji Fujii
    • G01K7/36
    • H01L37/02G01K7/36
    • A temperature sensor includes first and second lower electrodes, a ferroelectric layer having polarization, a semiconductor layer; and first to third upper electrodes. The second upper electrode is interposed between the first upper electrode and the third upper electrode in a plan view. The semiconductor layer includes a first channel disposed between the first upper electrode and the second upper electrode, and a second channel disposed between the second upper electrode and the third upper electrode. The ferroelectric layer includes a first ferroelectric part disposed below the first channel and a second ferroelectric part disposed below the second channel. A polarization direction of the first ferroelectric part is opposite to a polarization direction of the second first ferroelectric part. The temperature is calculated based on the output voltage from the second upper electrode and the voltage applied to the first upper electrode.
    • 温度传感器包括第一和第二下部电极,具有极化的铁电体层,半导体层; 和第一至第三上电极。 第二上电极在平面图中插入在第一上电极和第三上电极之间。 半导体层包括设置在第一上电极和第二上电极之间的第一通道和设置在第二上电极和第三上电极之间的第二通道。 铁电层包括设置在第一通道下方的第一铁电体部分和设置在第二通道下方的第二铁电体部分。 第一铁电体部的偏振方向与第二第一强电介质部的偏振方向相反。 基于来自第二上电极的输出电压和施加到第一上电极的电压来计算温度。
    • 90. 发明授权
    • Semiconductor device and method for fabricating the same
    • 半导体装置及其制造方法
    • US06174822B1
    • 2001-01-16
    • US09175250
    • 1998-10-20
    • Yoshihisa NaganoToshie KutsunaiYuji JudaiYasuhiro UemotoEiji Fujii
    • Yoshihisa NaganoToshie KutsunaiYuji JudaiYasuhiro UemotoEiji Fujii
    • H01L2131
    • H01L27/1085H01L21/76895H01L23/5223H01L28/55H01L2924/0002H01L2924/00
    • A semiconductor device includes: a capacitor provided on a supporting substrate having an integrated circuit thereon and including a lower electrode, a dielectric film, and an upper electrode; a first interlayer insulating film provided so as to cover the capacitor; a first interconnect selectively provided on the first interlayer insulating film and electrically connected to the integrated circuit and the capacitor through a first contact hole formed in the first interlayer insulating film; a second interlayer insulating film formed of ozone TEOS and provided so as to cover the first interconnect; a second interconnect selectively provided on the second interlayer insulating film and electrically connected to the first interconnect through a second contact hole formed in the second interlayer insulating film; and a passivation layer provided so as to cover the second interconnect.
    • 半导体器件包括:设置在其上具有集成电路的支撑衬底上并包括下电极,电介质膜和上电极的电容器; 设置为覆盖电容器的第一层间绝缘膜; 选择性地设置在所述第一层间绝缘膜上并通过形成在所述第一层间绝缘膜中的第一接触孔与所述集成电路和所述电容器电连接的第一互连; 由臭氧TEOS形成的第二层间绝缘膜,并设置为覆盖第一互连; 选择性地设置在第二层间绝缘膜上并通过形成在第二层间绝缘膜中的第二接触孔电连接到第一互连的第二互连; 以及设置成覆盖第二互连的钝化层。