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81. 发明授权

US06449312B1 Method of estimating motion in interlaced video 有权
标题翻译：交错视频中运动估计方法
公开(公告)号：US06449312B1
公开(公告)日：2002-09-10
申请号：US09589705
申请日：2000-06-08
申请人： Jian Zhang , Reji Mathew
发明人： Jian Zhang , Reji Mathew
IPC分类号： H04N712
CPC分类号： H04N5/145 , H04N19/105 , H04N19/112 , H04N19/137
摘要： A method of estimating motion in interlaced video involves, firstly, a frame search (61), where a search is conducted for the frame structure using a sub-sampled block matching metric (e.g. sub-sampled SAD). The locations to be searched are either fixed or dynamically determined based on the minimum frame SAD (ie best frame block match). Next, pixel errors are calculated (62) for all pixels included in the sub-sampled block matching metric. Each pixel error is first identified as belonging to one of four field patterns (e.g. even-even, even-odd, odd-even and odd-odd). For each location, pixel errors can be classified into two field patterns, either even-even and odd-odd or even-odd and odd-even (63). The pixel errors belonging to the same field pattern are added together (64) to obtain field error values (eg field SAD values). The individual field error (or field SAD) values are used to determine (77-80) the field Motion Vectors. The location of the lowest field SAD value is taken as the position of best match. All pixel errors are then summed together (65) to obtain the frame error and the location of the lowest frame error (or frame SAD) is taken as the position of best match for the frame. The frame and field Motion Vectors can be refined by using a full block matching metric within the small search window (66, 73-76).
摘要翻译：估计隔行视频中的运动的方法首先涉及帧搜索（61），其中使用子采样块匹配度量（例如，子采样SAD）对帧结构进行搜索。要搜索的位置是基于最小帧SAD（即最佳帧块匹配）来固定或动态确定的。接下来，对于包括在子采样块匹配度量中的所有像素，计算（62）像素误差。首先将每个像素误差识别为属于四个场模式之一（例如，偶数均匀，偶数奇数，奇偶校验和奇数奇数）。对于每个位置，像素误差可分为偶数和奇数奇偶奇数奇数两种场模式（63）。属于相同场模式的像素误差被加在一起（64）以获得场误差值（例如场SAD值）。单个字段错误（或字段SAD）值用于确定（77-80）字段运动矢量。最低字段SAD值的位置作为最佳匹配的位置。然后将所有像素误差相加在一起（65）以获得帧错误，并且将最低帧错误（或帧SAD）的位置作为帧的最佳匹配位置。可以通过在小搜索窗口（66,73-76）内使用完整的块匹配度量来改进帧和场运动矢量。

82. 发明授权

US5952454A Linking compounds useful for coupling carbohydrates to amine-containing carriers 有权
标题翻译：用于将碳水化合物偶联至含胺载体的连接化合物
公开(公告)号：US5952454A
公开(公告)日：1999-09-14
申请号：US183053
申请日：1998-10-30
申请人： Pavol Kovac , Jian Zhang
发明人： Pavol Kovac , Jian Zhang
IPC分类号： A61K39/385 , C07H15/12 , C08G69/26
CPC分类号： C07H15/12 , A61K39/385 , A61K2039/6081 , A61K2039/627
摘要： The present invention provides a method to couple a glycosyl donor to an amine-containing carrier or substrate material using as a spacer a compound of the general formula I: ##STR1## in which n and m are each independently an integer of from 1 to 12, R.sub.1 and R.sub.2 are each independently H, lower alkyl, a hydroxyl group, or a substituent which does not interfere with the linking reactions, R.sub.4 and R.sub.5 are each independently H, lower alkyl, a hydroxyl group, or a substituent which does not interfere with the linking reactions, R.sub.3 and R'.sub.3 are each independently an optionally substituted lower alkyl or R.sub.3 and R'.sub.3 can be joined to form an optionally substituted cyclic moiety having from 2 to 5 carbon atoms.
摘要翻译：本发明提供了使用通式I化合物作为间隔物将糖供体偶联到含胺载体或底物材料的方法：其中n和m各自独立地为1至12的整数，R 1和 R2各自独立地为H，低级烷基，羟基或不干扰连接反应的取代基，R4和R5各自独立地为H，低级烷基，羟基或不干扰连接的取代基反应，R 3和R'3各自独立地是任选取代的低级烷基或R 3，且R'3可以连接形成任选取代的具有2至5个碳原子的环状部分。

83. 外观设计

USD1047426S1 Mahjongg set bag 有权
公开(公告)号：USD1047426S1
公开(公告)日：2024-10-22
申请号：US29942196
申请日：2024-05-14
申请人： Jian Zhang
设计人： Jian Zhang
摘要： FIG. 1 is a front elevation view of a mahjongg set bag showing the new design;
FIG. 2 is a back elevation view thereof;
FIG. 3 is a left-side view thereof;
FIG. 4 is a right-side view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a perspective view thereof;
FIG. 8 is another perspective view thereof; and,
FIG. 9 is an enlarged view of the encircled portion in FIG. 7.
The broken lines depict portions of the mahjongg set bag that form no part of the claimed design.
The dash-dot lines in FIG. 7 and FIG. 9 illustrate the boundaries of the enlarged view indicators and form no part of the claimed design.

84. 外观设计

USD984612S1 Fan heater 有权
公开(公告)号：USD984612S1
公开(公告)日：2023-04-25
申请号：US29856827
申请日：2022-10-18
申请人： Jian Zhang
设计人： Jian Zhang

85. 发明授权

US11440117B2 Multiple module chip manufacturing arrangement 有权
公开(公告)号：US11440117B2
公开(公告)日：2022-09-13
申请号：US16602396
申请日：2019-09-27
申请人： Jian Zhang
发明人： Jian Zhang
IPC分类号： B23K3/00 , B23K3/047 , H01L23/00 , H01L21/68 , H01L21/687 , B23K3/06
摘要： A unitary wafer assembly arrangement for the application of solder balls onto a substrate for subsequent use in the electronics industry. This wafer tool assembly comprises a number of modules connected to one another and all serviced by a robotic arm to transfer processed wafers from one module to another. The tool assembly comprises a load port and pre-aligner module, a binder module, a solder ball mount module and a reflow module. A wafer inspection and repair module arrangement is also part of the tool assembly.

86. 发明申请

US20200043759A1 Hot wall flux free solder ball treatment arrangement 审中-公开
公开(公告)号：US20200043759A1
公开(公告)日：2020-02-06
申请号：US15998295
申请日：2018-08-01
申请人： Jian Zhang
发明人： Jian Zhang
IPC分类号： H01L21/67 , H01L21/687 , H01L21/677
摘要： A vertically oriented treatment chamber for the processing of a flux-free solder ball (or plated solder ball) loaded wafer chip. A treatment chamber comprises a first or upper heater at an upper end of the treatment chamber and a second or lower heater at a lower end of the treatment chamber. The treatment chamber includes a centrally disposed, preloaded flux free solder ball loaded wafer chip support ring movable upwardly and downwardly within the treatment chamber in response to temperature sensed monitoring of a wafer chip supported on the wafer chip support ring.

87. 发明申请

US20190243753A1 INTERMITTENT FAILURE METRICS IN TECHNOLOGICAL PROCESSES 审中-公开
公开(公告)号：US20190243753A1
公开(公告)日：2019-08-08
申请号：US16263363
申请日：2019-01-31
申请人： Jian Zhang , Minghao Lu , Xiaolu Ye , Ning He
发明人： Jian Zhang , Minghao Lu , Xiaolu Ye , Ning He
IPC分类号： G06F11/36 , G06F9/50 , G06F17/11
摘要： Systems and methods for testing a subject system with a software testing process are described. The system receives Boolean states responsive to repeatedly applying a first test case to a subject system. Each Boolean state signifies an outcome of an application of the first test case to a version of a first software feature over a span of time. The system identifies test case outcomes for the first test case that are adjacent in time and different and generates an intermittency value for the first test case. The system determines that the intermittency value for the first test case exceeds an intermittency threshold and alerts an engineering resource. Finally, the system repeats the above operations until the intermittency value for the first test case does not exceed the intermittency threshold.

88. 发明授权

US09629258B2 Reflow treating unit and substrate treating apparatus 有权
公开(公告)号：US09629258B2
公开(公告)日：2017-04-18
申请号：US14998387
申请日：2015-12-28
申请人： Jian Zhang
发明人： Jian Zhang
IPC分类号： B23K37/00 , H05K3/34 , B23K3/00 , B23K37/04 , B23K1/00 , B23K1/008 , H01L21/67 , B23K3/04 , B23K3/08 , B23K101/40
CPC分类号： H05K3/3494 , B23K1/0016 , B23K1/008 , B23K3/00 , B23K3/04 , B23K3/08 , B23K37/04 , B23K2101/40 , H01L21/6719
摘要： Provided are a semiconductor substrate manufacturing apparatus and a substrate treating method, and more particularly, an apparatus and method for performing a reflow treating process on a semiconductor wafer. The apparatus treating apparatus includes a load port on which a carrier accommodating a substrate is seated, a substrate treating module including one reflow treating unit or a plurality of reflow treating units for performing a reflow process on the substrate, and a substrate transfer module including a transfer robot transferring the substrate between the load port and the substrate treating module, the substrate transfer module being disposed between the load port and the substrate treating module. The reflow treating unit includes a process chamber having a treating space therein and an exhaust member exhausting a fluid within the process chamber. The exhaust member includes a plurality of individual exhaust lines connecting a plurality of process chambers to each other and a common exhaust line connected to the plurality of individual exhaust lines to exhaust the fluid to the outside of the substrate treating module.

89. 发明授权

US09596786B2 Closed circulating water cooling apparatus and method 有权
标题翻译：封闭循环水冷却装置及方法
公开(公告)号：US09596786B2
公开(公告)日：2017-03-14
申请号：US14361858
申请日：2012-05-29
申请人： Yigong Ding , Weizheng Yao , Jian Zhang , Weihua Ruan , Dawei Wang
发明人： Yigong Ding , Weizheng Yao , Jian Zhang , Weihua Ruan , Dawei Wang
IPC分类号： H05K7/20 , F25D3/02 , F25D17/02 , F25D31/00
CPC分类号： H05K7/20254 , F25B2400/24 , F25D3/02 , F25D16/00 , F25D17/02 , F25D31/002 , F28B1/06 , F28D9/00 , F28D15/00 , F28D20/021 , H01L23/473 , H01L2924/0002 , H05K7/20281 , H05K7/20927 , H05K7/20945 , H01L2924/00
摘要： A closed circulating water cooling apparatus and method. The cooling apparatus comprises: an internal cooling apparatus, a plate heat exchanger, an ice thermal-storage auxiliary cooling apparatus. The internal cooling apparatus comprises an air cooler. The ice thermal-storage auxiliary cooling apparatus comprises an ice thermal-storage apparatus.
摘要翻译：封闭式循环水冷却装置及方法。冷却装置包括：内部冷却装置，板式热交换器，冰蓄冷辅助冷却装置。内部冷却装置包括空气冷却器。冰蓄热辅助冷却装置包括冰蓄热装置。

90. 发明授权

US09572266B2 Reflow treating unit and substrate treating apparatus 有权
标题翻译：回流处理单元和基板处理装置
公开(公告)号：US09572266B2
公开(公告)日：2017-02-14
申请号：US14998386
申请日：2015-12-28
申请人： Jian Zhang
发明人： Jian Zhang
IPC分类号： B23K37/00 , H05K3/34 , B23K3/00 , B23K37/04 , B23K1/00 , B23K1/008 , H01L21/67 , B23K3/04 , B23K3/08
CPC分类号： H05K3/3494 , B23K1/0016 , B23K1/008 , B23K3/00 , B23K3/04 , B23K3/08 , B23K37/04 , B23K2101/40 , H01L21/6719
摘要： Provided are a semiconductor substrate manufacturing apparatus and a substrate treating method, and more particularly, an apparatus and method for performing a reflow treating process on a semiconductor wafer. The apparatus treating apparatus includes a load port on which a carrier accommodating a substrate is seated, a substrate treating module including one reflow treating unit or a plurality of reflow treating units for performing a reflow process on the substrate, and a substrate transfer module including a transfer robot transferring the substrate between the load port and the substrate treating module, the substrate transfer module being disposed between the load port and the substrate treating module. The reflow treating unit includes a process chamber having a treating space therein and an exhaust member exhausting a fluid within the process chamber. The exhaust member includes a plurality of individual exhaust lines connecting a plurality of process chambers to each other and a common exhaust line connected to the plurality of individual exhaust lines to exhaust the fluid to the outside of the substrate treating module.
摘要翻译：提供一种半导体衬底制造装置和衬底处理方法，更具体地，涉及一种在半导体晶片上进行回流处理工艺的装置和方法。该装置处理装置包括载置容纳基板的载体的载荷端口，具有一个回流处理单元的基板处理模块或用于在基板上进行回流处理的多个回流处理单元，以及基板传送模块，传送机器人在负载端口和衬底处理模块之间传送衬底，衬底传送模块设置在负载端口和衬底处理模块之间。回流处理单元包括其中具有处理空间的处理室和排出处理室内的流体的排气构件。排气构件包括将多个处理室彼此连接的多个单独的排气管线和连接到多个单独排气管线的共同排气管线，以将流体排出到基板处理模块的外部。

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