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1. 发明申请

US20190208671A1 POWER CONVERSION DEVICE 审中-公开
公开(公告)号：US20190208671A1
公开(公告)日：2019-07-04
申请号：US16304007
申请日：2016-06-01
申请人： Mitsubishi Electric Corporation
发明人： Hidetoshi KITANAKA , Hiroki KAWAMOTO
IPC分类号： H05K7/20 , H02M7/00 , H02M3/335 , H02M7/5387
CPC分类号： H05K7/20909 , H01L23/467 , H02M3/33569 , H02M7/003 , H02M7/04 , H02M7/48 , H02M7/53871 , H05K7/20154 , H05K7/20172 , H05K7/20209 , H05K7/20863 , H05K7/20918 , H05K7/20945
摘要： An inside of a housing of a power conversion device is partitioned by partitioning walls, and the power conversion device is configured from: an open part, into which external air flows; a first airtight part that is adjacent to the open part and into which no external air flows; and a second airtight part that is adjacent to the first airtight part and into which external air does not flow. At least two ventilation holes are formed in a partition wall between the first airtight part and the second airtight part. A circulation fan is provided to at least one of the at least two ventilation holes. The outer surface of the first airtight part is provided with a heatsink that dissipates heat transferred from an electronic component placed in the first airtight part, the heatsink being exposed to the open part.

2. 发明申请

US20190150315A1 TOPOLOGICAL INSULATOR THERMAL MANAGEMENT SYSTEMS 审中-公开
公开(公告)号：US20190150315A1
公开(公告)日：2019-05-16
申请号：US15836427
申请日：2017-12-08
申请人： The Boeing Company
发明人： Jeffrey H. HUNT , Wayne R. Howe , Angela W. Li
IPC分类号： H05K7/20 , H01B1/02 , C09K5/06
CPC分类号： H05K7/209 , C09K5/063 , H01B1/026 , H01L21/4871 , H01L23/373 , H01L23/3737 , H05K7/20945
摘要： An electrical device includes an electrical component configured to generate heat during operation of the electrical device. A thermal management coating is configured to transfer heat from the electrical component by thermal conduction. The thermal management coating comprises a non-carbon based topological insulator.

3. 发明申请

US20190067972A1 ELECTRONIC APPARATUS, METHOD OF CONTROLLING ELECTRONIC APPARATUS, POWER RECEPTION DEVICE, ELECTRIC DEVICE, AND SYSTEM 审中-公开
公开(公告)号：US20190067972A1
公开(公告)日：2019-02-28
申请号：US16117297
申请日：2018-08-30
申请人： Sony Corporation
发明人： Masakazu Yajima , Kiminobu Ichimura , Yuichi Ishida , Yutaka Sugiyama , Yoshio Muraoka
IPC分类号： H02J7/00 , H05K7/20 , H01M10/659 , H02J50/80 , H02J50/10 , F28D20/02 , H01L23/34 , H01L23/427 , H02J7/02 , H01M10/623 , H02J7/04 , H02J5/00 , H02J50/30 , H02J50/05 , H02J50/20 , H02J50/12
CPC分类号： H02J7/0072 , F28D20/028 , H01L23/34 , H01L23/4275 , H01L2924/0002 , H01M10/623 , H01M10/659 , H01M2220/30 , H02J5/005 , H02J7/0047 , H02J7/025 , H02J7/047 , H02J50/05 , H02J50/10 , H02J50/12 , H02J50/20 , H02J50/30 , H02J50/80 , H02J2007/005 , H05K7/209 , H05K7/20945 , Y02E60/145 , H01L2924/00
摘要： There is provided an electronic apparatus including: a heating section; a heat storage section; a detection section configured to detect a heat storage amount of the heat storage section; and a control section configured to control operation of the heating section, based on the heat storage amount detected by the detection section.

4. 发明申请

US20180116076A1 Fluidly Cooled Power Electronics Assemblies Having a Thermo-Electric Generator 审中-公开
公开(公告)号：US20180116076A1
公开(公告)日：2018-04-26
申请号：US15332537
申请日：2016-10-24
申请人： Toyota Motor Engineering & Manufacturing North America, Inc.
发明人： Ercan Mehmet Dede , Shailesh N. Joshi , Chi-Ming Wang
IPC分类号： H05K7/20 , H01L35/00
CPC分类号： H05K7/20945 , H01L35/00 , H05K7/20272 , H05K7/209 , H05K7/20927
摘要： A power electronics assembly that includes a first cooling chip fluidly coupled to a second cooling chip. The first cooling chip and the second cooling chip each include a cooling chip fluid inlet, a cooling chip fluid outlet, and one or more cooling chip fluid channels extending between and fluidly coupled to the cooling chip fluid inlet and the cooling chip fluid outlet. The power electronics assembly also includes a semiconductor device positioned between and thermally coupled to the first cooling chip and the second cooling chip and a thermo-electric generator positioned between and thermally coupled to the semiconductor device and one of the first cooling chip or the second cooling chip.

5. 发明申请

US20170347501A1 ENVIRONMENTAL CONTROL FOR MEDIUM-VOLTAGE DRIVE 审中-公开
公开(公告)号：US20170347501A1
公开(公告)日：2017-11-30
申请号：US15166366
申请日：2016-05-27
申请人： Toshiba International Corporation
发明人： Michael C. Daskalos , John D. Kleinecke
IPC分类号： H05K7/20 , G05B19/05
CPC分类号： H05K7/20945 , G05B19/05 , H05K7/20209 , H05K7/20909
摘要： In accordance with presently disclosed embodiments, a system and method for controlling the temperature of medium-voltage power electronics assemblies (i.e., medium-voltage drives) is provided. The disclosed system generally includes a medium-voltage drive having one or more cabinets with power electronics devices disposed therein, one or more fans for circulating air through the cabinet to cool the devices, and one or more space heaters disposed in the cabinet. The drive also features temperature sensors used to measure various temperatures of the drive, a controller communicatively coupled to the sensors, and one or more variable frequency drives (VFD) for the fans. The controller may receive measurements regarding the ambient and power device temperatures and apply controls to vary the space heater power and fan speed in response to environmental changes.

6. 发明授权

US09823140B2 Sensor abnormality determining apparatus 有权
公开(公告)号：US09823140B2
公开(公告)日：2017-11-21
申请号：US14906568
申请日：2014-07-31
申请人： Nissan Motor Co., Ltd.
发明人： Hatsuki Morinaga
IPC分类号： G01K17/00 , G01K15/00 , H05K7/20 , G01K17/08
CPC分类号： G01K15/007 , G01K17/08 , H05K7/20218 , H05K7/20927 , H05K7/20945
摘要： A sensor abnormality determining apparatus is applied to an inverter that includes: a power element; a cooling water circulation path for cooling the power element; a temperature sensor that detects a temperature of the power element; and a water temperature sensor that detects a temperature of the cooling water circulating in the cooling water circulation path. The sensor abnormality determining apparatus includes: an abnormality determining section and a determination temperature setting section. The abnormality determining section determines the temperature sensor is abnormal when a temperature difference between the detected power element temperature and the detected water temperature is larger than a prescribed determination temperature difference. The determination temperature setting section sets the prescribed determination temperature difference to a lower value when the detected power element temperature is lower than the detected water temperature as compared to when the detected power element temperature is higher than the detected water temperature.

7. 发明申请

US20170290198A1 IMMERSION COOLING SYSTEMS AND METHODS 审中-公开
公开(公告)号：US20170290198A1
公开(公告)日：2017-10-05
申请号：US15090236
申请日：2016-04-04
申请人： Hamilton Sundstrand Corporation
发明人： Charles Shepard , Kris H. Campbell
IPC分类号： H05K7/20
CPC分类号： H05K7/20236 , H01L23/44 , H05K7/20281 , H05K7/203 , H05K7/20381 , H05K7/20872 , H05K7/20881 , H05K7/20927 , H05K7/20936 , H05K7/20945
摘要： An immersion cooled electronic arrangement includes a sealed housing, a coolant contained within the housing, and an electronic device submerged within the coolant. An agitator is disposed within the housing to control passive heat transfer between the electronic device and the coolant. An immersion cooling system and related method are also described.

8. 发明授权

US09577547B2 Power conversion device 有权
标题翻译：电源转换装置
公开(公告)号：US09577547B2
公开(公告)日：2017-02-21
申请号：US15100711
申请日：2014-01-09
申请人： Mitsubishi Electric Corporation
发明人： Satoshi Taira
IPC分类号： H02M7/44 , H02M1/08 , H02P27/08 , H02H7/122 , H05K7/20 , H02M1/00
CPC分类号： H02M7/04 , H02H7/122 , H02M1/08 , H02M1/084 , H02M1/4208 , H02M1/4216 , H02M7/44 , H02M7/48 , H02M7/53875 , H02M2001/0009 , H02P27/08 , H05K7/20209 , H05K7/20909 , H05K7/20945 , Y02B70/126
摘要： A power conversion device converts three-phase AC power into DC power by two-arm PWM modulation control and includes a main circuit that is constituted by a plurality of switching elements that are bridge-connected therein; a voltage-command generation unit that generates a voltage command value for the main circuit; a current detection unit that detects at least one of output currents of the main circuit; a power-factor calculation unit that calculates a power factor on the basis of the output current and the voltage command value; a carrier-signal generation unit that generates a carrier signal of a frequency corresponding to the power factor; and a PWM-signal generation unit 6 that compares the voltage command value and the carrier signal to generate a PWM signal that executes switching control on the switching elements.
摘要翻译：电力转换装置通过双臂PWM调制控制将三相交流电转换为直流电力，并且包括由桥接在其中的多个开关元件构成的主电路; 电压指令生成部，生成上述主电路的电压指令值; 电流检测单元，其检测所述主电路的输出电流中的至少一个; 功率因数计算单元，其基于输出电流和电压指令值计算功率因数; 载波信号生成单元，生成与功率因数对应的频率的载波信号; 以及PWM信号生成部6，其对电压指令值和载波信号进行比较，生成对开关元件进行切换控制的PWM信号。

9. 发明授权

US09462707B2 Power distribution module form factor 有权
标题翻译：配电模块外形尺寸
公开(公告)号：US09462707B2
公开(公告)日：2016-10-04
申请号：US14231557
申请日：2014-03-31
申请人： Telect, Inc.
发明人： Randolph Stanton Wright , Larry O'Neal Reeder
IPC分类号： G06F1/16 , H05K5/00 , H05K7/00 , H05K7/20 , H04Q1/02 , H04Q1/04 , H05K7/14 , H05K13/00 , G06F1/18 , H02B1/26 , H05K7/18
CPC分类号： H05K5/0004 , G06F1/181 , G06F1/189 , H02B1/26 , H04Q1/03 , H04Q1/04 , H04Q1/155 , H05K7/1461 , H05K7/18 , H05K7/20945 , H05K13/00 , Y10T29/49002 , Y10T29/49117
摘要： A modular form factor power module system with monitoring and control functions is disclosed. The power module system is configured to power, monitor and/or control telecommunications equipment at the circuit level.
摘要翻译：公开了一种具有监控和控制功能的模块化外形功率模块系统。电源模块系统被配置为在电路级别对电信设备进行供电，监控和/或控制。

10. 发明申请

US20160249491A1 HEAT-DISSIPATING STRUCTURE FOR VSD, AND CONTROL METHOD AND DEVICE 有权
标题翻译：用于VSD的散热结构以及控制方法和装置
公开(公告)号：US20160249491A1
公开(公告)日：2016-08-25
申请号：US15025778
申请日：2014-09-29
申请人： SCHNEIDER TOSHIBA INVERTER EUROPE SAS
发明人： Yingqiang Wang , Haiyuan Yu
IPC分类号： H05K7/20
CPC分类号： H05K7/20909 , H05K7/20209 , H05K7/20918 , H05K7/20945
摘要： A heat-dissipating structure for a variable speed drive (VSD), a VSD device having the heat-dissipating structure, and a method for controlling the heat-dissipating structure. The heat-dissipating structure comprises: an electronic element array, having a first end and an opposite second end, electronic elements in the array producing heat during operation; a heat-dissipating fan, disposed at the first end of the array and used to conduct cooling air to flow between the first end and the second end to cool the electronic elements in the array; and a control apparatus, for controlling operation of the fan, the control apparatus controlling the fan so that the fan rotates at a first rotation direction within a first time period to conduct the cooling air to flow from the second end to the first end, and rotates at a second rotation direction contrary to the first rotation direction within a second time period to conduct the cooling air to flow from the first end to the second end.
摘要翻译：用于变速驱动器（VSD）的散热结构，具有散热结构的VSD装置和用于控制散热结构的方法。散热结构包括：电子元件阵列，其具有第一端和相对的第二端，所述阵列中的电子元件在操作期间产生热量; 散热风扇，设置在阵列的第一端，用于使冷却空气在第一端和第二端之间流动，以冷却阵列中的电子元件; 以及用于控制风扇的操作的控制装置，控制风扇的控制装置使得风扇在第一时间段内以第一旋转方向旋转，以使冷却空气从第二端流向第一端，并且在第二时间段内与第一旋转方向相反地在第二旋转方向旋转，以使冷却空气从第一端流到第二端。

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