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81. 发明授权

US08930013B2 Adaptively tracking spectrum features for endpoint detection 有权
标题翻译：自适应跟踪频谱特征进行端点检测
公开(公告)号：US08930013B2
公开(公告)日：2015-01-06
申请号：US13090954
申请日：2011-04-20
申请人： Jeffrey Drue David , Harry Q. Lee , Thian Choi Lim , Gary Ka Ho Lam
发明人： Jeffrey Drue David , Harry Q. Lee , Thian Choi Lim , Gary Ka Ho Lam
IPC分类号： G06F19/00 , B24B49/00 , G01B11/28 , B24B49/12 , B24B37/013
CPC分类号： B24B37/013 , B24B49/12
摘要： A method of controlling polishing includes polishing a substrate having a second layer overlying a first layer, detecting exposure of the first layer with an in-situ monitoring system, receiving an identification of a selected spectral feature and a characteristic of the selected spectral feature to monitor during polishing, measuring a sequence of spectra of light from the substrate while the substrate is being polished, determining a first value for the characteristic of the feature at the time that the first in-situ monitoring technique detects exposure of the first layer, adding an offset to the first value to generate a second value, and monitoring the characteristic of the feature and halting polishing when the characteristic of the feature is determined to reach the second value.
摘要翻译：控制抛光的方法包括抛光具有覆盖在第一层上的第二层的衬底，用原位监测系统检测第一层的曝光，接收所选择的光谱特征的标识和所选光谱特征的特征以监测在抛光期间，在衬底被抛光的同时测量来自衬底的光的光谱序列，确定在第一原位监测技术检测第一层的曝光时特征的特性的第一值，偏移到第一值以产生第二值，并且当特征的特征被确定为达到第二值时，监视特征的特性并停止抛光。

82. 发明授权

US08202738B2 Endpoint method using peak location of modified spectra 有权
标题翻译：端点方法使用修改光谱的峰位置
公开(公告)号：US08202738B2
公开(公告)日：2012-06-19
申请号：US13090934
申请日：2011-04-20
申请人： Jeffrey Drue David , Garrett Ho Yee Sin , Harry Q. Lee , Dominic J. Benvegnu
发明人： Jeffrey Drue David , Garrett Ho Yee Sin , Harry Q. Lee , Dominic J. Benvegnu
IPC分类号： H01L21/66
CPC分类号： B24B37/013 , H01L22/12 , H01L22/26
摘要： A method of optically monitoring a substrate during polishing includes receiving an identification of a selected spectral feature and a characteristic of the selected spectral feature to monitor during polishing, measuring a first spectrum from the substrate during polishing, the first spectrum measured within an initial time following initiation of polishing, measuring a sequence of second spectra from the substrate during polishing, the sequence of second spectra measured after the initial time, for each second spectrum in the sequence of second spectra, removing the first spectrum from the second spectrum to generate a sequence of modified third spectra, determining a value of a characteristic of the selected spectral feature for each third spectrum in the sequence of third spectra to generate a sequence of values for the characteristic, and determining a polishing endpoint or an adjustment for a polishing rate based on the sequence of values.
摘要翻译：在抛光期间光学监测基底的方法包括接收所选择的光谱特征的标识和所选择的光谱特征的特征以在抛光期间监测，在抛光期间测量来自基底的第一光谱，在初始时间之后测量的第一光谱开始抛光，在抛光期间测量来自衬底的第二光谱序列，在初始时间之后测量的第二光谱序列，对于第二光谱序列中的每个第二光谱，从第二光谱去除第一光谱以产生序列修改的第三光谱，确定第三光谱序列中的每个第三光谱的所选光谱特征的特征值，以产生该特征值的序列，并且基于以下步骤确定抛光终点或抛光速率的调整：值序列。

83. 发明申请

US20120034845A1 TECHNIQUES FOR MATCHING MEASURED SPECTRA TO REFERENCE SPECTRA FOR IN-SITU OPTICAL MONITORING 审中-公开
标题翻译：将测量光谱匹配到用于现场光学监测的参考光谱的技术
公开(公告)号：US20120034845A1
公开(公告)日：2012-02-09
申请号：US13198635
申请日：2011-08-04
申请人： Xiaoyuan Hu , Zhihong Wang , Harry Q. Lee , Zhize Zhu , Jeffrey Drue David , Dominic J. Benvegnu , Jimin Zhang , Wen-Chiang Tu
发明人： Xiaoyuan Hu , Zhihong Wang , Harry Q. Lee , Zhize Zhu , Jeffrey Drue David , Dominic J. Benvegnu , Jimin Zhang , Wen-Chiang Tu
IPC分类号： B24B49/00 , B24B51/00
CPC分类号： B24B37/013 , B24B37/042 , B24B37/107 , B24B37/205 , B24B49/045 , B24B49/12
摘要： A method of controlling polishing includes storing a library having a plurality of reference spectra, polishing a substrate, measuring a sequence of spectra of light from the substrate during polishing, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum using a matching technique other than sum of squared differences to generate a sequence of best matching reference spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of best matching reference spectra. Finding a best matching reference spectrum may include performing a cross-correlation of the measured spectrum with each of two or more of the plurality of reference spectra from the library and selecting a reference spectrum with the greatest correlation to the measured spectrum as a best matching reference spectrum.
摘要翻译：控制抛光的方法包括：存储具有多个参考光谱的库，抛光衬底，在抛光期间测量来自衬底的光的光谱序列，对于光谱序列的每个测量光谱，使用除了平方差的和以产生最佳匹配参考光谱的序列之外的匹配技术，以及基于最佳匹配参考光谱的序列来确定抛光终点或抛光速率的调整中的至少一个。找到最佳匹配的参考光谱可以包括执行所测量的光谱与来自文库的多个参考光谱中的两个或更多个的互相关，并且选择与所测量的光谱具有最大相关性的参考光谱作为最佳匹配参考光谱。

84. 发明申请

US20110318992A1 Adaptively Tracking Spectrum Features For Endpoint Detection 有权
标题翻译：自适应跟踪光谱特征进行端点检测
公开(公告)号：US20110318992A1
公开(公告)日：2011-12-29
申请号：US13090954
申请日：2011-04-20
申请人： Jeffrey Drue David , Harry Q. Lee , Thian Choi Lim , Gary Ka Ho Lam
发明人： Jeffrey Drue David , Harry Q. Lee , Thian Choi Lim , Gary Ka Ho Lam
IPC分类号： B24B49/04 , B24B49/12
CPC分类号： B24B37/013 , B24B49/12
摘要： A method of controlling polishing includes polishing a substrate having a second layer overlying a first layer, detecting exposure of the first layer with an in-situ monitoring system, receiving an identification of a selected spectral feature and a characteristic of the selected spectral feature to monitor during polishing, measuring a sequence of spectra of light from the substrate while the substrate is being polished, determining a first value for the characteristic of the feature at the time that the first in-situ monitoring technique detects exposure of the first layer, adding an offset to the first value to generate a second value, and monitoring the characteristic of the feature and halting polishing when the characteristic of the feature is determined to reach the second value.
摘要翻译：控制抛光的方法包括抛光具有覆盖在第一层上的第二层的衬底，用原位监测系统检测第一层的曝光，接收所选择的光谱特征的标识和所选光谱特征的特征以监测在抛光期间，在衬底被抛光的同时测量来自衬底的光的光谱序列，确定在第一原位监测技术检测第一层的曝光时特征的特性的第一值，偏移到第一值以产生第二值，并且当特征的特征被确定为达到第二值时，监视特征的特性并停止抛光。

85. 发明申请

US20110281501A1 FEEDBACK FOR POLISHING RATE CORRECTION IN CHEMICAL MECHANICAL POLISHING 有权
标题翻译：化学机械抛光抛光率校正反馈
公开(公告)号：US20110281501A1
公开(公告)日：2011-11-17
申请号：US12781644
申请日：2010-05-17
申请人： Jun Qian , Charles C. Garretson , Sivakumar Dhandapani , Jeffrey Drue David , Harry Q. Lee
发明人： Jun Qian , Charles C. Garretson , Sivakumar Dhandapani , Jeffrey Drue David , Harry Q. Lee
IPC分类号： B24B49/04 , B24B49/12
CPC分类号： B24B49/04 , B24B49/12
摘要： A substrate having a plurality of zones is polished and spectra are measured. For each zone, a first linear function fits a sequence of index values associated with reference spectra that best match the measured spectra. A projected time at which a reference zone will reach the target index value is determined based on the first linear function, and for at least one adjustable zone, a polishing parameter adjustment is calculated such that the adjustable zone has closer to the target index at the projected time than without such adjustment. The adjustment is calculated based on a feedback error calculated for a previous substrate. The feedback error for a subsequent substrate is calculated based on a second linear function that fits a sequence of index values associated with reference spectra that best match spectra measured after the polishing parameter is adjusted.
摘要翻译：研磨具有多个区域的基板并测量光谱。对于每个区域，第一个线性函数拟合与参考光谱相关联的索引值序列，该参考光谱与测量的光谱最匹配。基于第一线性函数确定参考区域将达到目标指标值的预计时间，并且对于至少一个可调整区域，计算抛光参数调整，使得可调节区域更接近目标索引处的目标索引预计时间比没有这样的调整。基于对先前基板计算的反馈误差来计算调整。基于适合与调整抛光参数之后测量的最佳匹配光谱的参考光谱相关联的索引值序列的第二线性函数来计算后续衬底的反馈误差。

86. 发明授权

US09233450B2 Optical detection of metal layer clearance 有权
标题翻译：光学检测金属层间隙
公开(公告)号：US09233450B2
公开(公告)日：2016-01-12
申请号：US13584565
申请日：2012-08-13
申请人： Jeffrey Drue David , Dominic J. Benvegnu
发明人： Jeffrey Drue David , Dominic J. Benvegnu
IPC分类号： B24B37/013 , B24B37/04 , B24B49/12
CPC分类号： B24B37/013 , B24B37/042 , B24B49/12
摘要： A method of controlling polishing includes polishing a metal layer of a substrate. The metal layer overlies an underlying layer structure. During polishing of the metal layer, a light beam is directed onto the first substrate. The metal layer is sufficiently thin that a portion of the light beam reflects from an exposed surface of the metal layer and a portion of the light beam passes through the metal layer and reflects from the underlying layer structure to generate a reflected light beam. The reflected light beam is monitored during polishing and a sequence of measured spectra is generated from the reflected light beam. At least one of a polishing endpoint or an adjustment for a polishing rate is determined from the sequence of measured spectra.
摘要翻译：控制抛光的方法包括抛光衬底的金属层。金属层覆盖下层结构。在抛光金属层期间，将光束引导到第一基板上。金属层足够薄，使得一部分光束从金属层的暴露表面反射，并且光束的一部分穿过金属层并从下面的层结构反射以产生反射光束。在抛光期间监测反射光束，并从反射光束产生测量光谱序列。从测量光谱的顺序确定抛光终点或抛光速率的调整中的至少一个。

87. 发明授权

US08944884B2 Fitting of optical model to measured spectrum 有权
标题翻译：光学模型拟合到测量光谱
公开(公告)号：US08944884B2
公开(公告)日：2015-02-03
申请号：US13773063
申请日：2013-02-21
申请人： Jeffrey Drue David , Dominic J. Benvegnu
发明人： Jeffrey Drue David , Dominic J. Benvegnu
IPC分类号： B24B1/00 , B24B37/013 , B24B49/12
CPC分类号： B24B37/013 , B24B49/12
摘要： A method of controlling a polishing operation includes polishing a first layer of a substrate, during polishing, obtaining a sequence over time of measured spectra with an in-situ optical monitoring system, for each measured spectrum from the sequence of measured spectra, fitting an optical model to the measured spectrum, the fitting including finding parameters that provide a minimum difference between an output spectrum of the optical model and the measured spectrum, the parameters including an endpoint parameter and at least one non-endpoint parameter, the fitting generating a sequence of fitted endpoint parameter values, each endpoint parameter value of the sequence associated with one of the spectra of the sequence of measured spectra, and determining at least one of a polishing endpoint or an adjustment of a pressure to the substrate from the sequence of fitted endpoint parameter values.
摘要翻译：控制抛光操作的方法包括在抛光期间抛光衬底的第一层，利用原位光学监测系统根据测量光谱序列为每个测量光谱获得测量光谱的时间序列，所述拟合包括找到在所述光学模型的输出光谱与所述测量光谱之间提供最小差异的参数，所述参数包括端点参数和至少一个非端点参数，所述拟合生成序列拟合的端点参数值，与测量光谱序列的光谱之一相关联的序列的每个端点参数值，以及根据拟合的端点参数序列确定抛光终点或对衬底的压力的调整中的至少一个价值观。

88. 发明授权

US08747189B2 Method of controlling polishing 有权
标题翻译：控制抛光的方法
公开(公告)号：US08747189B2
公开(公告)日：2014-06-10
申请号：US13094677
申请日：2011-04-26
申请人： Jeffrey Drue David
发明人： Jeffrey Drue David
IPC分类号： B24B1/00 , B24B7/19 , B24B7/30 , C23F1/00 , H01L21/306
CPC分类号： B24B37/013 , B24B37/005 , B24B37/042 , B24B37/105 , B24B49/04 , B24B49/12 , G01B11/0683 , G01J3/28 , G01N21/55 , G01N21/9501 , G01N2021/8416 , G01N2021/8438 , G05B15/02 , H01L21/304 , H01L21/3212
摘要： A method of controlling polishing includes polishing a substrate of a non-metallic layer undergoing polishing and a metal layer underlying the non-metallic layer; storing a metal reference spectrum, the metal reference spectrum being a spectrum of light reflected from a same metal material as the metal layer; measuring a sequence of raw spectra of light reflected from the substrate during polishing with an in-situ optical monitoring system; normalizing each raw spectrum in the sequence of spectra to generate a sequence of normalized spectra, of which normalizing includes a division operation where the measured spectrum is in the numerator and the metal reference spectrum is in the denominator; and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on at least one normalized predetermined spectrum from the sequence of normalized spectra.
摘要翻译：控制抛光的方法包括抛光经历抛光的非金属层的基底和非金属层下面的金属层; 存储金属参考光谱，所述金属参考光谱是从与所述金属层相同的金属材料反射的光谱; 用原位光学监测系统测量在抛光过程中从衬底反射的光的原始光谱序列; 对光谱序列中的每个原始光谱进行归一化以产生归一化光谱序列，其归一化包括除法运算，其中所测量的光谱在分子中，金属参考光谱在分母中; 以及基于来自归一化光谱序列的至少一个归一化的预定光谱来确定抛光终点或抛光速率的调整中的至少一个。

89. 发明申请

US20130052916A1 Optical Detection of Metal Layer Clearance 有权
标题翻译：金属层清除光学检测
公开(公告)号：US20130052916A1
公开(公告)日：2013-02-28
申请号：US13584565
申请日：2012-08-13
申请人： Jeffrey Drue David , Dominic J. Benvegnu
发明人： Jeffrey Drue David , Dominic J. Benvegnu
IPC分类号： B24B49/12
CPC分类号： B24B37/013 , B24B37/042 , B24B49/12
摘要： A method of controlling polishing includes polishing a metal layer of a substrate. The metal layer overlies an underlying layer structure. During polishing of the metal layer, a light beam is directed onto the first substrate. The metal layer is sufficiently thin that a portion of the light beam reflects from an exposed surface of the metal layer and a portion of the light beam passes through the metal layer and reflects from the underlying layer structure to generate a reflected light beam. The reflected light beam is monitored during polishing and a sequence of measured spectra is generated from the reflected light beam. At least one of a polishing endpoint or an adjustment for a polishing rate is determined from the sequence of measured spectra.
摘要翻译：控制抛光的方法包括抛光衬底的金属层。金属层覆盖下层结构。在抛光金属层期间，将光束引导到第一基板上。金属层足够薄，使得一部分光束从金属层的暴露表面反射，并且光束的一部分穿过金属层并从下面的层结构反射以产生反射光束。在抛光期间监测反射光束，并从反射光束产生测量光谱序列。从测量光谱的顺序确定抛光终点或抛光速率的调整中的至少一个。

90. 发明授权

US07163437B1 System with sealed polishing pad 失效
标题翻译：系统带密封抛光垫
公开(公告)号：US07163437B1
公开(公告)日：2007-01-16
申请号：US11400079
申请日：2006-04-05
申请人： Bogdan Swedek , David J. Lischka , Jeffrey Drue David , Dominic J. Benvegnu
发明人： Bogdan Swedek , David J. Lischka , Jeffrey Drue David , Dominic J. Benvegnu
IPC分类号： B24B7/22
CPC分类号： B24B37/205 , B24D18/00
摘要： A polishing pad, polishing system, method of making a polishing pad and method of using a polishing pad. The polishing pad includes a polishing layer having a polishing surface, a backing layer with an aperture and a first portion that is permeable to liquid, and a sealant that penetrates a second portion of the backing layer adjacent to and surrounding the aperture such that the second portion is substantially impermeable to liquid. The aperture is positioned below a substantially fluid-impermeable element.
摘要翻译：抛光垫，抛光系统，制造抛光垫的方法和抛光垫的使用方法。抛光垫包括具有抛光表面的抛光层，具有孔的背衬层和可渗透液体的第一部分，以及密封剂，该密封剂穿透邻近并包围孔的背衬层的第二部分，使得第二部分对液体基本上是不可渗透的。孔被定位在基本上不透液体的元件之下。

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