会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 5. 发明授权
    • Spectrum based endpointing for chemical mechanical polishing
    • 基于光谱的化学机械抛光终点
    • US07764377B2
    • 2010-07-27
    • US11213344
    • 2005-08-26
    • Dominic J. BenvegnuJeffrey Drue DavidBogdan Swedek
    • Dominic J. BenvegnuJeffrey Drue DavidBogdan Swedek
    • G01B11/00
    • H01L22/26B24B37/013B24B37/205B24B49/08B24B49/12B24D7/14H01L21/30625H01L21/31053H01L21/31055H01L21/3212H01L21/67075H01L21/67092H01L21/67253
    • Methods and apparatus for spectrum-based endpointing. An endpointing method includes selecting a reference spectrum. The reference spectrum is a spectrum of white light reflected from a film of interest on a first substrate and has a thickness greater than a target thickness. The reference spectrum is empirically selected for particular spectrum-based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectrum-based endpoint logic. The method includes obtaining a current spectrum. The current spectrum is a spectrum of white light reflected from a film of interest on a second substrate when the film of interest is being subjected to a polishing step and has a current thickness that is greater than the target thickness. The method includes determining, for the second substrate, when an endpoint of the polishing step has been achieved. The determining is based on the reference and current spectra.
    • 用于基于频谱的终点的方法和装置。 终点方法包括选择参考频谱。 参考光谱是在第一衬底上从感兴趣的膜反射的白光的光谱,并且具有大于目标厚度的厚度。 对于特定的基于频谱的端点确定逻辑,经验地选择参考频谱,使得当通过应用特定的基于频谱的端点逻辑来调用端点时实现目标厚度。 该方法包括获得当前频谱。 目前的光谱是当感兴趣的薄膜经受抛光步骤并且具有大于目标厚度的电流厚度时,在第二基板上从感兴趣的薄膜反射的白光的光谱。 该方法包括为第二基底确定何时已经实现了抛光步骤的终点。 该确定基于参考和当前光谱。