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    • 5. 发明申请
    • Gathering Spectra From Multiple Optical Heads
    • 从多个光头收集光谱
    • US20120196511A1
    • 2012-08-02
    • US13016504
    • 2011-01-28
    • Jeffrey Drue DavidBoguslaw A. SwedekDominic J. BenvegnuSivakumar Dhandapani
    • Jeffrey Drue DavidBoguslaw A. SwedekDominic J. BenvegnuSivakumar Dhandapani
    • B24B49/00
    • B24B49/12B24B37/013B24B37/105
    • A polishing apparatus includes a platen to hold a polishing pad having a plurality of optical apertures, a carrier head to hold a substrate against the polishing pad, a motor to generate relative motion between the carrier head and the platen, and an optical monitoring system. The optical monitoring system includes at least one light source, a common detector, and an optical assembly configured to direct light from the at least one light source to each of a plurality of separated positions in the platen, to direct light from each position of the plurality of separated positions to the substrate as the substrate passes over said each position, to receive reflected light from the substrate as the substrate passes over said each position, and to direct the reflected light from each of the plurality of separated positions to the common detector.
    • 抛光装置包括用于保持具有多个光学孔的抛光垫的压板,用于将衬底保持在抛光垫上的载体头,用于在承载头和压板之间产生相对运动的电动机以及光学监控系统。 所述光学监视系统包括至少一个光源,公共检测器和配置成将来自所述至少一个光源的光引导到所述压板中的多个分离位置中的每一个的光学组件,以引导来自所述至少一个光源的每个位置的光 当衬底越过所述每个位置时,多个分离的位置到衬底,以在衬底经过所述每个位置时接收来自衬底的反射光,并将来自多个分离位置中的每一个的反射光引导到公共检测器 。
    • 6. 发明申请
    • BUILDING A LIBRARY OF SPECTRA FOR OPTICAL MONITORING
    • 建立光学监测光谱图书馆
    • US20120096006A1
    • 2012-04-19
    • US13270137
    • 2011-10-10
    • Jeffrey Drue DavidDominic J. BenvegnuXiaoyuan Hu
    • Jeffrey Drue DavidDominic J. BenvegnuXiaoyuan Hu
    • G06F17/30H01L21/306
    • H01L22/26B24B37/013B24B49/12H01L21/3212H01L22/12
    • A method of controlling polishing includes storing a library having a plurality of reference spectra, polishing a substrate, measuring a sequence of spectra of light from the substrate during polishing, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum using a matching technique other than sum of squared differences to generate a sequence of best matching reference spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of best matching reference spectra. Finding a best matching reference spectrum may include performing a cross-correlation of the measured spectrum with each of two or more of the plurality of reference spectra from the library and selecting a reference spectrum with the greatest correlation to the measured spectrum as a best matching reference spectrum.
    • 控制抛光的方法包括:存储具有多个参考光谱的库,抛光衬底,在抛光期间测量来自衬底的光的光谱序列,对于光谱序列的每个测量光谱,使用 除了平方差的和以产生最佳匹配参考光谱的序列之外的匹配技术,以及基于最佳匹配参考光谱的序列来确定抛光终点或抛光速率的调整中的至少一个。 找到最佳匹配的参考光谱可以包括执行所测量的光谱与来自文库的多个参考光谱中的两个或更多个的互相关,并且选择与所测量的光谱具有最大相关性的参考光谱作为最佳匹配参考 光谱。
    • 10. 发明授权
    • Spectrum based endpointing for chemical mechanical polishing
    • 基于光谱的化学机械抛光终点
    • US07764377B2
    • 2010-07-27
    • US11213344
    • 2005-08-26
    • Dominic J. BenvegnuJeffrey Drue DavidBogdan Swedek
    • Dominic J. BenvegnuJeffrey Drue DavidBogdan Swedek
    • G01B11/00
    • H01L22/26B24B37/013B24B37/205B24B49/08B24B49/12B24D7/14H01L21/30625H01L21/31053H01L21/31055H01L21/3212H01L21/67075H01L21/67092H01L21/67253
    • Methods and apparatus for spectrum-based endpointing. An endpointing method includes selecting a reference spectrum. The reference spectrum is a spectrum of white light reflected from a film of interest on a first substrate and has a thickness greater than a target thickness. The reference spectrum is empirically selected for particular spectrum-based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectrum-based endpoint logic. The method includes obtaining a current spectrum. The current spectrum is a spectrum of white light reflected from a film of interest on a second substrate when the film of interest is being subjected to a polishing step and has a current thickness that is greater than the target thickness. The method includes determining, for the second substrate, when an endpoint of the polishing step has been achieved. The determining is based on the reference and current spectra.
    • 用于基于频谱的终点的方法和装置。 终点方法包括选择参考频谱。 参考光谱是在第一衬底上从感兴趣的膜反射的白光的光谱,并且具有大于目标厚度的厚度。 对于特定的基于频谱的端点确定逻辑,经验地选择参考频谱,使得当通过应用特定的基于频谱的端点逻辑来调用端点时实现目标厚度。 该方法包括获得当前频谱。 目前的光谱是当感兴趣的薄膜经受抛光步骤并且具有大于目标厚度的电流厚度时,在第二基板上从感兴趣的薄膜反射的白光的光谱。 该方法包括为第二基底确定何时已经实现了抛光步骤的终点。 该确定基于参考和当前光谱。