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    • 81. 发明申请
    • STRUCTURE AND METHOD FOR A SWITCHED CIRCUIT DEVICE
    • 一种开关电路设备的结构和方法
    • US20130320945A1
    • 2013-12-05
    • US13599909
    • 2012-08-30
    • Alexander Kalnitsky
    • Alexander Kalnitsky
    • G05F1/46
    • H02M3/155H01L29/78H01L29/7816
    • The present disclosure provides a switched voltage converter for receiving a source voltage and producing an output voltage. The voltage converter comprises a switch controller and a switched device communicatively coupled to the switch controller. The switch controller adjusts the output voltage by controlling a duty cycle of the switched device. The switched device is sized such that it is characterized by a drain-to-source breakdown voltage greater than or substantially equal to the source voltage and the output voltage and is further characterized by a hot-carrier injection rating less than the source voltage or the output voltage. In further embodiments, the switched device is sized such that it is characterized by a drain-to-source breakdown voltage greater than or substantially equal to a peak operating voltage and is further characterized by a hot-carrier injection rating less than the peak operating voltage.
    • 本公开提供了一种用于接收源极电压并产生输出电压的开关电压转换器。 电压转换器包括开关控制器和通信地耦合到开关控制器的开关装置。 开关控制器通过控制开关器件的占空比来调节输出电压。 开关器件的尺寸使得其特征在于漏极 - 源极击穿电压大于或基本上等于源极电压和输出电压,并且进一步的特征在于热载流子注入额定值小于源极电压或 输出电压。 在另外的实施例中,开关器件的尺寸使得其特征在于漏极 - 源极击穿电压大于或基本上等于峰值工作电压,并且进一步的特征在于小于峰值工作电压的热载流子注入额定值 。
    • 83. 发明授权
    • Memory array of floating gate-based non-volatile memory cells
    • 基于浮动栅极的非易失性存储单元的存储器阵列
    • US08325522B2
    • 2012-12-04
    • US13012361
    • 2011-01-24
    • Hosam HaggagAlexander KalnitskyEdgardo LaberMichael D. ChurchYun Yue
    • Hosam HaggagAlexander KalnitskyEdgardo LaberMichael D. ChurchYun Yue
    • G11C16/04G11C16/06
    • G11C16/0433
    • A memory array comprises a plurality of memory cells organized in a matrix of rows and columns. Each of the memory cells includes a high voltage access transistor, a floating gate memory transistor electrically connected to the access transistor, and a coupling capacitor electrically connected to the memory transistor. A first set of word lines are each electrically connected to the capacitor in each of the memory cells in a respective row. A second set of word lines are each electrically connected to the access transistor in each of the memory cells in a respective row. A first set of bit lines are each electrically connected to the access transistor in each of the memory cells in a respective column. A second set of bit lines are each electrically connected to the memory transistor in each of the memory cells in a respective column. Various combinations of voltages can be applied to the word lines and bit lines in operations to program, erase, read, or inhibit a logic state stored by the memory transistor in one or more of the memory cells.
    • 存储器阵列包括以行和列的矩阵组织的多个存储器单元。 每个存储单元包括高电压存取晶体管,电连接到存取晶体管的浮动栅极存储晶体管和电连接到存储晶体管的耦合电容器。 第一组字线分别电连接到相应行中的每个存储器单元中的电容器。 第二组字线各自电连接到相应行中的每个存储单元中的存取晶体管。 第一组位线分别电连接到相应列中每个存储单元中的存取晶体管。 第二组位线分别电连接到相应列中每个存储器单元中的存储晶体管。 在操作中可以对字线和位线施加电压的各种组合,以对存储器晶体管存储在一个或多个存储器单元中的逻辑状态进行编程,擦除,读取或禁止。
    • 88. 发明授权
    • Multiple time programmable (MTP) PMOS floating gate-based non-volatile memory device for a general-purpose CMOS technology with thick gate oxide
    • 多时间可编程(MTP)PMOS浮动栅极非易失性存储器件,用于具有厚栅极氧化物的通用CMOS技术
    • US07542342B2
    • 2009-06-02
    • US11508771
    • 2006-08-23
    • Alexander KalnitskyMichael Church
    • Alexander KalnitskyMichael Church
    • G11C16/04
    • G11C16/0433G11C16/10H01L27/115H01L27/11521H01L27/11558
    • A multiple time programmable (MTP) memory cell, in accordance with an embodiment, includes a floating gate PMOS transistor, a high voltage NMOS transistor, and an n-well capacitor. The floating gate PMOS transistor includes a source that forms a first terminal of the memory cell, a drain and a gate. The high voltage NMOS transistor includes a source connected to ground, an extended drain connected to the drain of the PMOS transistor, and a gate forming a second terminal of the memory cell. The n-well capacitor includes a first terminal connected to the gate of the PMOS transistor, and a second terminal forming a third terminal of the memory cell. The floating gate PMOS transistor can store a logic state. Combinations of voltages can be applied to the first, second and third terminals of the memory cell to program, inhibit program, read and erase the logic state.
    • 根据实施例的多时间可编程(MTP)存储单元包括浮置栅极PMOS晶体管,高电压NMOS晶体管和n阱电容器。 浮置栅极PMOS晶体管包括形成存储单元的第一端子,漏极和栅极的源极。 高电压NMOS晶体管包括连接到地的源极,连接到PMOS晶体管的漏极的延伸漏极和形成存储器单元的第二端子的栅极。 n阱电容器包括连接到PMOS晶体管的栅极的第一端子和形成存储器单元的第三端子的第二端子。 浮置栅极PMOS晶体管可以存储逻辑状态。 可以将组合的电压施加到存储单元的第一,第二和第三端子,以编程,禁止程序,读取和擦除逻辑状态。
    • 89. 发明授权
    • Photodiode for multiple wavelength operation
    • 用于多波长操作的光电二极管
    • US07485486B2
    • 2009-02-03
    • US11532762
    • 2006-09-18
    • Dong ZhengPhillip J. BenzelJoy JonesAlexander KalnitskyPerumal Ratman
    • Dong ZhengPhillip J. BenzelJoy JonesAlexander KalnitskyPerumal Ratman
    • H01L21/00
    • H01L27/1462H01L27/1463H01L31/02165
    • A method of a fabricating a multiple wavelength adapted photodiode and resulting photodiode includes the steps of providing a substrate having a first semiconductor type surface region on at least a portion thereof, implanting and forming a second semiconductor type shallow surface layer into the surface region, and forming a multi-layer anti-reflective coating (ARC) on the shallow surface layer. The forming step includes depositing or forming a thin oxide layer on the shallow surface layer and depositing a second dielectric layer different from the thin oxide layer on the thin oxide layer. An etch stop is formed on the second dielectric, wherein the etch stop includes at least one layer resistant to oxide etch. At least one oxide including layer (e.g. ILD) is then deposited on the etch stop. The oxide including layer and etch stop are then removed to expose at least a portion of the ARC to the ambient.
    • 一种制造多波长适应光电二极管和所得光电二极管的方法包括以下步骤:在其至少一部分上提供具有第一半导体类型表面区域的衬底,将表面区域中的第二半导体型浅表面层注入并形成,以及 在浅表面层上形成多层抗反射涂层(ARC)。 形成步骤包括在浅表面层上沉积或形成薄氧化物层,并在薄氧化物层上沉积不同于薄氧化物层的第二电介质层。 蚀刻停止件形成在第二电介质上,其中蚀刻停止层包括至少一层抵抗氧化物蚀刻的层。 然后将至少一种包括层(例如ILD)的氧化物沉积在蚀刻停止件上。 然后去除包括氧化物层和蚀刻停止层,以将ARC的至少一部分暴露于环境中。
    • 90. 发明申请
    • MEMORY ARRAY OF FLOATING GATE-BASED NON-VOLATILE MEMORY CELLS
    • 基于盖帽的不挥发性记忆细胞的记忆阵列
    • US20080266959A1
    • 2008-10-30
    • US11861111
    • 2007-09-25
    • Hosam HaggagAlexander KalnitskyEdgardo LaberMichael D. ChurchYun Yue
    • Hosam HaggagAlexander KalnitskyEdgardo LaberMichael D. ChurchYun Yue
    • G11C16/04
    • G11C16/0433
    • A memory array comprises a plurality of memory cells organized in a matrix of rows and columns. Each of the memory cells includes a high voltage access transistor, a floating gate memory transistor electrically connected to the access transistor, and a coupling capacitor electrically connected to the memory transistor. A first set of word lines are each electrically connected to the capacitor in each of the memory cells in a respective row. A second set of word lines are each electrically connected to the access transistor in each of the memory cells in a respective row. A first set of bit lines are each electrically connected to the access transistor in each of the memory cells in a respective column. A second set of bit lines are each electrically connected to the memory transistor in each of the memory cells in a respective column. Various combinations of voltages can be applied to the word lines and bit lines in operations to program, erase, read, or inhibit a logic state stored by the memory transistor in one or more of the memory cells.
    • 存储器阵列包括以行和列的矩阵组织的多个存储器单元。 每个存储单元包括高电压存取晶体管,电连接到存取晶体管的浮动栅极存储晶体管和电连接到存储晶体管的耦合电容器。 第一组字线分别电连接到相应行中的每个存储器单元中的电容器。 第二组字线各自电连接到相应行中的每个存储单元中的存取晶体管。 第一组位线分别电连接到相应列中每个存储单元中的存取晶体管。 第二组位线分别电连接到相应列中每个存储器单元中的存储晶体管。 在操作中可以对字线和位线施加电压的各种组合,以对存储器晶体管存储在一个或多个存储器单元中的逻辑状态进行编程,擦除,读取或禁止。