会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 72. 发明申请
    • Method for fabricating semiconductor device by forming damascene interconnections
    • 通过形成镶嵌互连制造半导体器件的方法
    • US20040029324A1
    • 2004-02-12
    • US10627895
    • 2003-07-24
    • Je-Min Park
    • H01L021/335
    • H01L21/76897H01L21/76802H01L21/76807
    • A method for fabricating a semiconductor device, in which a sufficient misalignment margin is obtained when forming interconnections and contact holes, is provided. Dielectric layer patterns which define recesses in which damascene interconnections are to be formed, are formed. Then, first contact holes between the dielectric layer patterns are etched, and the first contact holes and the recesses are concurrently filled with a conductive material. The recesses can be filled with the conductive material by performing an etch-back process. The dielectric layer patterns are then etched, thereby forming the damascene interconnections and concurrently covering only a region in which second contact holes are to be formed with the dielectric layer patterns. Spaces between the dielectric layer patterns are filled with a mask layer, and then the dielectric layer patterns are selectively removed from the resultant structure, thereby forming the second contact holes aligned with the damascene interconnections.
    • 提供一种制造半导体器件的方法,其中在形成互连和接触孔时获得足够的未对准余量。 形成限定要形成镶嵌互连的凹部的介电层图案。 然后,蚀刻电介质层图案之间的第一接触孔,同时用导电材料填充第一接触孔和凹部。 通过执行回蚀工艺,可以用导电材料填充凹部。 然后蚀刻介电层图案,从而形成镶嵌互连,并且同时仅覆盖将要与介电层图案形成第二接触孔的区域。 电介质层图案之间的空隙用掩模层填充,然后从所得到的结构中选择性地除去电介质层图案,从而形成与镶嵌互连对准的第二接触孔。
    • 73. 发明申请
    • METHOD TO REMOVE AN OXIDE SEAM ALONG GATE STACK EDGE, WHEN NITRIDE SPACE FORMATION BEGINS WITH AN OXIDE LINER SURROUNDING GATE STACK
    • 当氮氧化物空间形成与氧化物衬里周围的栅格堆叠时,在门盖堆积边缘上移除氧化物的方法
    • US20040029319A1
    • 2004-02-12
    • US10213086
    • 2002-08-07
    • Paul J. Rudeck
    • H01L021/335
    • H01L27/11521H01L27/115
    • An exposed top end of a vertical oxide spacer is removed, and a nitride layer is deposited in an amount sufficient to replace the removed portion prior to exposing a memory device to a self align contact etch process. The nitride layer may be used to prevent a short circuit through the oxide spacer. The present invention also provides memory devices that have a gate stack, a vertical spacer adjacent to the gate stack, in which the vertical spacer has a lower portion comprising an oxide and an upper portion comprising a nitride, and a continuous nitride layer overlaying the vertical spacer and the gate stack. The present invention further provides methods of fabricating the above devices, and processor systems which include the devices.
    • 去除暴露的垂直氧化物间隔物的顶端,并且在将存储器件暴露于自对准接触蚀刻工艺之前,以足以代替去除的部分的量沉积氮化物层。 氮化物层可以用于防止通过氧化物间隔物的短路。 本发明还提供了一种存储器件,它们具有一个栅极叠层,一个邻近栅极叠层的垂直隔离层,其中垂直间隔物具有一个包含一个氧化物的下部分和一个包含一个氮化物的上部分,以及一个连续的氮化物层, 间隔器和栅极堆叠。 本发明还提供了制造上述装置的方法以及包括这些装置的处理器系统。
    • 75. 发明申请
    • Production method for solid imaging device
    • 固体成像装置的生产方法
    • US20030170928A1
    • 2003-09-11
    • US10333640
    • 2003-05-05
    • Takayuki ShimozonoRitsuo Takizawa
    • H01L021/00H01L021/335H01L021/8232
    • H01L27/14683H01L27/14698H01L27/14806
    • White defects caused by a dark-current of a solid-state imaging device is reduced by effectively bringing out gettering capability of a buried getter sink layer. A buried getter sink layer is formed by introducing to the semiconductor substrate a substance of a second element which is a congener of a first element composing a semiconductor substrate, a crystal growth layer is formed by crystal growing a substance of the first element on a surface of the semiconductor substrate, and a solid-state imaging element is formed inside and on the crystal growth layer at a lower temperature than that in the case of forming an extrinsic getter sink layer by introducing a substance of a third element of a different group from the first element on a back surface of the semiconductor substrate. Alternately, a solid-state imaging element is formed at a lower temperature than that in the case of forming an extrinsic getter sink layer on a surface of the crystal growth layer by oxidization in an atmosphere of a gas containing hydrochloric acid.
    • 通过有效地提供掩埋的吸气剂吸收层的吸气能力,降低了由固态成像装置的暗电流引起的白色缺陷。 通过向半导体基板引入作为构成半导体基板的第一元素的同源物的第二元素的物质形成掩埋的吸气剂沉积层,通过在表面上晶体生长第一元素的物质形成晶体生长层 的半导体衬底的固体摄像元件,并且在比通过将不同组的第三元素的物质引入外部吸收剂沉积层的情况下的温度低于晶体生长层的内部和外部形成固体摄像元件 半导体衬底的背表面上的第一元件。 或者,固体成像元件形成在比在含有盐酸的气体的气氛中通过氧化在晶体生长层的表面上形成外部吸气剂沉积层的情况下更低的温度。