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    • 75. 发明授权
    • Apparatus for high throughput wafer bonding
    • 高通量晶片接合装置
    • US08425715B2
    • 2013-04-23
    • US13079446
    • 2011-04-04
    • Gregory George
    • Gregory George
    • B29C65/00B29C65/08B29C45/00B29C47/00B29C43/02B29C49/00B29C51/00B29C43/10B32B37/00B30B5/02B30B5/04B30B15/34H01L21/30H01L21/46H01L21/76B29D24/00B29D29/00B28B21/36A01J21/00A01J25/12A21C3/00A21C11/00A23G1/20A23G3/02A23P1/00B28B11/08B29C55/28
    • H01L21/6719H01L21/67092
    • An industrial-scale high throughput wafer bonding apparatus includes a wafer bonder chamber extending along a main axis and comprising a plurality of chamber zones, a plurality of heater/isolator plates, a guide rod system extending along the main axis, a pair of parallel track rods extending along the main axis, and first pressure means. The chamber zones are separated from each other and thermally isolated from each other by the heater/isolator plates. The heater/isolator plates are oriented perpendicular to the main axis, are movably supported and guided by the guide rod system and are configured to move along the direction of the main axis. Each of the chamber zones is dimensioned to accommodate an aligned wafer pair and the wafer pairs are configured to be supported by the parallel track rods. The first pressure means is configured to apply a first force perpendicular to a first end heater/isolator plate. The applied first force causes the heater/isolator plates to move toward each other along the main axis and thereby causes the collapse of each chamber zone volume and the application of bonding pressure onto the wafer pairs.
    • 一种工业规模的高通量晶片接合装置,包括沿着主轴延伸的晶片接合室,包括多个室区,多个加热器/隔离板,沿主轴延伸的导杆系统,一对平行轨道 杆沿着主轴线延伸,以及第一压力装置。 室区彼此分离并通过加热器/隔离板彼此热隔离。 加热器/隔离板垂直于主轴定向,由导杆系统可移动地支撑和引导,并被构造成沿着主轴线的方向移动。 每个室区的尺寸被设计成适应对准的晶片对,并且晶片对构造成由平行轨道杆支撑。 第一压力装置构造成施加垂直于第一端加热器/隔离板的第一力。 所施加的第一力使得加热器/隔离板沿着主轴线彼此移动,从而导致每个室区域体积的崩溃以及将结合压力施加到晶片对上。
    • 77. 发明授权
    • Mold, mold production process, processing apparatus, and processing method
    • 模具,模具生产工艺,加工设备及加工方法
    • US08308471B2
    • 2012-11-13
    • US12091845
    • 2008-03-14
    • Atsunori TerasakiJunichi Seki
    • Atsunori TerasakiJunichi Seki
    • A01J21/00
    • B82Y10/00B81C99/009B82Y40/00G03F7/0002G03F9/7084Y10T428/24479
    • A mold for imprinting a pattern onto a member to be processed. The mold includes a mold body having a front surface, at which an imprint pattern is formed, and a rear surface opposite from the front surface. A coating layer covers the front surface of the mold body, and a coating layer covers the rear surface of the mold body. An alignment mark as an object to be subjected to optical observation is provided at the front surface of the mold body. The coating layer for covering the rear surface includes (i) a hole for observation of the alignment mark and (ii) a stress adjusting pattern corresponding to a density of the imprint pattern. The hole for observation is formed at the rear surface of the mold body opposite from the alignment mark, and the stress adjusting pattern is formed at the rear surface of the mold body opposite from the imprint pattern.
    • 用于将图案压印到要处理的构件上的模具。 模具包括具有形成有压印图案的前表面和与前表面相对的后表面的模具体。 涂层覆盖模体的前表面,涂层覆盖模体的后表面。 在模具体的前表面设置有作为光学观察对象的对准标记。 用于覆盖后表面的涂层包括(i)用于观察对准标记的孔和(ii)与压印图案的密度相对应的应力调整图案。 用于观察的孔形成在与对准标记相对的模具体的后表面处,并且应力调整图案形成在与压印图案相对的模具体的后表面处。
    • 78. 发明授权
    • High power rotational cycle moulding method and device
    • 大功率旋转循环成型方法及装置
    • US08277212B2
    • 2012-10-02
    • US12514980
    • 2007-11-23
    • Klaus Gebert
    • Klaus Gebert
    • A01J21/00
    • B30B11/14B30B15/0082B30B15/302B30B15/306B30B15/34
    • The invention relates to a device for forming moldable bodies (57) from a moldable mass by means of a matrix grid (19), in which at least one cavity (21) is formed by lateral limiting elements (20), and at least one tool (17, 18) which compresses the moldable mass into the cavity (21). The inventive device is characterized by a compression partition (38) that can be displaced on the matrix grid (19) for portioning the moldable mass. Said compression partition (38) comprises lateral limiting elements (39) that correspond to the lateral limiting elements (20) of the matrix grid (19). The invention also relates to a method for forming moldable bodies (57) consisting of forming a moldable mass and guiding it to a matrix grid (19) such that it rests on the front face (45) of the lateral limiting elements (20) of the matrix grid (19). A compression partition (38) with lateral limiting elements (39), that correspond to the lateral limiting elements (20) of the matrix grid (19), is displaced towards the matrix grid (19) to reduce the part (14A) of the moldable mass on the lateral limiting elements (20) of the matrix grid (19) in the direction of a cavity (21) formed by the matrix grid (19) between the lateral limiting elements (20), thus portioning the moldable mass. At least one tool (17, 18) compresses the portions of the moldable mass in the cavity (21).
    • 本发明涉及一种用于通过矩阵格栅(19)从可模制物体形成可模制体(57)的装置,其中至少一个空腔(21)由横向限制元件(20)形成,并且至少一个 工具(17,18),其将可模制物料压缩到空腔(21)中。 本发明的装置的特征在于可以在矩阵栅格(19)上移位以分配可模制物料的压缩分隔件(38)。 所述压缩分隔件(38)包括对应于矩阵网格(19)的侧向限制元件(20)的横向限制元件(39)。 本发明还涉及一种用于形成可模制体(57)的方法,所述模制体(57)包括形成可模制的质量并将其引导到矩阵网格(19),使得其搁置在横向限制元件(20)的前表面(45)上 矩阵网格(19)。 具有与矩阵栅格(19)的横向限制元件(20)相对应的横向限制元件(39)的压缩分隔件(38)朝向矩阵格栅(19)移位,以减小矩形栅格(19)的部分(14A) 在矩形栅格(19)的横向限制元件(20)上,在矩形栅格(19)形成的空腔(21)的方向上在侧向限制元件(20)之间,从而分配可模制的质量块,可模制质量。 至少一个工具(17,18)压缩空腔(21)中的可模制物料的部分。