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71. 发明授权

US07851906B2 Flexible circuit electronic package with standoffs 失效
标题翻译：灵活的电路电子封装
公开(公告)号：US07851906B2
公开(公告)日：2010-12-14
申请号：US11727314
申请日：2007-03-26
申请人： David J. Alcoe , Varaprasad V. Calmidi
发明人： David J. Alcoe , Varaprasad V. Calmidi
IPC分类号： H01L23/34
CPC分类号： H01L23/367 , H01L23/10 , H01L23/40 , H01L23/42 , H01L23/5387 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/09701 , H01L2924/00 , H01L2224/0401
摘要： A flexible circuit electronic package including a heat sink, a flexible circuit having a semiconductor chip positioned thereon and electrically coupled thereto, and a quantity of heat shrunk adhesive securing the flexible circuit to the heat sink such that the flexible circuit is planar. This package is then adapted for being positioned on and electrically coupled to a circuitized substrate such as a printed circuit board. A method of making this package is also provided.
摘要翻译：一种柔性电路电子封装，包括散热器，具有定位在其上并电耦合到其上的半导体芯片的柔性电路以及将柔性电路固定到散热器的一定数量的热收缩粘合剂，使得柔性电路是平面的。然后，该封装适于定位在电耦合到诸如印刷电路板的电路化基板上。还提供了制造该包装的方法。

72. 发明申请

US20100033935A1 Method for Direct Heat Sink Attachment 有权
标题翻译：直接散热器附件方法
公开(公告)号：US20100033935A1
公开(公告)日：2010-02-11
申请号：US12535394
申请日：2009-08-04
申请人： Timothy J. Chainer
发明人： Timothy J. Chainer
IPC分类号： H05K7/20
CPC分类号： H01L23/40 , H01L23/4006 , H01L23/4093 , H01L2023/4062 , H01L2224/16 , H01L2224/73253 , Y10T29/53022 , Y10T29/5313
摘要： A system and method of attaching a heat sink to an integrated circuit chip includes providing a compliant material for constraining the heat sink's mechanical motion while simultaneously allowing for thermal expansion of the heat sink.
摘要翻译：将散热器附接到集成电路芯片的系统和方法包括提供用于约束散热器的机械运动的柔性材料，同时允许散热器的热膨胀。

73. 发明授权

US07600557B2 Heat sink mechanism 失效
标题翻译：散热机构
公开(公告)号：US07600557B2
公开(公告)日：2009-10-13
申请号：US11955564
申请日：2007-12-13
申请人： Shih-Chieh Chiang , Lin-Yu Lee
发明人： Shih-Chieh Chiang , Lin-Yu Lee
IPC分类号： H01L23/40 , B25B5/10
CPC分类号： H01L23/40 , H01L23/467 , H01L2023/4075 , H01L2924/0002 , Y10T74/19688 , Y10T74/19828 , Y10T74/2133 , H01L2924/00
摘要： A heat sink mechanism includes a fixed and a movable clamping piece, at least one adjusting gearwheel rotatably mounted to and between the fixed and the movable clamping piece via a fixing shaft while an end of the fixing shaft is screwed to the movable clamping piece, and an adjusting worm shaft rotatably mounted to the fixed clamping piece for driving the adjusting gearwheel to rotate via meshed worm threads on the worm shaft and gear teeth on the adjusting gearwheel. When the adjusting worm shaft is rotated, the meshed worm threads and gear teeth bring the adjusting gearwheel and the fixing shaft thereof to rotate, so that the movable clamping piece screwed to the rotating fixing shaft is brought to move toward or away from the fixed clamping piece to thereby fix the heat sink mechanism to a heat-producing source to achieve the purpose of heat dissipation.
摘要翻译：一种散热机构，包括固定和可动的夹紧件，至少一个调节齿轮可旋转地安装在固定和可动夹紧件之间并经固定轴固定在可动夹紧件之间，同时固定轴的一端拧到可动夹紧件上，以及调节蜗杆轴可旋转地安装在固定夹紧件上，用于驱动调节齿轮通过蜗杆轴上的啮合蜗杆和调节齿轮上的齿轮齿旋转。当调节蜗杆轴旋转时，网状蜗杆和齿轮齿使调节齿轮及其固定轴旋转，使得与旋转固定轴螺纹连接的可动夹紧件朝向或远离固定夹紧从而将散热机构固定在发热源上，达到散热的目的。

74. 发明申请

US20090056918A1 HEAT DISSIPATION DEVICE HAVING A BACK PLATE UNIT 失效
标题翻译：具有背板单元的散热装置
公开(公告)号：US20090056918A1
公开(公告)日：2009-03-05
申请号：US11845735
申请日：2007-08-27
申请人： HAO LI , JUN LONG , TAO LI
发明人： HAO LI , JUN LONG , TAO LI
IPC分类号： F28D15/00
CPC分类号： H01L23/4093 , H01L23/40 , H01L2023/4081 , H01L2023/4087 , H01L2924/0002 , Y10T24/44026 , Y10T24/44034 , Y10T24/44556 , H01L2924/00
摘要： A heat dissipation device for dissipating heat from an electronic component (12) mounted on a printed circuit board (10) includes a retention module (30) resting on the printed circuit board, a heat sink (20) disposed on the retention module for contacting the electronic component, a clip (40) for securing the heat sink to the retention module, and a back plate unit mounted below the printed circuit board for engaging with the retention module and supporting the electronic component. The back plate unit includes a back plate (50), a gasket (62) engaging with the back plate, and a bracket (64) being sandwiched between the gasket and the back plate. The gasket has an annular top face contacting the printed circuit board, and a plurality of blocks (6202) contacting the back plate, whereby the gasket can provide a sufficient and uniform support to the electronic component.
摘要翻译：一种用于从安装在印刷电路板（10）上的电子部件（12）散热的散热装置，包括搁置在印刷电路板上的保持模块（30），设置在保持模块上的散热片（20）电子部件，用于将散热器固定到保持模块的夹子（40），以及安装在印刷电路板下方的用于与保持模块接合并支撑电子部件的背板单元。背板单元包括背板（50），与背板接合的垫圈（62）和夹在垫圈和背板之间的托架（64）。垫圈具有接触印刷电路板的环形顶面和与背板接触的多个块（6202），由此垫圈可以向电子部件提供足够和均匀的支撑。

75. 发明申请

US20080237840A1 Flexible circuit electronic package with standoffs 失效
标题翻译：灵活的电路电子封装
公开(公告)号：US20080237840A1
公开(公告)日：2008-10-02
申请号：US11727314
申请日：2007-03-26
申请人： David J. Alcoe , Varaprasad V. Calmidi
发明人： David J. Alcoe , Varaprasad V. Calmidi
IPC分类号： H01L23/34
CPC分类号： H01L23/367 , H01L23/10 , H01L23/40 , H01L23/42 , H01L23/5387 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/09701 , H01L2924/00 , H01L2224/0401
摘要： A flexible circuit electronic package including a heat sink, a flexible circuit having a semiconductor chip positioned thereon and electrically coupled thereto, and a quantity of heat shrunk adhesive securing the flexible circuit to the heat sink such that the flexible circuit is planar. This package is then adapted for being positioned on and electrically coupled to a circuitized substrate such as a printed circuit board. A method of making this package is also provided.
摘要翻译：一种柔性电路电子封装，包括散热器，具有定位在其上并电耦合到其上的半导体芯片的柔性电路以及将柔性电路固定到散热器的一定数量的热收缩粘合剂，使得柔性电路是平面的。然后，该封装适于定位在电耦合到诸如印刷电路板的电路化基板上。还提供了制造该包装的方法。

76. 发明授权

US07394658B2 Heat sink with twist lock mounting mechanism 有权
标题翻译：散热器带扭锁安装机构
公开(公告)号：US07394658B2
公开(公告)日：2008-07-01
申请号：US11218146
申请日：2005-09-01
申请人： Philip S. McPhee
发明人： Philip S. McPhee
IPC分类号： H05K7/20 , H01L23/34 , F28F7/00
CPC分类号： H01L23/40 , H01L2924/0002 , H01L2924/00
摘要： A heat sink with a twist lock mounting mechanism. An electronic device may be mounted to the heat sink without the use of external fasteners, such as screws or rivets. Instead of using external fasteners, the heat sink includes resilient mounting flanges for securing an electronic device. Rotating an electronic device on the heat sink secures the electronic device in a friction fit with the resilient mounting flanges. Multiple electronic devices may be mounted to the heat sink, either manually or through an automated process.
摘要翻译：带有扭锁安装机构的散热器。电子设备可以安装在散热器上，而不需要使用诸如螺钉或铆钉的外部紧固件。代替使用外部紧固件，散热器包括用于固定电子设备的弹性安装凸缘。将电子设备旋转在散热器上，使电子设备与弹性安装凸缘摩擦配合。多个电子设备可以手动地或通过自动化过程安装到散热器。

77. 发明申请

US20080149321A1 THERMAL MODULE MOUNTED ON CARRIER BY USING MAGNETIC FORCE 审中-公开
标题翻译：通过使用磁力安装在载体上的热模块
公开(公告)号：US20080149321A1
公开(公告)日：2008-06-26
申请号：US11853030
申请日：2007-09-11
申请人： Chi-Wei Tien , Chang-Yuan Wu , Chang-Chiang Shih , Li-Kan Yeh , I-Feng Hsu
发明人： Chi-Wei Tien , Chang-Yuan Wu , Chang-Chiang Shih , Li-Kan Yeh , I-Feng Hsu
IPC分类号： F28F7/00
CPC分类号： F28F9/002 , F28D15/02 , F28F2275/08 , H01L23/40 , H01L23/4006 , H01L2023/4062 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： A thermal module includes a thermal conductor and at least one first magnetic element. The thermal conductor is disposed above a carrier. In addition, the thermal module may further include at least one second magnetic element or at least one magnetically susceptible element. Either the second magnetic element or the magnetically susceptible element and the first magnetic element can produce magnetic attractive force or magnetic repulsion force therebetween. By such magnetic force, the thermal conductor can be retained with respect to the carrier, thus making contact with a heat generating component.
摘要翻译：热模块包括热导体和至少一个第一磁性元件。热导体设置在载体上方。此外，热模块还可以包括至少一个第二磁性元件或至少一个磁敏元件。第二磁性元件或磁敏元件和第一磁性元件可以产生磁吸引力或其间的磁排斥力。通过这种磁力，热导体可以相对于载体保持，从而与发热部件接触。

78. 发明授权

US07333335B2 Using the wave soldering process to attach motherboard chipset heat sinks 失效
标题翻译：使用波峰焊工艺连接主板芯片组散热片
公开(公告)号：US07333335B2
公开(公告)日：2008-02-19
申请号：US10996332
申请日：2004-11-23
申请人： George Hsieh
发明人： George Hsieh
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L23/3677 , H01L23/40 , H01L23/42 , H01L2023/405 , H01L2023/4062 , H01L2023/4087 , H01L2224/16 , H01L2224/73253 , H01L2924/01057 , H01L2924/15311 , H05K3/3447 , H05K3/3468 , Y10T29/49359
摘要： A electronic device and method for extracting heat from a heat producing component having front and back sides, the front side is disposed across from the back side, and the front side is attached to a substrate including multiple holes. A thermal interface material is disposed over the back side of the heat producing component. A heat sink including multiple pins corresponding to the multiple holes in the substrate is disposed over the thermal interface material such that the pins are disposed through the holes. The thermal interface material melts and wets to form a thermal coupling between the back side and the heat sink when passed over pre-heaters of a wave soldering machine. Further, the pins are soldered to form solder joints between the respective pins and the substrate when passed over a solder wave in the wave soldering machine to lock-in the thermal coupling formed during the preheating of the thermal interface material to provide a low-cost thermal solution.
摘要翻译：一种用于从具有正面和背面的发热部件提取热量的电子装置和方法，其前侧从背侧横跨设置，并且将前侧附着到包括多个孔的基板。热界面材料设置在发热部件的背面上。在热界面材料上设置包括对应于衬底中的多个孔的多个销的散热器，使得销布置成穿过孔。热界面材料熔化并润湿以在通过波峰焊机的预热器时在背面和散热器之间形成热耦合。此外，当在波峰焊机中通过焊波时，引脚被焊接以在相应的引脚和基板之间形成焊接点，以锁定在热界面材料的预热期间形成的热耦合以提供低成本热解决方案。

79. 发明申请

US20070217161A1 HEAT SINK HAVING PROTECTIVE DEVICE FOR THERMAL INTERFACE MATERIAL SPREAD THEREON 失效
标题翻译：具有热接触材料传播的保护装置的散热器
公开(公告)号：US20070217161A1
公开(公告)日：2007-09-20
申请号：US11309592
申请日：2006-08-28
申请人： Yi-Qiang Wu , Chun-Chi Chen
发明人： Yi-Qiang Wu , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/40 , H01L21/4882 , H01L23/3737 , H01L2924/0002 , H01L2924/00
摘要： A protective device (10) comprises a cap (100) and a strap (120) connecting with the cap (100). The cap (100) defines a cavity (102) which is adapted for accommodating thermal interface material (300) spread on a bottom surface (204) of a heat sink (200). At least three sides of the heat sink (200) are encircled by the strap (120), thereby the cap (100) is firmly attached to the heat sink (200) via the strap (120).
摘要翻译：保护装置（10）包括盖（100）和与盖（100）连接的带（120）。盖（100）限定了适于容纳散布在散热器（200）的底表面（204）上的热界面材料（300）的空腔（102）。散热器（200）的至少三个侧面被带（120）包围，从而盖（100）经由带（120）牢固地附接到散热器（200）。

80. 发明申请

US20070047207A1 Heat sink with twist lock mounting mechanism 有权
标题翻译：散热器带扭锁安装机构
公开(公告)号：US20070047207A1
公开(公告)日：2007-03-01
申请号：US11218146
申请日：2005-09-01
申请人： Philip McPhee
发明人： Philip McPhee
IPC分类号： H05K7/20
CPC分类号： H01L23/40 , H01L2924/0002 , H01L2924/00
摘要： A heat sink with a twist lock mounting mechanism. An electronic device may be mounted to the heat sink. without the use of external fasteners, such as screws or rivets. Instead of using external fasteners, the heat sink includes resilient mounting flanges for securing an electronic device. Rotating an electronic device on the heat sink secures the electronic device in a friction fit with the resilient mounting flanges. Multiple electronic devices may be mounted to the heat sink, either manually or through an automated process.
摘要翻译：带有扭锁安装机构的散热器。电子设备可以安装到散热器。而不使用外部紧固件，例如螺钉或铆钉。代替使用外部紧固件，散热器包括用于固定电子设备的弹性安装凸缘。将电子设备旋转在散热器上，使电子设备与弹性安装凸缘摩擦配合。多个电子设备可以手动地或通过自动化过程安装到散热器。

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