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1. 发明申请

US20080149321A1 THERMAL MODULE MOUNTED ON CARRIER BY USING MAGNETIC FORCE 审中-公开
标题翻译：通过使用磁力安装在载体上的热模块
公开(公告)号：US20080149321A1
公开(公告)日：2008-06-26
申请号：US11853030
申请日：2007-09-11
申请人： Chi-Wei Tien , Chang-Yuan Wu , Chang-Chiang Shih , Li-Kan Yeh , I-Feng Hsu
发明人： Chi-Wei Tien , Chang-Yuan Wu , Chang-Chiang Shih , Li-Kan Yeh , I-Feng Hsu
IPC分类号： F28F7/00
CPC分类号： F28F9/002 , F28D15/02 , F28F2275/08 , H01L23/40 , H01L23/4006 , H01L2023/4062 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： A thermal module includes a thermal conductor and at least one first magnetic element. The thermal conductor is disposed above a carrier. In addition, the thermal module may further include at least one second magnetic element or at least one magnetically susceptible element. Either the second magnetic element or the magnetically susceptible element and the first magnetic element can produce magnetic attractive force or magnetic repulsion force therebetween. By such magnetic force, the thermal conductor can be retained with respect to the carrier, thus making contact with a heat generating component.
摘要翻译：热模块包括热导体和至少一个第一磁性元件。热导体设置在载体上方。此外，热模块还可以包括至少一个第二磁性元件或至少一个磁敏元件。第二磁性元件或磁敏元件和第一磁性元件可以产生磁吸引力或其间的磁排斥力。通过这种磁力，热导体可以相对于载体保持，从而与发热部件接触。

2. 发明授权

US07623350B2 Thermal conducting medium protector 失效
标题翻译：导热介质保护器
公开(公告)号：US07623350B2
公开(公告)日：2009-11-24
申请号：US11692926
申请日：2007-03-29
申请人： Chi-Wei Tien , Chang-Yuan Wu , Ching-Ya Tu
发明人： Chi-Wei Tien , Chang-Yuan Wu , Ching-Ya Tu
IPC分类号： H05K7/20 , H01L23/34 , F28F7/00
CPC分类号： H01L23/40 , H01L21/4882 , H01L23/3737 , H01L2924/0002 , Y10T24/44026 , Y10T24/44034 , Y10T24/44556 , H01L2924/00
摘要： A thermal conducting medium protector is applicable for being assembled to a carrier, so as to protect a thermal conducting medium disposed on the carrier. The thermal conducting medium protector includes a shell and a cover plate. The shell has a first buckling portion on one side of the shell, and an opening. When the carrier is placed on a side surface of the shell, the thermal conducting medium is located in the opening. The cover plate has a second buckling portion, a first side, on which the second buckling portion is located, and a second side opposite to the first side and pivoted to the shell. When the cover plate rotates along the second side and then span across the carrier placed on the side surface of the shell, the buckling portions are buckled with each other to hold the carrier between the shell and the cover plate.
摘要翻译：热传导介质保护器适用于组装到载体上，以保护设置在载体上的导热介质。导热介质保护器包括外壳和盖板。壳体在壳体的一侧具有第一弯曲部分和开口。当载体放置在壳体的侧表面上时，导热介质位于开口中。盖板具有第二弯曲部分，第一侧面，第二弯曲部分位于该第一弯曲部分上，第二侧面与第一侧相对并且枢转到壳体。当盖板沿着第二侧旋转，然后穿过设置在壳体的侧表面上的载体时，该弯曲部分彼此弯曲以将托架保持在壳体和盖板之间。

3. 发明授权

US07688590B2 Thermal module and electronic apparatus using the same 失效
标题翻译：热模块和电子设备使用相同
公开(公告)号：US07688590B2
公开(公告)日：2010-03-30
申请号：US12110336
申请日：2008-04-27
申请人： Chau-Wen Cheng , Chi-Wei Tien , Chang-Yuan Wu , Ya-Ping Lin
发明人： Chau-Wen Cheng , Chi-Wei Tien , Chang-Yuan Wu , Ya-Ping Lin
IPC分类号： H05K7/20
CPC分类号： G06F1/203
摘要： A thermal module suitable for cooling a heat generating element within a casing of an electronic apparatus includes a fan, a heat sink and a heat pipe. The fan is mounted within the casing for generating airflow to an opening of the casing. The heat sink is mounted within the casing between the opening of the casing and the fan, such that the airflow generated by the fan passes through the heat sink and then flows out of the opening. The heat pipe contacts the heat generating element, extends from the heat generating element to the heat sink, and extends along a periphery of the fan to contact the heat generating element again.
摘要翻译：适用于冷却电子设备的壳体内的发热元件的热模块包括风扇，散热器和热管。风扇安装在壳体内，用于产生到壳体开口的气流。散热器安装在壳体内的壳体开口和风扇之间，使得风扇产生的气流通过散热器，然后流出开口。热管接触发热元件，从发热元件延伸到散热器，并且沿着风扇的周边延伸以再次接触发热元件。

4. 发明申请

US20080285234A1 THERMAL MODULE AND ELECTRONIC APPARATUS USING THE SAME 失效
标题翻译：使用相同的热模块和电子设备
公开(公告)号：US20080285234A1
公开(公告)日：2008-11-20
申请号：US12110336
申请日：2008-04-27
申请人： Chau-Wen Cheng , Chi-Wei Tien , Chang-Yuan Wu , Ya-Ping Lin
发明人： Chau-Wen Cheng , Chi-Wei Tien , Chang-Yuan Wu , Ya-Ping Lin
IPC分类号： H05K7/20
CPC分类号： G06F1/203
摘要： A thermal module suitable for cooling a heat generating element within a casing of an electronic apparatus includes a fan, a heat sink and a heat pipe. The fan is mounted within the casing for generating airflow to an opening of the casing. The heat sink is mounted within the casing between the opening of the casing and the fan, such that the airflow generated by the fan passes through the heat sink and then flows out of the opening. The heat pipe contacts the heat generating element, extends from the heat generating element to the heat sink, and extends along a periphery of the fan to contact the heat generating element again.
摘要翻译：适用于冷却电子设备的壳体内的发热元件的热模块包括风扇，散热器和热管。风扇安装在壳体内，用于产生到壳体开口的气流。散热器安装在壳体内的壳体开口和风扇之间，使得风扇产生的气流通过散热器，然后流出开口。热管接触发热元件，从发热元件延伸到散热器，并且沿着风扇的周边延伸以再次接触发热元件。

5. 发明申请

US20080024995A1 THERMAL CONDUCTING MEDIUM PROTECTOR 失效
标题翻译：导热介质保护器
公开(公告)号：US20080024995A1
公开(公告)日：2008-01-31
申请号：US11692926
申请日：2007-03-29
申请人： Chi-Wei Tien , Chang-Yuan Wu , Ching Ya Tu
发明人： Chi-Wei Tien , Chang-Yuan Wu , Ching Ya Tu
IPC分类号： H05K7/20
CPC分类号： H01L23/40 , H01L21/4882 , H01L23/3737 , H01L2924/0002 , Y10T24/44026 , Y10T24/44034 , Y10T24/44556 , H01L2924/00
摘要： A thermal conducting medium protector is applicable for being assembled to a carrier, so as to protect a thermal conducting medium disposed on the carrier. The thermal conducting medium protector includes a shell and a cover plate. The shell has a first buckling portion on one side of the shell, and an opening. When the carrier is placed on a side surface of the shell, the thermal conducting medium is located in the opening. The cover plate has a second buckling portion, a first side, on which the second buckling portion is located, and a second side opposite to the first side and pivoted to the shell. When the cover plate rotates along the second side and then span across the carrier placed on the side surface of the shell, the buckling portions are buckled with each other to hold the carrier between the shell and the cover plate.
摘要翻译：热传导介质保护器适用于组装到载体上，以保护设置在载体上的导热介质。导热介质保护器包括外壳和盖板。壳体在壳体的一侧具有第一弯曲部分和开口。当载体放置在壳体的侧表面上时，导热介质位于开口中。盖板具有第二弯曲部分，第一侧面，第二弯曲部分位于该第一弯曲部分上，第二侧面与第一侧相对并且枢转到壳体。当盖板沿着第二侧旋转，然后穿过设置在壳体的侧表面上的载体时，该弯曲部分彼此弯曲以将托架保持在壳体和盖板之间。

6. 发明申请

US20070284096A1 Cooler module and heat pipe for cooler module 审中-公开
标题翻译：冷却器模块和冷却器模块的热管
公开(公告)号：US20070284096A1
公开(公告)日：2007-12-13
申请号：US11717840
申请日：2007-03-14
申请人： Chi-Wei Tien , Jenq-Haur Pan , Chang-Yuan Wu
发明人： Chi-Wei Tien , Jenq-Haur Pan , Chang-Yuan Wu
IPC分类号： F28F1/00
CPC分类号： F28D15/0266 , F28D15/046 , F28F2275/025
摘要： A cooler module includes a heat pipe, which has one end terminating in a heat absorbing section that has at least one pane closely attached to the CPU to absorb heat from the CPU and a relatively greater metal wall thickness than the metal wall thickness of the heat pipe, and a heat sink connected to the other end of the heat pipe for dissipating heat absorbed from the CPU by the heat absorbing section of the heat pipe. The invention also provides a heat pipe for use in such a cooler module.
摘要翻译：冷却器模块包括热管，其一端终止于吸热部分，该热吸收部分具有紧密连接到CPU的至少一个窗格以吸收来自CPU的热量和比热量的金属壁厚度更大的金属壁厚度管道和连接到热管的另一端的散热器，用于通过热管的吸热部分散发从CPU吸收的热量。本发明还提供了一种用于这种冷却器模块的热管。

7. 发明申请

US20060285299A1 HEAT DISSIPATION STRUCTURE FOR INTERFACE CARD 失效
标题翻译：接口卡散热结构
公开(公告)号：US20060285299A1
公开(公告)日：2006-12-21
申请号：US11307543
申请日：2006-02-13
申请人： Sheng- Liang Cheng , Chi-Wei Tien , Jenq-Haur Pan
发明人： Sheng- Liang Cheng , Chi-Wei Tien , Jenq-Haur Pan
IPC分类号： H05K7/20
CPC分类号： H05K7/20445 , H01L23/3672 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation structure configured to couple with an interface card is provided. The heat dissipation structure comprises a first heat conduction portion arranged above a first surface of a wired board of the interface card, a second heat conduction portion arranged above a second surface of the wired board opposite the first surface thereof, and a heat convection portion connecting the first and the second heat conduction portions. Both the first and the second heat conduction portions comprise a plurality of contact leads used to contact the heat-generating electronic components disposed on the two surfaces of the wired board. The heat convection portion has a plurality of first bending strips and a plurality of second bending strips that are alternatively arranged, and a plurality of heat convection slots are formed between the first bending strips and the second bending strips.
摘要翻译：提供了一种配置成与接口卡耦合的散热结构。所述散热结构包括布置在所述接口卡的布线板的第一表面上方的第一导热部分，布置在所述布线板的与其第一表面相对的第二表面上方的第二导热部分，以及连接第一和第二导热部分。第一和第二导热部分都包括用于接触布置在布线板的两个表面上的发热电子部件的多个接触引线。热对流部分具有多个第一弯曲条和多个第二弯曲条，这些第二弯曲条交替布置，并且在第一弯曲条和第二弯曲条之间形成多个热对流槽。

8. 发明申请

US20080187407A1 FASTENING STRUCTURE FOR REDUCING SURFACE TEMPERATURE OF HOUSING 审中-公开
标题翻译：用于减少外壳表面温度的紧固结构
公开(公告)号：US20080187407A1
公开(公告)日：2008-08-07
申请号：US11944454
申请日：2007-11-22
申请人： Chi-Wei Tien , Hsuan-Cheng Wang , Wei-Chung Hsiao , Chih-Yung Kao
发明人： Chi-Wei Tien , Hsuan-Cheng Wang , Wei-Chung Hsiao , Chih-Yung Kao
IPC分类号： F16B39/01
CPC分类号： F16B5/02 , F16B19/02 , G06F1/1613 , G06F1/1656 , G06F1/203 , H05K5/0008 , H05K7/142
摘要： A fastening structure including a first housing, a substrate, a second housing, and a fastening component is provided. The first housing has a first boss with a first opening, and a sidewall of the first opening is made of metal. The substrate has a second opening. The second housing has a second boss with a third opening. One end of the fastening component passes through the third opening and is fastened in the first opening, and the other end of the fastening component is restricted in one end of the third opening to fasten the substrate between the first housing and the second housing. Both the metal sidewall and the sidewall of the fastening component therein do not contact the substrate.
摘要翻译：提供了包括第一壳体，基板，第二壳体和紧固部件的紧固结构。第一壳体具有第一开口的第一凸台，第一开口的侧壁由金属制成。基板具有第二开口。第二个房屋有第二个老板，第三个开放。紧固部件的一端穿过第三开口并被紧固在第一开口中，并且紧固部件的另一端限制在第三开口的一端，以将基板紧固在第一壳体和第二壳体之间。金属侧壁和其中的紧固部件的侧壁均不接触基板。

9. 发明申请

US20070242437A1 Heat dissipating module 有权
标题翻译：散热模块
公开(公告)号：US20070242437A1
公开(公告)日：2007-10-18
申请号：US11705937
申请日：2007-02-13
申请人： Chi-Wei Tien , Chau-Wen Cheng
发明人： Chi-Wei Tien , Chau-Wen Cheng
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating module includes a releasing member, a heat pipe, which has a first end connected to the releasing member and a second end attached to the top surface of a thermal chip on a circuit board, and a fastening member, which has a protruded arch portion that defines an arch chamber that accommodates the second end of the heat pipe, two press portions respectively extended from two opposite lateral sides of the protruded arch portion and pressed on the top surface of the thermal chip, and a plurality of hook portions respectively extended from the press portions and hooked on the bottom edge of the circuit board.
摘要翻译：散热模块包括释放构件，热管，其具有连接到释放构件的第一端和附接到电路板上的热芯片的顶表面的第二端，以及紧固构件，其具有突出的弓形部分，其限定容纳热管的第二端的拱形室，分别从突出的拱形部分的两个相对的横向侧面延伸并压在热芯片的顶表面上的两个按压部分以及多个钩部分从按压部分延伸并钩在电路板的底部边缘上。

10. 发明申请

US20070075663A1 METHOD FOR CONTROLLING FAN 有权
标题翻译：控制风扇的方法
公开(公告)号：US20070075663A1
公开(公告)日：2007-04-05
申请号：US11309306
申请日：2006-07-25
申请人： Chi-Wei Tien
发明人： Chi-Wei Tien
IPC分类号： H02P7/00
CPC分类号： G06F1/206 , H05K7/20209
摘要： A method for controlling a fan is provided for adjusting the rotational speed of a fan. The method includes adjusting the rotational speed of the fan from a first mode value to a range of rotational speed variation, wherein the upper bound of the range of rotational speed variation is a second mode value plus a first variation value, and the lower bound of the range of rotational speed variation is the second mode value minus a second variation value; and adjusting the rotational speed of the fan in the range of rotational speed variation during a time period. Thus, a user will not consider the sound from the fan as a noise.
摘要翻译：提供一种用于控制风扇的方法，用于调节风扇的转速。该方法包括将风扇的转速从第一模式值调整到转速变化的范围，其中转速变化范围的上限是第二模式值加上第一变化值，下限转速变化的范围是第二模式值减去第二变化值; 并且在一段时间内调节风扇在转速变化范围内的转速。因此，用户不会将来自风扇的声音视为噪声。

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