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71. 发明申请

US20050032469A1 Raised island abrasive, lapping apparatus and method of use 有权
标题翻译：凸岛研磨，研磨装置及使用方法
公开(公告)号：US20050032469A1
公开(公告)日：2005-02-10
申请号：US10816275
申请日：2004-08-16
申请人： Wayne Duescher
发明人： Wayne Duescher
IPC分类号： B24D11/00 , C09K3/14 , B24B5/00
CPC分类号： B24D11/001 , C09K3/1436
摘要： Flexible abrasive sheet materials having annular bands of precise height flat-topped raised island structures that are coated with a mono layer of abrasive particles or abrasive agglomerates, processes for manufacture of the abrasive sheet materials, processes for using the abrasive sheeting in high speed lapping/abrading processes, and apparatus for using the abrasive sheeting are described. The process for manufacturing the abrasive sheeting provides an economical method for providing an improved configuration of abrasive sheeting that can provide precisely flat workpiece surfaces that are also highly polished.
摘要翻译：具有精密高度平顶凸起岛结构的环形带的柔性磨料片材，其被涂覆有磨料颗粒或磨料附聚物的单层，用于制造磨料片材的方法，使用高速研磨/ 研磨工艺和使用磨料片的设备进行了描述。用于制造磨料片的方法提供了一种经济的方法，用于提供可提供也被高度抛光的精确平坦的工件表面的研磨片材的改进构型。

72. 发明申请

US20040235406A1 Abrasive agglomerate coated raised island articles 有权
标题翻译：磨料聚集物包覆凸岛制品
公开(公告)号：US20040235406A1
公开(公告)日：2004-11-25
申请号：US10824107
申请日：2004-04-14
发明人： Wayne O. Duescher
IPC分类号： B24B001/00 , B24B007/19 , C09K003/14
CPC分类号： B24D11/001 , C09K3/1436
摘要： Abrasive disk sheet articles having raised islands coated with spherical abrasive agglomerates that can provide both precision flat and smooth workpiece surfaces by high speed lapping are described. These disks also provide high material removal rates and low surface pick-out of soft metallic or non-metallic materials embedded in hard workpieces. A method of producing equal-sized spherical shaped composite abrasive agglomerate beads containing small diamond abrasive particles is described. These beads can be bonded directly on the flat surface of a flexible backing or bonded onto raised island surfaces. Simple and inexpensive apparatus devices and process techniques are described that allow efficient low-volume batch or continuous web manufacturing of precision thickness, large diameter abrasive disk or rectangular sheet abrasive articles
摘要翻译：描述了通过高速研磨能够提供精密平坦和平滑的工件表面的具有球形磨料团聚物的凸起岛的磨料盘片制品。这些磁盘还提供高的材料去除率和低硬度的金属或非金属材料的表面挑选。描述了生产包含小金刚石磨料颗粒的相等尺寸球形复合磨料凝聚珠的方法。这些珠粒可以直接粘合在柔性背衬的平坦表面上或粘合到凸起的岛状表面上。描述了简单和便宜的装置装置和工艺技术，其允许精确厚度，大直径研磨盘或矩形片材磨料制品的有效低容量批量或连续幅材制造

73. 发明申请

US20040154533A1 Apparatuses for forming a planarizing pad for planarization of microlectronic substrates 失效
标题翻译：用于形成用于平坦化微电子衬底的平坦化焊盘的装置
公开(公告)号：US20040154533A1
公开(公告)日：2004-08-12
申请号：US10772541
申请日：2004-02-05
发明人： Vishnu K. Agarwal , Dinesh Chopra
IPC分类号： B05C005/00 , B05B015/12
CPC分类号： B24B37/22 , B24B37/26 , B24D3/28 , B24D11/001 , B24D18/0072
摘要： A planarizing pad for planarizing a microelectronic substrate, and a method and apparatus for forming the planarizing pad. In one embodiment, planarizing pad material is mixed with compressed gas to form a plurality of discrete elements that are distributed on a support material. At least a portion of the discrete elements are spaced apart from each other on the support material to form a textured surface for engaging a microelectronic substrate and removing material from the microelectronic substrate. The discrete elements can be uniformly or randomly distributed on the support material, and the discrete elements can be directly affixed to the support material or affixed to the support material with an adhesive.
摘要翻译：用于平坦化微电子衬底的平坦化焊盘，以及用于形成平坦化焊盘的方法和装置。在一个实施例中，平坦化焊盘材料与压缩气体混合以形成分布在支撑材料上的多个分立元件。离散元件的至少一部分在支撑材料上彼此间隔开以形成纹理化表面，用于接合微电子衬底并从微电子衬底去除材料。离散元件可以均匀地或随机地分布在支撑材料上，并且离散元件可以直接固定到支撑材料上或者用粘合剂固定到支撑材料上。

74. 发明授权

US06733876B1 Flexible abrasive article 失效
标题翻译：柔性磨料制品
公开(公告)号：US06733876B1
公开(公告)日：2004-05-11
申请号：US09420968
申请日：1999-10-20
申请人： Kris A. Beardsley , Rufus C. Sanders, Jr.
发明人： Kris A. Beardsley , Rufus C. Sanders, Jr.
IPC分类号： B32B522
CPC分类号： B24D18/009 , B24D3/002 , B24D3/32 , B24D11/001 , Y10T428/24372 , Y10T428/2438 , Y10T428/24388 , Y10T428/24397 , Y10T428/24405 , Y10T428/24413 , Y10T428/24421 , Y10T428/2443 , Y10T428/249982 , Y10T428/249986
摘要： The present invention provides a flexible abrasive article containing minimal releaseable amounts of physical and chemical contaminants that may be used to clean surfaces. The abrasive article is made of a foraminous substrate, at least one binder and abrasive particles. Methods of making such abrasive articles are also provided.
摘要翻译：本发明提供了一种柔性磨料制品，其含有可用于清洁表面的最小可释放量的物理和化学污染物。研磨制品由多孔基材，至少一种粘合剂和磨料颗粒制成。还提供了制造这种磨料制品的方法。

75. 发明申请

US20040058127A1 Polishing film and method of producing same 审中-公开
公开(公告)号：US20040058127A1
公开(公告)日：2004-03-25
申请号：US10329657
申请日：2002-12-23
申请人： Nihon Microcoating Co., Ltd.
发明人： Toru Yamazaki , Tetsuya Baba , Osamu Murata
IPC分类号： B32B001/00
CPC分类号： B24D11/001 , B05D5/02 , B24B19/226 , B24D3/28 , B32B27/14 , G02B6/3863 , Y10T428/24372 , Y10T428/2993
摘要： A polishing film includes a plastic film and a polishing layer formed on its surface, having a mixture of a first group of silica particles with a first average diameter and a second group of silica particles with a second average diameter fixed in a resin binder, the first average diameter and the second diameter being different from each other and both within a range of 0.001-10 nullm. The mixture of the two groups of silica particles has a granularity distribution curve with two peaks at two different diameter values corresponding to the first and second average diameters.

76. 发明授权

US06663480B2 Polishing pad for semiconductor and optical parts, and method for manufacturing the same 失效
公开(公告)号：US06663480B2
公开(公告)日：2003-12-16
申请号：US09878213
申请日：2001-06-12
申请人： Hae-Do Jeong , Ho-Sik Lee , Ho-Youn Kim , Chul-Woo Nam , Sang-Ick Lee , Jae-Hong Kim
发明人： Hae-Do Jeong , Ho-Sik Lee , Ho-Youn Kim , Chul-Woo Nam , Sang-Ick Lee , Jae-Hong Kim
IPC分类号： B24D1100
CPC分类号： B24B37/22 , B24B37/24 , B24D3/344 , B24D11/001
摘要： The present invention relates to a polishing pad for the chemical mechanical polishing (CMP). According to the present invention, there is provided a chemical mechanical polishing pad for polishing a semiconductor wafer with chemicals containing predetermined components supplied between the semiconductor wafer and the polishing pad, comprising a base layer; and an abrasive layer which contains polishing abrasives capsulated with a material soluble in the chemicals and is formed to have a constant thickness on the top surface of the base layer. The capsulated polishing abrasives become free abrasives in the chemicals supplied upon polishing, and take part in the polishing. Capsulating the polishing abrasives can be performed by granulization or spraying. According to the polishing pad of the present invention, planarization polishing can be performed as whole. In addition, since a small amount of chemicals are used, it is advantageous in the economic and environmental aspects.

77. 发明申请

US20030207659A1 Abrasive product and method of making and using the same 审中-公开
公开(公告)号：US20030207659A1
公开(公告)日：2003-11-06
申请号：US10462253
申请日：2003-06-16
申请人： 3M Innovative Properties Company
发明人： Michael J. Annen , James W. Schutz
IPC分类号： B24D011/00 , B24B001/00
CPC分类号： B24D13/147 , B24D3/26 , B24D3/32 , B24D11/001
摘要： The present invention relates to an abrasive article having a shaped abrasive coating on a shaped backing and to a method of making and using the flexible abrasive article. The flexible abrasive article includes a backing bearing separated, shaped non-abrasive structures having a distal end spaced from the backing which are coated with a shaped abrasive coating. The method comprises providing the backing, applying to one surface of the backing a plurality of separated, shaped non-abrasive structures with distal ends, coating the distal ends with a curable composition containing abrasive particles, imparting a shaped configuration to the uncured coating and curing the coating.

78. 发明授权

US06613113B2 Abrasive product and method of making the same 有权
标题翻译：研磨产品及其制造方法
公开(公告)号：US06613113B2
公开(公告)日：2003-09-02
申请号：US10033390
申请日：2001-12-28
申请人： Chris A. Minick , Michael J. Annen , Eric W. Nelson
发明人： Chris A. Minick , Michael J. Annen , Eric W. Nelson
IPC分类号： B24D300
CPC分类号： B24D3/28 , B24D3/002 , B24D11/001
摘要： The invention provides a flexible abrasive product comprising a flexible sheet-like substrate comprising a multiplicity of separated resilient bodies connected to each other in a generally planar array in a pattern which provides open spaces between adjacent connected bodies, each body having a first surface and an opposite second surface; and abrasive particles to cause at least the first surface to be an abrasive surface. A method of making the abrasive is provided by providing the substrate and providing abrasive particles to at least the first surface to provide an abrasive surface.
摘要翻译：本发明提供了一种柔性磨料产品，其包括柔性片状基材，该柔性片状基材包括多个分离的弹性体，所述多个分离的弹性体以大致平面的阵列相互连接，以相邻连接体之间提供开放空间的图案，每个主体具有第一表面和相对的第二表面; 和磨料颗粒，使至少第一表面成为研磨表面。制造研磨剂的方法是通过提供基底并将研磨颗粒提供给至少第一表面以提供研磨表面来提供的。

79. 发明申请

US20030119432A1 Abrasive belt material for grinding/polishing/cutting tools 审中-公开
标题翻译：用于研磨/抛光/切削工具的研磨带材料
公开(公告)号：US20030119432A1
公开(公告)日：2003-06-26
申请号：US10022401
申请日：2001-12-20
发明人： Fang-Chun Yu
IPC分类号： B24B021/00
CPC分类号： B24D3/06 , B24D11/001 , B24D13/00
摘要： An material having a polyester fabric base layer, at least one metal layer coated on at least one of two opposite sides of the polyester fabric base layer by chemical plating, and at least one outer abrasive layer of diamond powder or cubic boron nitride bonded to the at least one metal layer by electroplating.
摘要翻译：具有聚酯织物基层的材料，通过化学镀涂覆在聚酯织物基层的两个相对侧中的至少一个上的至少一个金属层和至少一个金刚石粉末或立方氮化硼的外磨料层，通过电镀至少一个金属层。

80. 发明申请

US20030079415A1 Binder for abrasive articles, abrasive articles including the same and method of making same 有权
标题翻译：磨料制品的粘合剂，包括其的磨料制品及其制造方法
公开(公告)号：US20030079415A1
公开(公告)日：2003-05-01
申请号：US10242009
申请日：2002-09-12
发明人： Christopher J. Carter , Richard J. Darwood , Roy Stubbs
IPC分类号： B24D003/00 , B24D003/02
CPC分类号： C08G12/12 , B24D3/285 , B24D11/001
摘要： A binder for abrasive products, coated abrasive articles and a method of making the same comprising a urea formaldehyde resin precursor cured in the presence of a sole catalyst which consists essentially of at least one salt of an acid with a diamine of the formula H2NnullRnullNH2 wherein R is an alkylene group of 3 to 10 carbon atoms, and the acid is selected from the group consisting of hydrochloric, citric, nitric, sulphuric, acetic, phosphoric and combinations thereof
摘要翻译：用于研磨产品的粘合剂，涂覆的磨料制品及其制备方法包括在唯一催化剂存在下固化的脲甲醛树脂前体，其主要由至少一种酸与式H2N-R的二胺组成 -NH 2，其中R是3至10个碳原子的亚烷基，酸选自盐酸，柠檬酸，硝酸，硫酸，乙酸，磷酸及其组合

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