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71. 发明授权

US09037280B2 Computer-implemented methods for performing one or more defect-related functions 有权
标题翻译：用于执行一个或多个缺陷相关功能的计算机实现的方法
公开(公告)号：US09037280B2
公开(公告)日：2015-05-19
申请号：US11146342
申请日：2005-06-06
申请人： Mark Dishner , Chris W. Lee , Sharon McCauley , Patrick Huet , David Wang
发明人： Mark Dishner , Chris W. Lee , Sharon McCauley , Patrick Huet , David Wang
IPC分类号： G06F19/00 , G05B23/02
CPC分类号： G05B23/0221
摘要： Computer-implemented methods for performing one or more defect-related functions are provided. One method for identifying noise in inspection data includes identifying events detected in a number of sets of inspection data that is less than a predetermined number as noise. One method for binning defects includes binning the defects into groups based on defect characteristics and the sets of the inspection data in which the defects were detected. One method for selecting defects for defect analysis includes binning defects into group(s) based on proximity of the defects to each other and spatial signatures formed by the group(s). A different method for selecting defects for defect analysis includes selecting defects having the greatest diversity of defect characteristic(s) for defect analysis. One method includes classifying defects on a specimen using inspection data generated for the specimen combined with defect review data generated for the specimen.
摘要翻译：提供了用于执行一个或多个缺陷相关功能的计算机实现的方法。用于识别检查数据中的噪声的一种方法包括将小于预定数目的多组检查数据中检测到的事件识别为噪声。分类缺陷的一种方法包括基于缺陷特征和检测缺陷检查数据的集合将缺陷合并成组。用于选择缺陷分析的缺陷的一种方法包括基于缺陷彼此的接近度和由组形成的空间特征将缺陷合并成组。用于选择缺陷分析缺陷的不同方法包括选择具有最大差异缺陷特征的缺陷以进行缺陷分析。一种方法包括使用生成的样本的检查数据与样本产生的缺陷评估数据相结合来对样本进行分类。

72. 发明授权

US08422010B2 Methods and systems for determining a characteristic of a wafer 有权
标题翻译：用于确定晶片特性的方法和系统
公开(公告)号：US08422010B2
公开(公告)日：2013-04-16
申请号：US13610860
申请日：2012-09-12
申请人： Michael D. Kirk , Christopher F. Bevis , David Adler , Kris Bhaskar
发明人： Michael D. Kirk , Christopher F. Bevis , David Adler , Kris Bhaskar
IPC分类号： G01N21/00
CPC分类号： G01N21/9501 , G01N21/4738 , G01N21/55
摘要： Methods and systems for determining a characteristic of a wafer are provided. One method includes generating output responsive to light from the wafer using an inspection system. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The method also includes determining the characteristic of the wafer using the second output. One system includes an inspection subsystem configured to illuminate the wafer and to generate output responsive to light from the wafer. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The system also includes a processor configured to determine the characteristic of the wafer using the second output.
摘要翻译：提供了用于确定晶片特性的方法和系统。一种方法包括使用检查系统响应来自晶片的光产生输出。输出包括对应于晶片上的缺陷的第一输出和不对应于缺陷的第二输出。该方法还包括使用第二输出确定晶片的特性。一个系统包括检查子系统，该检查子系统配置成照亮晶片并产生响应于来自晶片的光的输出。输出包括对应于晶片上的缺陷的第一输出和不对应于缺陷的第二输出。该系统还包括配置成使用第二输出来确定晶片的特性的处理器。

73. 发明授权

US08213705B2 Methods for accurate identification of an edge of a care area for an array area formed on a wafer and methods for binning defects detected in an array area formed on a wafer 有权
标题翻译：用于精确识别形成在晶片上的阵列区域的护理区域的边缘的方法以及在形成在晶片上的阵列区域中检测到的合并缺陷的方法
公开(公告)号：US08213705B2
公开(公告)日：2012-07-03
申请号：US13032577
申请日：2011-02-22
申请人： Chien-Huei (Adam) Chen , Xiaoming Wang , Eugene Shifrin , Tsung-Pao Fang
发明人： Chien-Huei (Adam) Chen , Xiaoming Wang , Eugene Shifrin , Tsung-Pao Fang
IPC分类号： G06K9/62
CPC分类号： G06T7/001 , G06T7/11 , G06T7/187 , G06T2207/10056 , G06T2207/30148
摘要： Methods for identifying an edge of a care area for an array area formed on a wafer and/or for binning defects detected in the array area are provided. One method for identifying an edge of a care area for an array area formed on a wafer includes determining a value for a difference image as a function of position from a position known to be inside the array area to a position known to be outside of the array area. The method also includes identifying the position that is located closest to the inside of the array area and that has the value greater than a threshold as a position of the edge of the care area.
摘要翻译：提供了用于识别在晶片上形成的阵列区域的护理区域的边缘和/或用于合并在阵列区域中检测到的缺陷的方法。用于识别形成在晶片上的阵列区域的护理区域的边缘的一种方法包括从已知在阵列区域内的位置到已知在阵列区域外的位置确定作为位置的函数的差异图像的值阵列区域。该方法还包括识别位于最靠近阵列区域内部并且具有大于阈值的值作为护理区域的边缘的位置的位置。

74. 发明授权

US08179530B2 Methods and systems for determining a critical dimension and overlay of a specimen 有权
标题翻译：用于确定试样的临界尺寸和覆盖层的方法和系统
公开(公告)号：US08179530B2
公开(公告)日：2012-05-15
申请号：US12830408
申请日：2010-07-05
申请人： Ady Levy , Kyle A. Brown , Rodney Smedt , Gary Bultman , Mehrdad Nikoonahad , Dan Wack , John Fielden , Ibrahim Abdul-Halim
发明人： Ady Levy , Kyle A. Brown , Rodney Smedt , Gary Bultman , Mehrdad Nikoonahad , Dan Wack , John Fielden , Ibrahim Abdul-Halim
IPC分类号： G01B11/00 , G01B11/30 , G01B11/14 , G01B11/28
CPC分类号： G01N21/27 , G01N21/211 , G01N21/47 , G01N21/636 , G01N21/64 , G01N21/9501 , G01N21/956 , G01N2021/646 , G01N2021/8825 , G03F7/70616 , G03F7/70625 , G03F7/70633 , G03F7/7065 , G03F7/70658 , G03F7/707 , G03F7/70708 , H01J2237/31701 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including: but not limited to, critical dimension and overlay misregistration; defects and thin film characteristics; critical dimension and defects; critical dimension and thin film characteristics; critical dimension, thin film characteristics and defects; macro defects and micro defects; flatness, thin film characteristics and defects; overlay misregistration and flatness; an implant characteristic and defects; and adhesion and thickness. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.
摘要翻译：提供了用于监测半导体制造工艺的方法和系统。系统可以包括被配置为支撑样本并耦合到测量装置的台。测量装置可以包括照明系统和检测系统。照明系统和检测系统可以被配置为使得系统可以被配置为确定样本的多个属性。例如，系统可以被配置为确定样本的多个属性，包括但不限于临界尺寸和重叠错位; 缺陷和薄膜特性; 临界尺寸和缺陷; 临界尺寸和薄膜特性; 临界尺寸，薄膜特性和缺陷; 宏观缺陷和微缺陷; 平整度，薄膜特性和缺陷; 重叠错位和平整度; 植入物特征和缺陷; 附着力和厚度。以这种方式，测量装置可以执行多个光学和/或非光学测量和/或检查技术。

75. 发明授权

US08151220B2 Methods for simulating reticle layout data, inspecting reticle layout data, and generating a process for inspecting reticle layout data 有权
标题翻译：用于模拟标线布局数据，检查标线布局数据以及生成检查标线布局数据的过程的方法
公开(公告)号：US08151220B2
公开(公告)日：2012-04-03
申请号：US11003291
申请日：2004-12-03
申请人： Carl Hess , Yalin Xiong
发明人： Carl Hess , Yalin Xiong
IPC分类号： G06F17/50 , G06F11/22
CPC分类号： G03F1/84 , G03F1/36
摘要： Various computer-implemented methods are provided. One method for generating a process for inspecting reticle layout data includes identifying a first region in the reticle layout data. A printability of the first region is more sensitive to changes in process parameters than a printability of a second region in the reticle layout data. The method also includes assigning one or more inspection parameters to the first region and the second region such that the first region will be inspected during the process with a higher sensitivity than the second region. Another method includes inspecting the first region with a higher sensitivity than the second region. An additional method includes simulating how the reticle layout data will print. Simulation of the first and second regions is performed with one or more different simulation parameters such that the first region is simulated with a higher fidelity than the second region.
摘要翻译：提供了各种计算机实现的方法。用于生成用于检查标线布局数据的处理的一种方法包括识别标线布局数据中的第一区域。第一区域的可印刷性对于工艺参数的改变比在标线布局数据中的第二区域的可印刷性更敏感。该方法还包括将一个或多个检查参数分配给第一区域和第二区域，使得在处理期间将以比第二区域更高的灵敏度对第一区域进行检查。另一种方法包括以比第二区域更高的灵敏度检查第一区域。另外一种方法包括模拟标线布局数据如何打印。利用一个或多个不同的模拟参数来执行第一和第二区域的模拟，使得以比第二区域更高的保真度来模拟第一区域。

76. 发明授权

US08148900B1 Methods and systems for providing illumination of a specimen for inspection 有权
标题翻译：用于提供样品照明的方法和系统用于检查
公开(公告)号：US08148900B1
公开(公告)日：2012-04-03
申请号：US11623981
申请日：2007-01-17
申请人： Greg Kirk , Rich Solarz
发明人： Greg Kirk , Rich Solarz
IPC分类号： H01J65/00
CPC分类号： H01J65/046 , G01N21/8806 , G01N21/9501
摘要： Methods and systems for providing illumination of a specimen for inspection are provided. One embodiment relates to a system configured to provide illumination of a specimen for inspection. The system includes an electrodeless lamp configured to generate light. The system is further configured such that the light illuminates the specimen during the inspection. Another embodiment relates to a system configured to inspect a specimen. The system includes an electrodeless lamp configured to generate light and one or more optical elements configured to direct the light to the specimen. The system also includes a detection subsystem configured to generate output responsive to light from the specimen. The output can be used to detect defects on the specimen. An additional embodiment relates to a method for providing illumination of a specimen for inspection. The method includes illuminating the specimen during the inspection with light generated by an electrodeless lamp.
摘要翻译：提供了用于提供用于检查的样本的照明的方法和系统。一个实施例涉及一种被配置为提供用于检查的样本的照明的系统。该系统包括配置成产生光的无电极灯。该系统进一步配置成使得在检查期间光照射样品。另一实施例涉及一种被配置为检查样本的系统。该系统包括被配置为产生光的无电极灯和被配置为将光引导到样本的一个或多个光学元件。该系统还包括检测子系统，被配置为产生响应于来自样本的光的输出。输出可用于检测样品上的缺陷。另外的实施例涉及一种用于提供用于检查的样本的照明的方法。该方法包括在检查期间用无电极灯产生的光照射样品。

77. 发明授权

US08102408B2 Computer-implemented methods and systems for determining different process windows for a wafer printing process for different reticle designs 有权
标题翻译：用于确定用于不同掩模版设计的晶片印刷工艺的不同工艺窗口的计算机实现的方法和系统
公开(公告)号：US08102408B2
公开(公告)日：2012-01-24
申请号：US11770437
申请日：2007-06-28
申请人： Gaurav Verma , Bo Su , William Volk , Harold Lehon , Carl Hess
发明人： Gaurav Verma , Bo Su , William Volk , Harold Lehon , Carl Hess
IPC分类号： H04N7/18
CPC分类号： G03F1/84
摘要： Computer-implemented methods and systems for determining different process windows for a wafer printing process for different reticle designs are provided. One method includes generating simulated images illustrating how each of the different reticle designs will be printed on a wafer at different values of one or more parameters of the wafer printing process. The method also includes detecting defects in each of the different reticle designs using the simulated images. In addition, the method includes determining a process window for the wafer printing process for each of the different reticle designs based on results of the detecting step.
摘要翻译：提供了用于确定用于不同掩模版设计的晶片印刷工艺的不同工艺窗口的计算机实现的方法和系统。一种方法包括产生模拟图像，其示出了在晶片印刷过程的一个或多个参数的不同值下每个不同的标线设计将如何印刷在晶片上。该方法还包括使用模拟图像检测每个不同标线设计中的缺陷。此外，该方法包括基于检测步骤的结果确定用于每个不同掩模版设计的晶片印刷处理的处理窗口。

78. 发明申请

US20110172982A1 SITE BASED QUANTIFICATION OF SUBSTRATE TOPOGRAPHY AND ITS RELATION TO LITHOGRAPHY DEFOCUS AND OVERLAY 有权
标题翻译：基于位置的基底地质定量及其与断层和覆盖的关系
公开(公告)号：US20110172982A1
公开(公告)日：2011-07-14
申请号：US12778013
申请日：2010-05-11
申请人： Sathish Veeraraghavan , Jaydeep Sinha
发明人： Sathish Veeraraghavan , Jaydeep Sinha
IPC分类号： G06F17/50
CPC分类号： G06F17/5009 , G01B11/24 , G01N21/9501 , G03F7/705 , G03F7/70633 , G03F7/70641 , G03F7/7065 , G03F7/70783 , G06F17/5018 , H01L22/12
摘要： A method and system for modeling and analyzing wafer nanotopography data utilizes a nonlinear contact finite element model. Inputs to the model include lithography chuck parameters and site-based geometry data. Outputs from the model include in-plane distortions and out-of-plane distortions, from which defocus and overlay can be derived.
摘要翻译：用于建模和分析晶片纳米成像数据的方法和系统利用非线性接触有限元模型。该模型的输入包括光刻卡盘参数和基于位置的几何数据。模型的输出包括平面内失真和平面外失真，从中可以得出散焦和叠加。

79. 发明授权

US07925486B2 Computer-implemented methods, carrier media, and systems for creating a metrology target structure design for a reticle layout 有权
标题翻译：计算机实现的方法，载体介质和用于创建光罩布局的计量目标结构设计的系统
公开(公告)号：US07925486B2
公开(公告)日：2011-04-12
申请号：US11685501
申请日：2007-03-13
申请人： Mark Smith , Robert Hardister , Mike Pochkowski , Amir Widmann , Elyakim Kassel , Mike Adel
发明人： Mark Smith , Robert Hardister , Mike Pochkowski , Amir Widmann , Elyakim Kassel , Mike Adel
IPC分类号： G06F17/50 , G02B23/10
CPC分类号： G06F17/5009 , G03F1/44
摘要： Computer-implemented methods, carrier media, and systems for creating a metrology target structure design for a reticle layout are provided. One computer-implemented method for creating a metrology target structure design for a reticle layout includes simulating how one or more initial metrology target structures will be formed on a wafer based on one or more fabrication processes that will be used to form a metrology target structure on the wafer and one or more initial metrology target structure designs. The method also includes creating the metrology target structure design based on results of the simulating step.
摘要翻译：提供了计算机实现的方法，载体介质和用于创建标线布局的计量目标结构设计的系统。用于创建标线布局的计量目标结构设计的一种计算机实现的方法包括模拟如何在晶片上形成一个或多个初始计量目标结构，所述一个或多个初始计量目标结构将基于将用于形成计量目标结构的一个或多个制造过程晶圆和一个或多个初始计量目标结构设计。该方法还包括基于模拟步骤的结果创建计量目标结构设计。

80. 发明授权

US07869020B1 Fourier filters, inspection systems, and systems for fabricating fourier filters 有权
标题翻译：傅立叶滤波器，检查系统和用于制造傅立叶滤波器的系统
公开(公告)号：US07869020B1
公开(公告)日：2011-01-11
申请号：US11683554
申请日：2007-03-08
申请人： Shing Lee
发明人： Shing Lee
IPC分类号： G01N21/00
CPC分类号： G01N21/95623 , G01N2021/8822 , G01N2021/95676
摘要： Fourier filters, inspection systems, and systems for fabricating Fourier filters are provided. One Fourier filter configured for use in an inspection system includes a substrate that is substantially transparent to light from a specimen illuminated by the inspection system. The Fourier filter also includes an array of patterned features formed on the substrate. The patterned features are formed of one or more pigments on the substrate. The patterned features are configured to block light reflected and diffracted from structures on the specimen and to allow light scattered from defects on the specimen to pass through the substrate.
摘要翻译：提供傅立叶滤波器，检查系统和用于制造傅立叶滤波器的系统。配置用于检查系统的一个傅立叶滤波器包括对来自检查系统照射的样本的光基本透明的基板。傅立叶滤波器还包括形成在基板上的图案特征的阵列。图案化特征由基底上的一种或多种颜料形成。图案化特征被配置为阻挡从样品上的结构反射和衍射的光，并允许从样品上的缺陷散射的光穿过基底。

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