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1. 发明授权

US08284394B2 Methods and systems for determining a characteristic of a wafer 有权
标题翻译：用于确定晶片特性的方法和系统
公开(公告)号：US08284394B2
公开(公告)日：2012-10-09
申请号：US11673150
申请日：2007-02-09
申请人： Michael D. Kirk , Christopher F. Bevis , David Adler , Kris Bhaskar
发明人： Michael D. Kirk , Christopher F. Bevis , David Adler , Kris Bhaskar
IPC分类号： G01N21/00
CPC分类号： G01N21/9501 , G01N21/4738 , G01N21/55
摘要： Methods and systems for determining a characteristic of a wafer are provided. One method includes generating output responsive to light from the wafer using an inspection system. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The method also includes determining the characteristic of the wafer using the second output. One system includes an inspection subsystem configured to illuminate the wafer and to generate output responsive to light from the wafer. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The system also includes a processor configured to determine the characteristic of the wafer using the second output.
摘要翻译：提供了用于确定晶片特性的方法和系统。一种方法包括使用检查系统响应来自晶片的光产生输出。输出包括对应于晶片上的缺陷的第一输出和不对应于缺陷的第二输出。该方法还包括使用第二输出确定晶片的特性。一个系统包括检查子系统，该检查子系统配置成照亮晶片并产生响应于来自晶片的光的输出。输出包括对应于晶片上的缺陷的第一输出和不对应于缺陷的第二输出。该系统还包括配置成使用第二输出来确定晶片的特性的处理器。

2. 发明授权

US08422010B2 Methods and systems for determining a characteristic of a wafer 有权
标题翻译：用于确定晶片特性的方法和系统
公开(公告)号：US08422010B2
公开(公告)日：2013-04-16
申请号：US13610860
申请日：2012-09-12
申请人： Michael D. Kirk , Christopher F. Bevis , David Adler , Kris Bhaskar
发明人： Michael D. Kirk , Christopher F. Bevis , David Adler , Kris Bhaskar
IPC分类号： G01N21/00
CPC分类号： G01N21/9501 , G01N21/4738 , G01N21/55
摘要： Methods and systems for determining a characteristic of a wafer are provided. One method includes generating output responsive to light from the wafer using an inspection system. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The method also includes determining the characteristic of the wafer using the second output. One system includes an inspection subsystem configured to illuminate the wafer and to generate output responsive to light from the wafer. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The system also includes a processor configured to determine the characteristic of the wafer using the second output.
摘要翻译：提供了用于确定晶片特性的方法和系统。一种方法包括使用检查系统响应来自晶片的光产生输出。输出包括对应于晶片上的缺陷的第一输出和不对应于缺陷的第二输出。该方法还包括使用第二输出确定晶片的特性。一个系统包括检查子系统，该检查子系统配置成照亮晶片并产生响应于来自晶片的光的输出。输出包括对应于晶片上的缺陷的第一输出和不对应于缺陷的第二输出。该系统还包括配置成使用第二输出来确定晶片的特性的处理器。

3. 发明申请

US20130035877A1 Methods and Systems for Determining a Characteristic of a Wafer 有权
标题翻译：确定晶圆特性的方法和系统
公开(公告)号：US20130035877A1
公开(公告)日：2013-02-07
申请号：US13610860
申请日：2012-09-12
申请人： Michael D. Kirk , Christopher F. Bevis , David Adler , Kris Bhaskar
发明人： Michael D. Kirk , Christopher F. Bevis , David Adler , Kris Bhaskar
IPC分类号： G01N21/88 , G06F19/00
CPC分类号： G01N21/9501 , G01N21/4738 , G01N21/55
摘要： Methods and systems for determining a characteristic of a wafer are provided. One method includes generating output responsive to light from the wafer using an inspection system. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The method also includes determining the characteristic of the wafer using the second output. One system includes an inspection subsystem configured to illuminate the wafer and to generate output responsive to light from the wafer. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The system also includes a processor configured to determine the characteristic of the wafer using the second output.
摘要翻译：提供了用于确定晶片特性的方法和系统。一种方法包括使用检查系统响应来自晶片的光产生输出。输出包括对应于晶片上的缺陷的第一输出和不对应于缺陷的第二输出。该方法还包括使用第二输出确定晶片的特性。一个系统包括检查子系统，该检查子系统配置成照亮晶片并产生响应于来自晶片的光的输出。输出包括对应于晶片上的缺陷的第一输出和不对应于缺陷的第二输出。该系统还包括配置成使用第二输出来确定晶片的特性的处理器。

4. 发明申请

US20100235114A1 SYSTEMS AND METHODS FOR DETERMINING ONE OR MORE CHARACTERISTICS OF A SPECIMEN USING RADIATION IN THE TERAHERTZ RANGE 审中-公开
标题翻译：用于确定在TERAHERTZ范围内使用辐射的样本的一个或多个特征的系统和方法
公开(公告)号：US20100235114A1
公开(公告)日：2010-09-16
申请号：US12401029
申请日：2009-03-10
申请人： Ady Levy , Samuel Ngai , Christopher F. Bevis , Stefano Concina , John Fielden , Walter Mieher , Dieter Mueller , Neil Richardson , Dan Wack , Larry Wagner
发明人： Ady Levy , Samuel Ngai , Christopher F. Bevis , Stefano Concina , John Fielden , Walter Mieher , Dieter Mueller , Neil Richardson , Dan Wack , Larry Wagner
IPC分类号： G06F19/00 , G01N21/47 , G01N21/59 , G01N21/55
CPC分类号： G01N21/9505 , G01N21/3581 , H01L22/12
摘要： Systems and methods for determining one or more characteristics of a specimen using radiation in the terahertz range are provided. One system includes an illumination subsystem configured to illuminate the specimen with radiation. The system also includes a detection subsystem configured to detect radiation propagating from the specimen in response to illumination of the specimen and to generate output responsive to the detected radiation. The detected radiation includes radiation in the terahertz range. In addition, the system includes a processor configured to determine the one or more characteristics of the specimen using the output.
摘要翻译：提供了使用太赫兹范围内的辐射来确定样本的一个或多个特征的系统和方法。一个系统包括被配置为用辐射照射样本的照明子系统。该系统还包括检测子系统，该检测子系统被配置为响应于样本的照射来检测从样本传播的辐射，并响应于检测到的辐射产生输出。检测到的辐射包括太赫兹范围内的辐射。另外，该系统包括配置成使用该输出来确定样本的一个或多个特性的处理器。

5. 发明授权

US07505619B2 System and method for conducting adaptive fourier filtering to detect defects in dense logic areas of an inspection surface 有权
标题翻译：用于进行自适应傅立叶滤波以检测检查表面的密集逻辑区域中的缺陷的系统和方法
公开(公告)号：US07505619B2
公开(公告)日：2009-03-17
申请号：US11314779
申请日：2005-12-20
申请人： Evan R. Mapoles , Grace H. Chen , Christopher F. Bevis , David W. Shortt
发明人： Evan R. Mapoles , Grace H. Chen , Christopher F. Bevis , David W. Shortt
IPC分类号： G06K9/00
CPC分类号： G01N21/95607 , G01N21/47 , G01N21/95623 , G01N2021/8822
摘要： A dark field surface inspection tool and system are disclosed herein. The tool includes an illumination source capable of scanning a light beam onto an inspection surface. Light scattered by each inspection point is captured as image data by a photo detector array arranged at a fourier plane. The images captured are adaptively filtered to remove a portion of the bright pixels from the images to generate filtered images. The filtered images are then analyzed to detect defects in the inspection surface. Methods of the invention include using die-to-die comparison to identify bright portions of scattering patterns and generate unique image filters associated with those patterns. The associated images are then filtered to generate filtered images which are then used to detect defects. Also, data models of light scattering behavior can be used to generate filters.
摘要翻译：本文公开了一种暗场表面检查工具和系统。该工具包括能够将光束扫描到检查表面上的照明源。由每个检查点散射的光通过布置在傅立叶平面上的光检测器阵列捕获为图像数据。捕获的图像被自适应地滤波以从图像中去除一部分亮像素以产生滤波图像。然后分析滤波图像以检测检查表面中的缺陷。本发明的方法包括使用管芯到管芯的比较来识别散射图案的亮部分并且生成与这些图案相关联的独特的图像滤波器。然后将相关联的图像过滤以产生滤波图像，然后将其用于检测缺陷。此外，可以使用光散射行为的数据模型来生成滤波器。

6. 发明申请

US20080207089A1 METHODS AND SYSTEMS FOR MONITORING A PARAMETER OF A MEASUREMENT DEVICE DURING POLISHING, DAMAGE TO A SPECIMEN DURING POLISHING, OR A CHARACTERISTIC OF A POLISHING PAD OR TOOL 有权
标题翻译：用于在抛光期间监测测量装置的参数的方法和系统，在抛光期间对样品的损害，或抛光抛光或工具的特性
公开(公告)号：US20080207089A1
公开(公告)日：2008-08-28
申请号：US12032112
申请日：2008-02-15
申请人： Kurt Lehman , Charles Chen , Ronald L. Allen , Robert Shinagawa , Anantha Sethuraman , Christopher F. Bevis , Thanassis Trikas , Haiguang Chen , Ching Ling Meng
发明人： Kurt Lehman , Charles Chen , Ronald L. Allen , Robert Shinagawa , Anantha Sethuraman , Christopher F. Bevis , Thanassis Trikas , Haiguang Chen , Ching Ling Meng
IPC分类号： B24B49/12
CPC分类号： B24B37/013 , B24B37/042 , B24B41/04 , B24B49/04 , B24B49/10 , B24B49/12
摘要： Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, a characteristic of a polishing pad, or a characteristic of a polishing tool are provided. One method includes scanning a specimen with a measurement device during polishing of a specimen to generate output signals at measurement spots on the specimen. The method also includes determining if the output signals are outside of a range of output signals. Output signals outside of the range may indicate that a parameter of the measurement device is out of control limits. In a different embodiment, output signals outside of the range may indicate damage to the specimen. Another method includes scanning a polishing pad with a measurement device to generate output signals at measurement spots on the polishing pad. The method also includes determining a characteristic of the polishing pad from the output signals.
摘要翻译：提供了用于在抛光期间监测测量装置的参数的方法和系统，在抛光期间对样本的损坏，抛光垫的特性或抛光工具的特性。一种方法包括在样品抛光期间用测量装置扫描样品，以在样品上的测量点产生输出信号。该方法还包括确定输出信号是否在输出信号的范围之外。超出范围的输出信号可能表示测量设备的参数失控。在不同的实施例中，在该范围之外的输出信号可以指示对样本的损伤。另一种方法包括用测量装置扫描抛光垫以在抛光垫上的测量点产生输出信号。该方法还包括从输出信号确定抛光垫的特性。

7. 发明授权

US07385699B2 Apparatus and methods for detecting overlay errors using scatterometry 有权
公开(公告)号：US07385699B2
公开(公告)日：2008-06-10
申请号：US10785396
申请日：2004-02-23
申请人： Walter D. Mieher , Ady Levy , Boris Golovanesky , Michael Friedmann , Ian Smith , Michael E. Adel , Anatoly Fabrikant , Christopher F. Bevis , Mark Ghinovker
发明人： Walter D. Mieher , Ady Levy , Boris Golovanesky , Michael Friedmann , Ian Smith , Michael E. Adel , Anatoly Fabrikant , Christopher F. Bevis , Mark Ghinovker
IPC分类号： G01B11/00
CPC分类号： G03F9/7088 , G01N21/956 , G01N2021/213 , G03F7/70625 , G03F7/70633 , G03F7/70683 , G03F9/7049 , G03F9/7084
摘要： Disclosed is a method for determining an overlay error between at least two layers in a multiple layer sample. An imaging optical system is used to measure a plurality of measured optical signals from a plurality of periodic targets on the sample. The targets each have a first structure in a first layer and a second structure in a second layer. There are predefined offsets between the first and second structures. A scatterometry overlay technique is then used to analyze the measured optical signals of the periodic targets and the predefined offsets of the first and second structures of the periodic targets to thereby determine an overlay error between the first and second structures of the periodic targets.

8. 发明授权

US07317531B2 Apparatus and methods for detecting overlay errors using scatterometry 有权
标题翻译：使用散射法检测重叠误差的装置和方法
公开(公告)号：US07317531B2
公开(公告)日：2008-01-08
申请号：US10729838
申请日：2003-12-05
申请人： Walter D. Mieher , Ady Levy , Boris Golovanesky , Michael Friedmann , Ian Smith , Michael Adel , Anatoly Fabrikant , Christopher F. Bevis , John Fielden , Noah Bareket , Kenneth P. Gross , Piotr Zalicki , Dan Wack , Paola Dececco , Thaddeus G. Dziura , Mark Ghinovker
发明人： Walter D. Mieher , Ady Levy , Boris Golovanesky , Michael Friedmann , Ian Smith , Michael Adel , Anatoly Fabrikant , Christopher F. Bevis , John Fielden , Noah Bareket , Kenneth P. Gross , Piotr Zalicki , Dan Wack , Paola Dececco , Thaddeus G. Dziura , Mark Ghinovker
IPC分类号： G01B11/00 , G01J4/00 , G01N21/00
CPC分类号： G03F9/7088 , G01N21/956 , G01N2021/213 , G03F7/70625 , G03F7/70633 , G03F7/70683 , G03F9/7049 , G03F9/7084
摘要： Disclosed are techniques, apparatus, and targets for determining overlay error between two layers of a sample. In one embodiment, a method for determining overlay between a plurality of first structures in a first layer of a sample and a plurality of second structures in a second layer of the sample is disclosed. Targets A, B, C and D that each include a portion of the first and second structures are provided. Target A is designed to have an offset Xa between its first and second structures portions; target B is designed to have an offset Xb between its first and second structures portions; target C is designed to have an offset Xc between its first and second structures portions; and target D is designed to have an offset Xd between its first and second structures portions. Each of the offsets Xa, Xb, Xc and Xd is preferably different from zero; Xa is an opposite sign and differ from Xb; and Xc is an opposite sign and differs from Xd. The targets A, B, C and D are illuminated with electromagnetic radiation to obtain spectra SA, SB, SC, and SD from targets A, B, C, and D, respectively. Any overlay error between the first structures and the second structures is then determined using a linear approximation based on the obtained spectra SA, SB, SC, and SD.
摘要翻译：公开了用于确定样品的两层之间的重叠误差的技术，装置和目标。在一个实施例中，公开了一种用于确定样品的第一层中的多个第一结构与样品的第二层中的多个第二结构之间的叠层的方法。提供了各自包括第一和第二结构的一部分的目标A，B，C和D。目标A设计成在其第一和第二结构部分之间具有偏移Xa; 目标B设计成在其第一和第二结构部分之间具有偏移Xb; 目标C被设计成在其第一和第二结构部分之间具有偏移Xc; 并且目标D被设计成在其第一和第二结构部分之间具有偏移Xd。偏移量Xa，Xb，Xc和Xd中的每一个优选地不同于零; Xa是相反的符号，不同于Xb; Xc是相反的符号，与Xd不同。目标A，B，C和D用电磁辐射照射，以获得光谱S A，B，C，S和S，分别来自目标A，B，C和D的SUB> D

9. 发明授权

US07242477B2 Apparatus and methods for detecting overlay errors using scatterometry 有权
标题翻译：使用散射法检测重叠误差的装置和方法
公开(公告)号：US07242477B2
公开(公告)日：2007-07-10
申请号：US10785430
申请日：2004-02-23
申请人： Walter D. Mieher , Ady Levy , Boris Golovanesky , Michael Friedmann , Ian Smith , Michael E. Adel , Mark Ghinovker , Christopher F. Bevis , Noam Knoll , Moshe Baruch
发明人： Walter D. Mieher , Ady Levy , Boris Golovanesky , Michael Friedmann , Ian Smith , Michael E. Adel , Mark Ghinovker , Christopher F. Bevis , Noam Knoll , Moshe Baruch
IPC分类号： G01B11/00
CPC分类号： G03F9/7088 , G01N21/956 , G01N2021/213 , G03F7/70625 , G03F7/70633 , G03F7/70683 , G03F9/7049 , G03F9/7084
摘要： Disclosed is a method for determining an overlay error between at least two layers in a multiple layer sample. A sample having a plurality of periodic targets that each have a first structure in a first layer and a second structure in a second layer is provided. There are predefined offsets between the first and second structures. Using a scatterometry overlay metrology, scatterometry overlay data is obtained from a first set of the periodic targets based on one or more measured optical signals from the first target set on the sample. Using an imaging overlay metrology, imaging overlay data is obtained from a second set of the periodic targets based on one or more image(s) from the second target set on the sample.
摘要翻译：公开了一种用于确定多层样品中至少两层之间的覆盖误差的方法。提供具有多个周期性靶的样品，每个周期性靶在第一层中具有第一结构，在第二层中具有第二结构。在第一和第二结构之间有预定义的偏移。使用散射测绘重叠测量，基于来自样品上的第一目标组的一个或多个测量光信号，从第一组周期性目标获得散点测绘覆盖数据。使用成像覆盖度量，基于来自样品上的第二目标集的一个或多个图像，从第二组周期性目标获得成像覆盖数据。

10. 发明授权

US07175503B2 Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device 有权
标题翻译：用于从涡流装置的组合输出信号确定样品上的区域内的抛光特性的方法和系统
公开(公告)号：US07175503B2
公开(公告)日：2007-02-13
申请号：US10358069
申请日：2003-02-04
申请人： Kurt Lehman , Charles Chen , Ronald L. Allen , Robert Shinagawa , Anantha Sethuraman , Christopher F. Bevis , Thanassis Trikas , Haiguang Chen , Ching Ling Meng
发明人： Kurt Lehman , Charles Chen , Ronald L. Allen , Robert Shinagawa , Anantha Sethuraman , Christopher F. Bevis , Thanassis Trikas , Haiguang Chen , Ching Ling Meng
IPC分类号： B24B49/00 , B24B51/00
CPC分类号： B24B37/013 , B24B37/042 , B24B41/04 , B24B49/04 , B24B49/10 , B24B49/12
摘要： Systems and methods for characterizing polishing of a specimen are provided. One method includes scanning a specimen with an eddy current device during polishing to generate output signals at measurement spots across the specimen. The method also includes combining a portion of the output signals generated at the measurement spots located within a zone on the specimen. In addition, the method includes determining a characteristic of polishing within the zone from the combined portion of the output signals. In some instances, a zone may include a predetermined range of radial and azimuthal positions on the specimen. In one embodiment, the method may include determining a characteristic of polishing within more than one zone on the specimen. Some embodiments may include determining an additional characteristic of polishing from the characteristic of polishing within more than one zone on the specimen.
摘要翻译：提供了用于表征样品抛光的系统和方法。一种方法包括在抛光过程中用涡流装置扫描样品，以在样品上的测量点产生输出信号。该方法还包括组合在位于样品上的区域内的测量点处产生的输出信号的一部分。此外，该方法包括从输出信号的组合部分确定该区域内的抛光特性。在一些情况下，区域可以包括样品上的径向和方位位置的预定范围。在一个实施例中，该方法可以包括确定在样本上的多于一个区域内的抛光的特性。一些实施例可以包括从样品上的多于一个区域内的抛光特性确定抛光的附加特性。

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